Inventor · disambiguated record
Anthony Meyer
Also filed as: MEYER ANTHONY · MEYER ANTHONY S
4 granted patents·323 citations·filing 1996–2000
83Inventor score
Top patents by PatentIndex Score
4 records- 0193US5800248AControl of chemical-mechanical polishing rate across a substrate surfaceONTRAK SYSTEMS INC·Filed 1996·Granted Sep 1, 1998·133 cites·23 claims
- 0293US5722877ATechnique for improving within-wafer non-uniformity of material removal for performing CMPLAM RES CORP·Filed 1996·Granted Mar 3, 1998·132 cites·28 claims
- 0377US6328637B1Method and apparatus for conditioning a polishing pad used in chemical mechanical planarizationLAM RES CORP·Filed 2000·Granted Dec 11, 2001·17 cites·20 claims
- 0473US6086460AMethod and apparatus for conditioning a polishing pad used in chemical mechanical planarizationLAM RES CORP·Filed 1998·Granted Jul 11, 2000·41 cites·30 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →