Inventor · disambiguated record
Andrew Mcnees
Also filed as: MCNEES ANDREW · MCNEES ANDREW L · MCNEES ANDREW LEE
32 granted patents·6 pending applications·112 citations·filing 2002–2023
95Inventor score
Files withLEXMARK INT INC17FUNAI ELECTRIC CO10BERNARD DAVID LAURIER4BERNARD DAVID2ANDERSON FRANK EDWARD1
Top patents by PatentIndex Score
38 records- 0197US9855566B1Fluid ejection head and process for making a fluid ejection head structureFUNAI ELECTRIC CO·Filed 2016·Granted Jan 2, 2018·21 cites·9 claims
- 0293US7438392B2Microfluidic substrates having improved fluidic channelsLEXMARK INT INC·Filed 2005·Granted Oct 21, 2008·17 cites·20 claims
- 0383US7938513B2Heater chips with silicon die bonded on silicon substrate and methods of fabricating the heater chipsLEXMARK INT INC·Filed 2008·Granted May 10, 2011·7 cites·20 claims
- 0482US9132654B1Label for inkjet printheadFUNAI ELECTRIC CO·Filed 2014·Granted Sep 15, 2015·3 cites·20 claims
- 0582US8087756B2Heater chips with silicon die bonded on silicon substrateANDERSON FRANK EDWARD·Filed 2011·Granted Jan 3, 2012·5 cites·3 claims
- 0681US6902867B2Ink jet printheads and methods thereforLEXMARK INT INC·Filed 2002·Granted Jun 7, 2005·25 cites·29 claims
- 0777US7041226B2Methods for improving flow through fluidic channelsLEXMARK INT INC·Filed 2003·Granted May 9, 2006·16 cites·24 claims
- 0876US9403365B2Method for fabricating fluid ejection deviceBERNARD DAVID·Filed 2011·Granted Aug 2, 2016·3 cites·5 claims
- 0975US9962948B1Fluid delivery devicesFUNAI ELECTRIC CO·Filed 2016·Granted May 8, 2018·1 cites·11 claims
- 1075US9744771B1Fluidic dispensing device having a stir barFUNAI ELECTRIC CO·Filed 2016·Granted Aug 29, 2017·1 cites·20 claims
- 1168US8324076B2Micro-fluid ejection heads and methods for bonding substrates to supportsBERNARD DAVID LAURIER·Filed 2010·Granted Dec 4, 2012·2 cites·7 claims
- 1268US7735952B2Method of bonding a micro-fluid ejection head to a support substrateLEXMARK INT INC·Filed 2007·Granted Jun 15, 2010·2 cites·20 claims
- 1361US10647119B2Method for fabricating fluid ejection deviceFUNAI ELECTRIC CO·Filed 2018·Granted May 12, 2020·0 cites·10 claims
- 1461US8071275B2Methods for planarizing unevenness on surface of wafer photoresist layer and wafers produced by the methodsBERNARD DAVID LAURIER·Filed 2008·Granted Dec 6, 2011·1 cites·10 claims
- 1561US7344994B2Multiple layer etch stop and etching methodLEXMARK INT INC·Filed 2005·Granted Mar 18, 2008·1 cites·20 claims
- 1660US7271104B2Method for dry etching fluid feed slots in a silicon substrateLEXMARK INT INC·Filed 2005·Granted Sep 18, 2007·2 cites·18 claims
- 1753US7560039B2Methods of deep reactive ion etchingLEXMARK INT INC·Filed 2004·Granted Jul 14, 2009·5 cites·10 claims
- 1853US2015283810A1Fluid ejection devicesFUNAI ELECTRIC CO·Filed 2015·Application pending·0 cites
- 1953US2024278580A1Small form factor print head and printerFUNAI ELECTRIC CO·Filed 2023·Application pending·0 cites
- 2052US10112404B2Fluidic ejection cartridge with molded ceramic bodyFUNAI ELECTRIC CO·Filed 2016·Granted Oct 30, 2018·0 cites·16 claims
- 2151US9079409B2Fluid ejection devicesFANG JIANDONG·Filed 2011·Granted Jul 14, 2015·0 cites·18 claims
- 2251US2016325546A1Fluid ejection deviceFUNAI ELECTRIC CO·Filed 2016·Application pending·0 cites
- 2350US7850284B2Method for dry etching fluid feed slots in a silicon substrateLEXMARK INT INC·Filed 2007·Granted Dec 14, 2010·0 cites·12 claims
- 2450US7815289B2Micro-fluid ejection heads and methods for bonding substrates to supportsLEXMARK INT INC·Filed 2007·Granted Oct 19, 2010·0 cites·6 claims
- 2548US2010206840A1Bonding a micro-fluid ejection head to a support substrateBERNARD DAVID L·Filed 2010·Application pending·0 cites
- 2647US8826502B2Method for making a substantially planar micro-fluid ejection headBERNARD DAVID LAURIER·Filed 2010·Granted Sep 9, 2014·0 cites·19 claims
- 2745US8882221B2Modular micro-fluid ejection head assemblyBERNARD DAVID LAURIER·Filed 2008·Granted Nov 11, 2014·0 cites·4 claims
- 2844US9878894B1Fluid delivery devices having improved efficiency in delivering fluid with reduced wastage of fluidFUNAI ELECTRIC CO·Filed 2016·Granted Jan 30, 2018·0 cites·8 claims
- 2943US2008083700A1Method and Apparatus for Maximizing Cooling for Wafer ProcessingLEXMARK INT INC·Filed 2006·Application pending·0 cites
- 3041US9132639B2Method for fabricating fluid ejection deviceBERNARD DAVID·Filed 2011·Granted Sep 15, 2015·0 cites·6 claims
- 3139US7413915B2Micro-fluid ejection head containing reentrant fluid feed slotsLEXMARK INT INC·Filed 2004·Granted Aug 19, 2008·0 cites·13 claims
- 3239US2008007595A1Methods of Etching Polymeric Materials Suitable for Making Micro-Fluid Ejection Heads and Micro-Fluid Ejection Heads Relating TheretoKRAWCZYK JOHN WILLIAM·Filed 2006·Application pending·0 cites
- 3338US7560223B2Fluid ejection device structures and methods thereforLEXMARK INT INC·Filed 2004·Granted Jul 14, 2009·0 cites·31 claims
- 3438US7524430B2Fluid ejection device structures and methods thereforLEXMARK INT INC·Filed 2004·Granted Apr 28, 2009·0 cites·19 claims
- 3537US7273266B2Micro-fluid ejection assembliesLEXMARK INT INC·Filed 2004·Granted Sep 25, 2007·0 cites·19 claims
- 3636US8491095B2Fluid ejection device and method for fabricating fluid ejection deviceMCNEES ANDREW L·Filed 2011·Granted Jul 23, 2013·0 cites·20 claims
- 3736US7767103B2Micro-fluid ejection assembliesLEXMARK INT INC·Filed 2004·Granted Aug 3, 2010·0 cites·13 claims
- 3836US7202178B2Micro-fluid ejection head containing reentrant fluid feed slotsLEXMARK INT INC·Filed 2004·Granted Apr 10, 2007·0 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →