Inventor · disambiguated record
Annamalai Lakshmanan
Also filed as: LAKSHMANAN ANNAMALAI
26 granted patents·15 pending applications·148 citations·filing 2002–2025
95Inventor score
Files withAPPLIED MATERIALS INC36LAKSHMANAN ANNAMALAI2CHATTERJEE SUKTI1NOORI ATIF1RAJAGOPALAN NAGARAJAN1
Top patents by PatentIndex Score
41 records- 0195US12022650B2Low resistivity DRAM buried word line stackAPPLIED MATERIALS INC·Filed 2023·Granted Jun 25, 2024·2 cites·20 claims
- 0294US11587936B2Low resistivity DRAM buried word line stackAPPLIED MATERIALS INC·Filed 2021·Granted Feb 21, 2023·2 cites·20 claims
- 0390US10431493B2Doping control of metal nitride filmsAPPLIED MATERIALS INC·Filed 2018·Granted Oct 1, 2019·5 cites·10 claims
- 0490US7189658B2Strengthening the interface between dielectric layers and barrier layers with an oxide layer of varying composition profileAPPLIED MATERIALS INC·Filed 2005·Granted Mar 13, 2007·11 cites·20 claims
- 0589US7091137B2Bi-layer approach for a hermetic low dielectric constant layer for barrier applicationsAPPLIED MATERIALS INC·Filed 2004·Granted Aug 15, 2006·43 cites·52 claims
- 0687US9613859B2Direct deposition of nickel silicide nanowireAPPLIED MATERIALS INC·Filed 2015·Granted Apr 4, 2017·5 cites·19 claims
- 0787US7259111B2Interface engineering to improve adhesion between low k stacksAPPLIED MATERIALS INC·Filed 2005·Granted Aug 21, 2007·14 cites·17 claims
- 0880US10008412B2Doping control of metal nitride filmsAPPLIED MATERIALS INC·Filed 2017·Granted Jun 26, 2018·2 cites·9 claims
- 0980US7288205B2Hermetic low dielectric constant layer for barrier applicationsAPPLIED MATERIALS INC·Filed 2004·Granted Oct 30, 2007·19 cites·25 claims
- 1080US7229911B2Adhesion improvement for low k dielectrics to conductive materialsAPPLIED MATERIALS INC·Filed 2004·Granted Jun 12, 2007·24 cites·9 claims
- 1179US7273823B2Situ oxide cap layer developmentAPPLIED MATERIALS INC·Filed 2005·Granted Sep 25, 2007·3 cites·20 claims
- 1278US12281387B2Method of depositing metal filmsAPPLIED MATERIALS INC·Filed 2021·Granted Apr 22, 2025·0 cites·5 claims
- 1378US2025250675A1Method of depositing metal filmsAPPLIED MATERIALS INC·Filed 2025·Application pending·0 cites
- 1474US9659814B2Doping control of metal nitride filmsAPPLIED MATERIALS INC·Filed 2014·Granted May 23, 2017·2 cites·12 claims
- 1573US11587829B2Doping control of metal nitride filmsAPPLIED MATERIALS INC·Filed 2021·Granted Feb 21, 2023·0 cites·19 claims
- 1672US12453086B2Low resistivity metal contact stackAPPLIED MATERIALS INC·Filed 2021·Granted Oct 21, 2025·0 cites·15 claims
- 1771US9466524B2Method of depositing metals using high frequency plasmaAPPLIED MATERIALS INC·Filed 2013·Granted Oct 11, 2016·2 cites·15 claims
- 1870US10204764B2Methods for forming a metal silicide interconnection nanowire structureAPPLIED MATERIALS INC·Filed 2014·Granted Feb 12, 2019·2 cites·13 claims
- 1968US9076661B2Methods for manganese nitride integrationAPPLIED MATERIALS INC·Filed 2013·Granted Jul 7, 2015·2 cites·14 claims
- 2068US2023343645A1Gradient oxidation and etch of pvd molybdenum for bottom up gap fillAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 2165US2023343643A1Gradient oxidation and etch for pvd metal as bottom liner in bottom up gap fillAPPLIED MATERIALS INC·Filed 2022·Application pending·0 cites
- 2263US10910263B2Doping control of metal nitride filmsAPPLIED MATERIALS INC·Filed 2019·Granted Feb 2, 2021·0 cites·12 claims
- 2360US8642376B2Methods for depositing a material atop a substrateCHATTERJEE SUKTI·Filed 2012·Granted Feb 4, 2014·1 cites·19 claims
- 2458US12104243B2Methods and apparatus for processing a substrateAPPLIED MATERIALS INC·Filed 2021·Granted Oct 1, 2024·0 cites·20 claims
- 2557US10930472B2Methods for forming a metal silicide interconnection nanowire structureAPPLIED MATERIALS INC·Filed 2019·Granted Feb 23, 2021·0 cites·9 claims
- 2657US10784157B2Doped tantalum nitride for copper barrier applicationsAPPLIED MATERIALS INC·Filed 2012·Granted Sep 22, 2020·1 cites·22 claims
- 2757US2013012030A1Method and apparatus for remote plasma source assisted silicon-containing film depositionAPPLIED MATERIALS INC·Filed 2010·Application pending·0 cites
- 2856US2011230008A1Method and Apparatus for Silicon Film DepositionAPPLIED MATERIALS INC·Filed 2010·Application pending·0 cites
- 2951US2013230986A1Adhesion improvement for low k dielectrics to conductive materialsAPPLIED MATERIALS INC·Filed 2013·Application pending·0 cites
- 3050US9157151B2Elimination of first wafer effect for PECVD filmsLAKSHMANAN ANNAMALAI·Filed 2007·Granted Oct 13, 2015·0 cites·19 claims
- 3150US2023326744A1Field suppressed metal gapfillAPPLIED MATERIALS INC·Filed 2022·Application pending·0 cites
- 3248US6923189B2Cleaning of CVD chambers using remote source with cxfyoz based chemistryAPPLIED MATERIALS INC·Filed 2003·Granted Aug 2, 2005·8 cites·13 claims
- 3348US2010087062A1High temperature bd development for memory applicationsAPPLIED MATERIALS INC·Filed 2008·Application pending·0 cites
- 3447US2023323543A1Integrated cleaning and selective molybdenum deposition processesAPPLIED MATERIALS INC·Filed 2022·Application pending·0 cites
- 3545US2008182403A1Uv curing of pecvd-deposited sacrificial polymer films for air-gap ildNOORI ATIF·Filed 2008·Application pending·0 cites
- 3642US2008050932A1Overall defect reduction for PECVD filmsAPPLIED MATERIALS INC·Filed 2006·Application pending·0 cites
- 3742US2005233555A1Adhesion improvement for low k dielectrics to conductive materialsRAJAGOPALAN NAGARAJAN·Filed 2004·Application pending·0 cites
- 3841US2004052969A1Methods for operating a chemical vapor deposition chamber using a heated gas distribution plateAPPLIED MATERIALS INC·Filed 2002·Application pending·0 cites
- 3937US10593592B2Laminate and core shell formation of silicide nanowireAPPLIED MATERIALS INC·Filed 2015·Granted Mar 17, 2020·0 cites·15 claims
- 4034US2016032455A1High through-put and low temperature ald copper deposition and integrationAPPLIED MATERIALS INC·Filed 2015·Application pending·0 cites
- 4129US2012122320A1Method Of Processing Low K Dielectric FilmsLAKSHMANAN ANNAMALAI·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →