Inventor · disambiguated record
Anil K. Pant
Also filed as: PANT ANIL · PANT ANIL K
16 granted patents·2 pending applications·924 citations·filing 1996–2004
95Inventor score
Top patents by PatentIndex Score
18 records- 0195US5762536ASensors for a linear polisherLAM RES CORP·Filed 1997·Granted Jun 9, 1998·150 cites·20 claims
- 0293US5800248AControl of chemical-mechanical polishing rate across a substrate surfaceONTRAK SYSTEMS INC·Filed 1996·Granted Sep 1, 1998·133 cites·23 claims
- 0392US6722950B1Method and apparatus for electrodialytic chemical mechanical polishing and depositionPLANAR LABS CORP·Filed 2001·Granted Apr 20, 2004·67 cites·20 claims
- 0490US5916012AControl of chemical-mechanical polishing rate across a substrate surface for a linear polisherLAM RES CORP·Filed 1997·Granted Jun 29, 1999·112 cites·15 claims
- 0588US6132289AApparatus and method for film thickness measurement integrated into a wafer load/unload unitLAM RES CORP·Filed 1998·Granted Oct 17, 2000·101 cites·18 claims
- 0687US5871390AMethod and apparatus for aligning and tensioning a pad/belt used in linear planarization for chemical mechanical polishingLAM RES CORP·Filed 1997·Granted Feb 16, 1999·75 cites·26 claims
- 0784US6328642B1Integrated pad and belt for chemical mechanical polishingLAM RES CORP·Filed 1997·Granted Dec 11, 2001·66 cites·19 claims
- 0879US6336845B1Method and apparatus for polishing semiconductor wafersLAM RES CORP·Filed 1997·Granted Jan 8, 2002·45 cites·25 claims
- 0979US6325706B1Use of zeta potential during chemical mechanical polishing for end point detectionLAM RES CORP·Filed 1998·Granted Dec 4, 2001·54 cites·23 claims
- 1078US6224461B1Method and apparatus for stabilizing the process temperature during chemical mechanical polishingLAM RES CORP·Filed 1999·Granted May 1, 2001·44 cites·22 claims
- 1176US6416385B2Method and apparatus for polishing semiconductor wafersLAM RES CORP·Filed 2001·Granted Jul 9, 2002·16 cites·19 claims
- 1275US6186865B1Apparatus and method for performing end point detection on a linear planarization toolLAM RES CORP·Filed 1998·Granted Feb 13, 2001·38 cites·30 claims
- 1357US6656025B2Integrated pad and belt for chemical mechanical polishingLAM RES CORP·Filed 2001·Granted Dec 2, 2003·5 cites·13 claims
- 1455US6773337B1Method and apparatus to recondition an ion exchange polish padPLANAR LABS CORP·Filed 2001·Granted Aug 10, 2004·5 cites·7 claims
- 1549US6425812B1Polishing head for chemical mechanical polishing using linear planarization technologyLAM RES CORP·Filed 1999·Granted Jul 30, 2002·13 cites·31 claims
- 1643US6905526B1Fabrication of an ion exchange polish padPLANAR LABS CORP·Filed 2001·Granted Jun 14, 2005·0 cites·13 claims
- 1740US2005118936A1Integrated pad and belt for chemical mechanical polishingLAM RES CORP·Filed 2003·Application pending·0 cites
- 1839US2004235398A1Chemical mechanical planarization method and apparatus for improved process uniformity, reduced topography and reduced defectsFiled 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →