Inventor · disambiguated record
Anthony M. Pasqualoni
Also filed as: PASQUALONI ANTHONY · PASQUALONI ANTHONY M · PASQUALONI ANTHONY MARK
10 granted patents·2 pending applications·785 citations·filing 1988–2009
93Inventor score
Top patents by PatentIndex Score
12 records- 0197US6083840ASlurry compositions and method for the chemical-mechanical polishing of copper and copper alloysARCH SPEC CHEM INC·Filed 1998·Granted Jul 4, 2000·299 cites·28 claims
- 0295US6468913B1Ready-to-use stable chemical-mechanical polishing slurriesARCH SPEC CHEM INC·Filed 2000·Granted Oct 22, 2002·63 cites·37 claims
- 0393US4897508AMetal electronic packageOLIN CORP·Filed 1988·Granted Jan 30, 1990·121 cites·36 claims
- 0485US5477008APolymer plug for electronic packagesOLIN CORP·Filed 1993·Granted Dec 19, 1995·95 cites·10 claims
- 0584US5399805AMetal electronic package with reduced seal widthOLIN CORP·Filed 1993·Granted Mar 21, 1995·66 cites·19 claims
- 0680US5066368AProcess for producing black integrally colored anodized aluminum componentsOLIN CORP·Filed 1990·Granted Nov 19, 1991·60 cites·18 claims
- 0778US6749488B2Chemical mechanical polishing slurry composition for polishing conductive and non-conductive layers on semiconductor wafersPLANAR SOLUTIONS LLC·Filed 2002·Granted Jun 15, 2004·24 cites·2 claims
- 0875US5324888AMetal electronic package with reduced seal widthOLIN CORP·Filed 1992·Granted Jun 28, 1994·45 cites·34 claims
- 0936USD612414SElectric guitarMILLS DAVID DYCKMAN·Filed 2009·Granted Mar 23, 2010·6 cites·1 claims
- 1036US5403975AAnodized aluminum electronic package componentsOLIN CORP·Filed 1993·Granted Apr 4, 1995·6 cites·6 claims
- 1136US2003104770A1Chemical mechanical polishing slurry composition for polishing conductive and non-conductive layers on semiconductor wafersARCH SPEC CHEM INC·Filed 2001·Application pending·0 cites
- 1235US2004159050A1Chemical mechanical polishing slurry composition for polishing conductive and non-conductive layers on semiconductor wafersARCH SPEC CHEM INC·Filed 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →