Inventor · disambiguated record
Ghassem Azdasht
Also filed as: AZDASHT GHASSEM
53 granted patents·6 pending applications·797 citations·filing 1994–2020
98Inventor score
Files withPAC TECH GMBH11PAC TECH PACKAGING TECH GMBH11AZDASHT GHASSEM10FRAUNHOFER GES FORSCHUNG8ZAKEL ELKE7
Top patents by PatentIndex Score
59 records- 0197US6281577B1Chips arranged in plurality of planes and electrically connected to one anotherPAC TECH GMBH·Filed 1997·Granted Aug 28, 2001·350 cites·7 claims
- 0285US7882997B2Method and device for mutual contacting of two wafersPAC TECH GMBH·Filed 2005·Granted Feb 8, 2011·13 cites·20 claims
- 0384US10286470B2Device for the separate application of connecting material depositsPAC TECH—PACKAGING TECH GMBH·Filed 2014·Granted May 14, 2019·5 cites·7 claims
- 0482US6713714B1Method and device for thermally connecting the contact surfaces of two substratesPAC TECH GMBH·Filed 2000·Granted Mar 30, 2004·27 cites·10 claims
- 0581US5977512AMulti-wavelength laser soldering device with substrate cleaning beamFRAUNHOFER GES FORSCHUNG·Filed 1996·Granted Nov 2, 1999·71 cites·11 claims
- 0681US5653381AProcess and apparatus for producing a bonded metal coatingFRAUNHOFER GES FORSCHUNG·Filed 1994·Granted Aug 5, 1997·46 cites·11 claims
- 0778US8328068B2Transfer device for receiving and transferring a solder ball arrangementAZDASHT GHASSEM·Filed 2008·Granted Dec 11, 2012·7 cites·10 claims
- 0878US6478906B1Method for bonding a flexible substrate to a chipFRAUNHOFER GES FORSCHUNG·Filed 2000·Granted Nov 12, 2002·27 cites·2 claims
- 0977US8330076B2Method and device for removing solder material deposits from a substrateAZDASHT GHASSEM·Filed 2008·Granted Dec 11, 2012·4 cites·13 claims
- 1076US9401298B2Method and device for transferring a chip to a contact substrateZAKEL ELKE·Filed 2006·Granted Jul 26, 2016·7 cites·10 claims
- 1172US8480298B2Device for positioning and contacting test contactsAZDASHT GHASSEM·Filed 2009·Granted Jul 9, 2013·5 cites·9 claims
- 1272US7717316B2Method and device for applying a solder to a substratePAC TECH GMBH·Filed 2007·Granted May 18, 2010·4 cites·10 claims
- 1371US8361881B2Method for alternately contacting two wafersPAC TECH GMBH·Filed 2011·Granted Jan 29, 2013·3 cites·6 claims
- 1467US6072148ADevice for producing connections between two respective contact elements by means of laser energyFRAUNHOFER GES FORSCHUNG·Filed 1997·Granted Jun 6, 2000·34 cites·19 claims
- 1566US11618094B2Solder ball feeding devicePAC TECH—PACKAGING TECH GMBH·Filed 2020·Granted Apr 4, 2023·0 cites·7 claims
- 1665US7087442B2Process for the formation of a spatial chip arrangement and spatial chip arrangementPAC TECH GMBH·Filed 2001·Granted Aug 8, 2006·11 cites·6 claims
- 1762US8205325B2Device for applying an electronic componentAZDASHT GHASSEM·Filed 2009·Granted Jun 26, 2012·2 cites·4 claims
- 1861US9685423B2Semiconductor chip assembly and method for manufacturing the samePAC TECH—PACKAGING TECH GMBH·Filed 2014·Granted Jun 20, 2017·1 cites·10 claims
- 1961US9649711B2Method and device for electrically contacting terminal faces of two substrates by laser soldering using a gaseous flux mediumAZDASHT GHASSEM·Filed 2012·Granted May 16, 2017·1 cites·7 claims
- 2061US8087163B2Method of manufacturing a contact arrangement between a microelectronic component and a carrierAZDASHT GHASSEM·Filed 2006·Granted Jan 3, 2012·2 cites·10 claims
- 2159US10354971B2Method for producing a chip modulePAC TECH—PACKAGING TECH GMBH·Filed 2014·Granted Jul 16, 2019·2 cites·13 claims
- 2258US7762446B2Method and device for transferring a solder deposit configurationPAC TECH & MDASH PACKAGING TEC·Filed 2005·Granted Jul 27, 2010·2 cites·3 claims
- 2358US6915940B2Device for applying solder globulesPAC TECH GMBH·Filed 2002·Granted Jul 12, 2005·6 cites·5 claims
- 2457US10118240B2Method for forming solder depositsPAC TECH—PACKAGING TECH GMBH·Filed 2017·Granted Nov 6, 2018·0 cites·9 claims
- 2557US2017165772A1Solder ball feeding devicePAC TECH - PACKAGING TECH GMBH·Filed 2015·Application pending·0 cites
- 2656US6769599B1Method and device for placing and remelting shaped pieces consisting of solder materialPAC TECH GMBH·Filed 1999·Granted Aug 3, 2004·20 cites·21 claims
- 2755US6983539B2Method of forming an electrical connection between electrical leads of a tab circuit and electrical contact bumpsHEWLETT PACKARD DEVELOPMENT CO·Filed 2002·Granted Jan 10, 2006·5 cites·9 claims
- 2855US6955943B2Method for producing a substrate arrangementPAC TECH GMBH·Filed 2002·Granted Oct 18, 2005·6 cites·16 claims
- 2953US11554434B2Method and laser arrangement for fusing a solder material deposit by means of laser energyPAC TECH—PACKAGING TECH GMBH·Filed 2018·Granted Jan 17, 2023·0 cites·8 claims
- 3053US10634699B2Device for removing a test contact of a test contact arrangementPAC TECH—PACKAGING TECH GMBH·Filed 2016·Granted Apr 28, 2020·0 cites·8 claims
- 3153US6397465B1Connection of electrical contacts utilizing a combination laser and fiber optic push connect systemHEWLETT PACKARD CO·Filed 1997·Granted Jun 4, 2002·16 cites·12 claims
- 3253US6043985AThermal connecting structure for connecting materials with different expansion coefficientsFRAUNHOFER GES FORSCHUNG·Filed 1997·Granted Mar 28, 2000·21 cites·7 claims
- 3352US11224928B2Device for the separate application of solder material depositsPAC TECH—PACKAGING TECH GMBH·Filed 2014·Granted Jan 18, 2022·0 cites·7 claims
- 3452US10081068B2Device for the separate application of solder material depositsPAC TECH PACKAGING TECH GMBH·Filed 2014·Granted Sep 25, 2018·0 cites·8 claims
- 3552US6093971AChip module with conductor paths on the chip bonding side of a chip carrierFRAUNHOFER GES FORSCHUNG·Filed 1997·Granted Jul 25, 2000·18 cites·11 claims
- 3651US7726543B2Method for the production of a soldered jointSMART PAC GMBH TECHNOLOGY SERV·Filed 2008·Granted Jun 1, 2010·0 cites·1 claims
- 3750US8256131B2Method and device for drying circuit substratesZAKEL ELKE·Filed 2004·Granted Sep 4, 2012·2 cites·18 claims
- 3850US7926699B2Method and device for transferring a solder deposit configurationPAC TECH & MDASH PACKAGING TECHNOLOGIES GMBH·Filed 2009·Granted Apr 19, 2011·0 cites·7 claims
- 3949US7360679B2Method for the production of a soldered connectionSMART PAC GMBH TECHNOLOGY SERV·Filed 2002·Granted Apr 22, 2008·3 cites·1 claims
- 4049US7106599B2Chip module and chip card module for producing a chip cardSMART PAC GMBH TECHNOLOGY SERV·Filed 2001·Granted Sep 12, 2006·2 cites·8 claims
- 4149US6407457B1Contact-bumpless chip contacting method and an electronic circuit produced by said methodSMART PAC GMBH TECHNOLOGY SERV·Filed 2000·Granted Jun 18, 2002·4 cites·9 claims
- 4248US6059176ADevice and a method for applying a plurality of solder globules to a substratePAC TECH GMBH·Filed 1998·Granted May 9, 2000·16 cites·10 claims
- 4348US2012126410A1Contact Array for Substrate ContactingZAKEL ELKE·Filed 2009·Application pending·0 cites
- 4448US2021379683A1Assembly and Method for Applying Solder Balls to a SubstrateAZDASHT GHASSEM·Filed 2018·Application pending·0 cites
- 4547US2013087539A1Method and Device for Forming Solder DepositsAZDASHT GHASSEM·Filed 2011·Application pending·0 cites
- 4646US9327360B2Method and device for contacting, positioning and impinging a solder ball formation with laser energyAZDASHT GHASSEM·Filed 2008·Granted May 3, 2016·0 cites·5 claims
- 4745US5938951AMethod and apparatus for the bonding of a contact elementFRAUNHOFER GES ZUR FORSCHUNG E·Filed 1994·Granted Aug 17, 1999·15 cites·2 claims
- 4844US10695853B2Device for the separate application of bonding material depositsPAC TECH—PACKAGING TECH GMBH·Filed 2015·Granted Jun 30, 2020·0 cites·8 claims
- 4943US8988094B2Test contact arrangementAZDASHT GHASSEM·Filed 2009·Granted Mar 24, 2015·0 cites·7 claims
- 5042US6107118AChip-contacting method requiring no contact bumps, and electronic circuit produced in this wayZAKEL ELKE·Filed 1996·Granted Aug 22, 2000·11 cites·9 claims
Showing the top 50 of 59 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →