Solder ball feeding device

Abstract

The invention relates to a solder ball feeding device ( 40 ), comprising a solder ball reservoir ( 20 ) for receiving an amount of solder balls and a metering device ( 31 ) for dispensing a metered feeding amount of solder balls ( 16 ) to a discharge device ( 11 ), wherein the metering device comprises an ultrasound device ( 32 ) and a dispensing nozzle ( 21 ) with a dispensing cannula ( 43 ), the ultrasound device serving to apply vibrations to the dispensing nozzle, and the solder ball reservoir or the dispensing nozzle of the solder ball reservoir being provided with a pressure connection ( 23 ) which serves to introduce a pressurized gas into the solder ball feeding device.

1 . A solder ball feeding device, comprising:
 a solder ball reservoir receiving an amount of solder balls; and   a metering device dispensing a metered feeding amount of solder balls from the solder ball reservoir to a discharge device, wherein the metering device an ultrasound device and a dispensing nozzle with a dispensing cannula, the ultrasound device applying vibrations to the dispensing nozzle, and the solder ball reservoir or the dispensing nozzle of the solder ball reservoir being provided with a pressure connection introducing a pressurized gas into the solder ball feeding device.   
     
     
         2 . The solder ball feeding device according to  claim 1 , in which the ultrasound device is independent of the dispensing nozzle. 
     
     
         3 . The solder ball feeding device according to  claim 2 , in which the ultrasound device is arranged on a container body of the solder ball reservoir. 
     
     
         4 . The solder ball feeding device according to  claim 3 , in which the ultrasound device is detachably arranged on the container body of the solder ball reservoir by a support device. 
     
     
         5 . The solder ball feeding device according to  claims 1 , in which the pressure connection is arranged above a receiving chamber formed in the solder ball reservoir receiving the amount of solder balls. 
     
     
         6 . The solder ball feeding device according to  claim 5 , in which the pressure connection is arranged in a container lid of the solder ball reservoir, said container lid covering the receiving chamber. 
     
     
         7 . The solder ball feeding device according to  claim 6 , in which a sealing device is arranged between the container lid and the container body. 
     
     
         8 . The solder ball feeding device according to  claims 1 , in which the dispensing cannula has a duct diameter that is 2 to 8 times as large as the diameter of the solder balls. 
     
     
         9 . The solder ball feeding device according to  claim 8 , in which the duct diameter is 4 to 7 times as large as the diameter of the solder balls. 
     
     
         10 . The solder ball feeding device according to  claims 1 , in which the dispensing cannula is arranged in an exchangeable manner on the dispensing nozzle. 
     
     
         11 . A transfer device for receiving a solder ball array from a discharge device connected to a solder ball feeding device according to  claim 1 , wherein, for forming an even solder ball array, the transfer device has a transfer substrate that interacts with the discharge device and can be subjected to negative pressure, the discharge device having a bottom wall perforated at least in sections and the transfer substrate having a hole pattern for receiving the solder ball array, the discharge device being provided with an ultrasound device for applying ultrasonic vibrations to the discharge device. 
     
     
         12 . The transfer device according to  claim 11 , which the dispensing cannula is provided with a flexible duct feeding the metered feeding amount to the discharge device. 
     
     
         13 . The transfer device according to  claim 11 , in which the discharge device has a supplying device beneath the bottom wall for supplying an ionized gas. 
     
     
         14 . The transfer device according to  claim 11 , in which the discharge device is provided with a sensor device for monitoring a filling level height h, which interacts with the metering device. 
     
     
         15 . The transfer device according to  claim 14 , in which for the sensor device includes a light barrier device is arranged on the discharge device at the filling level height h. 
     
     
         16 . The transfer device according to  claim 11 , in which the discharge device has an annular circumferential wall with a wire mesh as a bottom wall.