Inventor · disambiguated record
Anna Litza
Also filed as: LITZA ANNA
4 granted patents·2 pending applications·178 citations·filing 1999–2011
80Inventor score
Top patents by PatentIndex Score
6 records- 0193US7382142B2High density interconnect system having rapid fabrication cycleNANONEXUS INC·Filed 2005·Granted Jun 3, 2008·43 cites·29 claims
- 0291US7872482B2High density interconnect system having rapid fabrication cycleVERIGY PTE LTD SINGAPORE·Filed 2007·Granted Jan 18, 2011·21 cites·24 claims
- 0388US6242279B1High density wire bond BGATHIN FILM MODULE INC·Filed 1999·Granted Jun 5, 2001·112 cites·9 claims
- 0461US7884634B2High density interconnect system having rapid fabrication cycleVERIGY PTE LTD SINGAPORE·Filed 2009·Granted Feb 8, 2011·2 cites·8 claims
- 0542US2012023730A1Construction structures and manufacturing processes for integrated circuit wafer probe card assembliesCHONG FU CHIUNG·Filed 2011·Application pending·0 cites
- 0636US2012212248A9Construction Structures and Manufacturing Processes for Integrated Circuit Wafer Probe Card AssembliesCHONG FU CHIUNG·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →