Inventor · disambiguated record
Anand Kumar
Also filed as: KUMAR ANAND · KUMAR ANAND H
9 granted patents·6 pending applications·114 citations·filing 1998–2025
84Inventor score
Top patents by PatentIndex Score
15 records- 0193US12002703B2Lift pin assemblyAPPLIED MATERIALS INC·Filed 2021·Granted Jun 4, 2024·2 cites·20 claims
- 0289US11004722B2Lift pin assemblyAPPLIED MATERIALS INC·Filed 2018·Granted May 11, 2021·4 cites·20 claims
- 0388US9761416B2Apparatus and methods for reducing particles in semiconductor process chambersAPPLIED MATERIALS INC·Filed 2014·Granted Sep 12, 2017·7 cites·2 claims
- 0487US6055150AMulti-electrode electrostatic chuck having fuses in hollow cavitiesAPPLIED MATERIALS INC·Filed 1998·Granted Apr 25, 2000·101 cites·32 claims
- 0585US12444644B2Lift pin assemblyAPPLIED MATERIALS INC·Filed 2024·Granted Oct 14, 2025·0 cites·17 claims
- 0671US2025379090A1Electrostatic chucks with hybrid pucks to improve thermal performance and leakage current stabilityAPPLIED MATERIALS INC·Filed 2025·Application pending·0 cites
- 0768US12459071B2Cooling base for a substrate supportAPPLIED MATERIALS INC·Filed 2024·Granted Nov 4, 2025·0 cites·20 claims
- 0868US10770269B2Apparatus and methods for reducing particles in semiconductor process chambersAPPLIED MATERIALS INC·Filed 2017·Granted Sep 8, 2020·0 cites·9 claims
- 0966US12412769B2Electrostatic chucks with hybrid pucks to improve thermal performance and leakage current stabilityAPPLIED MATERIALS INC·Filed 2023·Granted Sep 9, 2025·0 cites·20 claims
- 1059US2025299929A1Substrate support assembly having an edge voltage delivery systemAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 1157US2024304486A1Differential substrate backside coolingAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 1256US2025357089A1Substrate Processing Chamber with Plasma ConfinementAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 1356US2024344199A1Semiconductor processing chamber lid and coatingAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 1455US2025279313A1Lid and hydbrid substrate support for efficient heating and cooling in process chambersAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 1551US10695427B2Shape memory particles for biomedical usesUNIV JOHNS HOPKINS·Filed 2016·Granted Jun 30, 2020·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →