Assignee
PAC TECH PACKAGING TECH GMBH
DE·20 granted patents·21 pending applications·11 citations·filing 2014–2025
Top patents by PatentIndex Score
41 records- 0187US12028987B2Method for soldering an electronic component to a circuit board by jetting liquefied solder into a through holePAC TECH—PACKAGING TECH GMBH·Filed 2022·Granted Jul 2, 2024·1 cites·12 claims
- 0284US10286470B2Device for the separate application of connecting material depositsPAC TECH—PACKAGING TECH GMBH·Filed 2014·Granted May 14, 2019·5 cites·7 claims
- 0381US12349287B2Method for soldering an electronic component to a circuit board by jetting liquefied solder into a through holePAC TECH—PACKAGING TECH GMBH·Filed 2024·Granted Jul 1, 2025·0 cites·20 claims
- 0470US11367709B2Semiconductor chip stack arrangement and semiconductor chip for producing such a semiconductor chip stack arrangementPAC TECH—PACKAGING TECH GMBH·Filed 2018·Granted Jun 21, 2022·2 cites·16 claims
- 0569US2026034598A1Method of Forming Solder Contact PinsPAC TECH PACKAGING TECH GMBH·Filed 2024·Application pending·0 cites
- 0669US2025367743A1Bonding Head and Bonding ApparatusPAC TECH PACKAGING TECH GMBH·Filed 2025·Application pending·0 cites
- 0767US2025196244A1Method and laser arrangement for electrically contacting terminal faces of two substratesPAC TECH – PACKAGING TECH GMBH·Filed 2024·Application pending·0 cites
- 0866US11618094B2Solder ball feeding devicePAC TECH—PACKAGING TECH GMBH·Filed 2020·Granted Apr 4, 2023·0 cites·7 claims
- 0966US2026026301A1Method and device for producing contact metallizationsPAC TECH – PACKAGING TECH GMBH·Filed 2025·Application pending·0 cites
- 1066US2024109144A1Laser-Assisted Soldering ApparatusPAC TECH PACKAGING TECH GMBH·Filed 2023·Application pending·0 cites
- 1164US12358084B2Bonding head and bonding apparatusPAC TECH—PACKAGING TECH GMBH·Filed 2023·Granted Jul 15, 2025·0 cites·24 claims
- 1263US2023105144A1Laser-assisted Soldering Apparatus and Solder Deposition MachinePAC TECH PACKAGING TECH GMBH·Filed 2022·Application pending·0 cites
- 1362US2024110286A1Depositing Station And Device For Generating Contact MetallizationsPAC TECH PACKAGING TECH GMBH·Filed 2023·Application pending·0 cites
- 1461US9685423B2Semiconductor chip assembly and method for manufacturing the samePAC TECH—PACKAGING TECH GMBH·Filed 2014·Granted Jun 20, 2017·1 cites·10 claims
- 1560US12171066B2Method for removing and repositioning electronic components connected to a circuit boardPAC TECH—PACKAGING TECH GMBH·Filed 2021·Granted Dec 17, 2024·0 cites·20 claims
- 1660US2023105729A1Press-Forming Device for Depositing Solder and Producing Individual Solder BodiesPAC TECH PACKAGING TECH GMBH·Filed 2022·Application pending·0 cites
- 1760US2025038468A1Package Comprising At Least Two Contacts For Microtechnology, Method For Handling A Package, And Tool For Implementing The MethodPAC TECH PACKAGING TECH GMBH·Filed 2024·Application pending·0 cites
- 1859US10354971B2Method for producing a chip modulePAC TECH—PACKAGING TECH GMBH·Filed 2014·Granted Jul 16, 2019·2 cites·13 claims
- 1959US2025323066A1Rinsing station and device for producing contact metallizationsPAC TECH – PACKAGING TECH GMBH·Filed 2025·Application pending·0 cites
- 2057US10118240B2Method for forming solder depositsPAC TECH—PACKAGING TECH GMBH·Filed 2017·Granted Nov 6, 2018·0 cites·9 claims
- 2157US2024337677A1Device for Handling a Test ContactPAC TECH PACKAGING TECH GMBH·Filed 2024·Application pending·0 cites
- 2257US2017165772A1Solder ball feeding devicePAC TECH - PACKAGING TECH GMBH·Filed 2015·Application pending·0 cites
- 2357US2026040894A1Method of Increasing a Volume and a Height of a Solder BumpPAC TECH PACKAGING TECH GMBH·Filed 2024·Application pending·0 cites
- 2455US2024203913A1Method For Producing A Solder Contact Surface On A Chip By Producing A Sinter Paste InterfacePAC TECH PACKAGING TECH GMBH·Filed 2023·Application pending·0 cites
- 2554US2026036607A1Test contact, table device, test contact holding device, and method for receiving a test contact in a simplified manner with an active pre-alignment process using electromagnetic manipulationPAC TECH PACKAGING TECH GMBH·Filed 2023·Application pending·0 cites
- 2653US11554434B2Method and laser arrangement for fusing a solder material deposit by means of laser energyPAC TECH—PACKAGING TECH GMBH·Filed 2018·Granted Jan 17, 2023·0 cites·8 claims
- 2753US10634699B2Device for removing a test contact of a test contact arrangementPAC TECH—PACKAGING TECH GMBH·Filed 2016·Granted Apr 28, 2020·0 cites·8 claims
- 2853US2025076342A1Apparatus, System and Method for Repairing a Test Contact ArrangementPAC TECH PACKAGING TECH GMBH·Filed 2023·Application pending·0 cites
- 2952US11224928B2Device for the separate application of solder material depositsPAC TECH—PACKAGING TECH GMBH·Filed 2014·Granted Jan 18, 2022·0 cites·7 claims
- 3052US10081068B2Device for the separate application of solder material depositsPAC TECH PACKAGING TECH GMBH·Filed 2014·Granted Sep 25, 2018·0 cites·8 claims
- 3149US12485500B2Method for monitoring a laser soldering process, and laser soldering system using a spectroscope devicePAC TECH—PACKAGING TECH GMBH·Filed 2021·Granted Dec 2, 2025·0 cites·10 claims
- 3249US12048972B2Method and device including laser heating of gripper for repairing a test contact arrangementPAC TECH—PACKAGING TECH GMBH·Filed 2019·Granted Jul 30, 2024·0 cites·4 claims
- 3348US2025235961A1Apparatus and Method for Establishing a Contact ConnectionPAC TECH PACKAGING TECH GMBH·Filed 2023·Application pending·0 cites
- 3447US12023756B2Method for removing electronic components connected to a circuit boardPAC TECH—PACKAGING TECH GMBH·Filed 2021·Granted Jul 2, 2024·0 cites·17 claims
- 3544US10914759B2Method for placing and contacting a test contactPAC TECH—PACKAGING TECH GMBH·Filed 2016·Granted Feb 9, 2021·0 cites·11 claims
- 3644US10695853B2Device for the separate application of bonding material depositsPAC TECH—PACKAGING TECH GMBH·Filed 2015·Granted Jun 30, 2020·0 cites·8 claims
- 3744US2022259743A1Plating bath for the electroless plating of a substratePAC TECH PACKAGING TECH GMBH·Filed 2020·Application pending·0 cites
- 3843US2023313383A1Method for electrolessly depositing a metal layer onto a substratePAC TECH PACKAGING TECH GMBH·Filed 2021·Application pending·0 cites
- 3943US2023369284A1Chip arrangement and method for forming a sintered contact connectionPAC TECH PACKAGING TECH GMBH·Filed 2022·Application pending·0 cites
- 4038US11217558B2Method and device for establishing a wire connection as well as a component arrangement having a wire connectionPAC TECH—PACKAGING TECH GMBH·Filed 2018·Granted Jan 4, 2022·0 cites·11 claims
- 4117US2018047697A1Chip arrangement and method for forming a contact connectionPAC TECH PACKAGING TECH GMBH·Filed 2016·Application pending·0 cites
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