Inventor · disambiguated record
Anthony E. Panczak
Also filed as: PANCZAK ANTHONY · PANCZAK ANTHONY E
11 granted patents·1,346 citations·filing 1995–2012
94Inventor score
Top patents by PatentIndex Score
11 records- 0198US6962829B2Method of making near chip size integrated circuit packageAMKOR TECHNOLOGY INC·Filed 2002·Granted Nov 8, 2005·148 cites·19 claims
- 0297US5981314ANear chip size integrated circuit packageAMKOR TECHNOLOGY INC·Filed 1996·Granted Nov 9, 1999·280 cites·10 claims
- 0396US6268654B1Integrated circuit package having adhesive bead supporting planar lid above planar substrateAMKOR TECHNOLOGY INC·Filed 1999·Granted Jul 31, 2001·198 cites·28 claims
- 0496US6117705AMethod of making integrated circuit package having adhesive bead supporting planar lid above planar substrateAMKOR TECHNOLOGY INC·Filed 1998·Granted Sep 12, 2000·202 cites·38 claims
- 0595US9153543B1Shielding technique for semiconductor package including metal lid and metalized contact areaMANGRUM MARC ALAN·Filed 2012·Granted Oct 6, 2015·29 cites·20 claims
- 0695US5620928AUltra thin ball grid array using a flex tape or printed wiring board substrate and methodNAT SEMICONDUCTOR CORP·Filed 1995·Granted Apr 15, 1997·119 cites·21 claims
- 0794US6228676B1Near chip size integrated circuit packageAMKOR TECHNOLOGY INC·Filed 1999·Granted May 8, 2001·151 cites·13 claims
- 0886US5950074AMethod of making an integrated circuit packageAMKOR TECHNOLOGY INC·Filed 1998·Granted Sep 7, 1999·75 cites·36 claims
- 0981US6034429AIntegrated circuit packageAMKOR TECHNOLOGY INC·Filed 1997·Granted Mar 7, 2000·55 cites·75 claims
- 1078US5796163ASolder ball jointAMKOR TECHNOLOGY INC·Filed 1997·Granted Aug 18, 1998·53 cites·13 claims
- 1164US5796586ASubstrate board having an anti-adhesive solder maskNAT SEMICONDUCTOR INC·Filed 1996·Granted Aug 18, 1998·36 cites·23 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →