Inventor · disambiguated record
Anthony R. Schepis
Also filed as: SCHEPIS ANTHONY · SCHEPIS ANTHONY R
20 granted patents·8 pending applications·31 citations·filing 2000–2024
90Inventor score
Top patents by PatentIndex Score
28 records- 0189US11791167B2Cyclic self-limiting etch processTOKYO ELECTRON LTD·Filed 2020·Granted Oct 17, 2023·2 cites·20 claims
- 0287US12381093B2Hybrid patterning-bonding semiconductor toolTOKYO ELECTRON LTD·Filed 2022·Granted Aug 5, 2025·1 cites·18 claims
- 0375US11526088B2Coaxial see-through alignment imaging systemTOKYO ELECTRON LTD·Filed 2021·Granted Dec 13, 2022·0 cites·9 claims
- 0474US12099299B2Method of patterning a substrate using a sidewall spacer etch maskTOKYO ELECTRON LTD·Filed 2023·Granted Sep 24, 2024·0 cites·10 claims
- 0570US12374562B2Wafer shape control for W2W bondingTOKYO ELECTRON LTD·Filed 2022·Granted Jul 29, 2025·0 cites·20 claims
- 0668US11862497B2Method for die-level unique authentication and serialization of semiconductor devices using electrical and optical markingTOKYO ELECTRON LTD·Filed 2021·Granted Jan 2, 2024·0 cites·20 claims
- 0767US6872301B2High shear rotating disc filterFiled 2001·Granted Mar 29, 2005·15 cites·8 claims
- 0864US6663290B1Grooved bearing ball and rolling elementFiled 2002·Granted Dec 16, 2003·9 cites·17 claims
- 0963US12505998B2Method for chuck compensation via wafer shape controlTOKYO ELECTRON LTD·Filed 2022·Granted Dec 23, 2025·0 cites·20 claims
- 1063US11782346B2Method of patterning a substrate using a sidewall spacer etch maskTOKYO ELECTRON LTD·Filed 2020·Granted Oct 10, 2023·0 cites·10 claims
- 1160US12512356B2Apparatus and method for wafer alignmentTOKYO ELECTRON LTD·Filed 2022·Granted Dec 30, 2025·0 cites·20 claims
- 1260US12001147B2Precision multi-axis photolithography alignment correction using stressor filmTOKYO ELECTRON LTD·Filed 2022·Granted Jun 4, 2024·0 cites·7 claims
- 1359US12455511B2In-situ lithography pattern enhancement with localized stress treatment tuning using heat zonesTOKYO ELECTRON LTD·Filed 2022·Granted Oct 28, 2025·0 cites·11 claims
- 1459US11133206B2Method for die-level unique authentication and serialization of semiconductor devices using electrical and optical markingTOKYO ELECTRON LTD·Filed 2019·Granted Sep 28, 2021·0 cites·11 claims
- 1559US2025308951A1Die to wafer bonding method and apparatus with thermal contactless die shape controlTOKYO ELECTRON LTD·Filed 2024·Application pending·0 cites
- 1659US2025308902A1Using laser based system for mean of shaping of unsingulated & singulated dies by substrate lattice manipulationTOKYO ELECTRON LTD·Filed 2024·Application pending·0 cites
- 1758US2025259943A1Die shape control for die to wafer bond enhancementTOKYO ELECTRON LTD·Filed 2024·Application pending·0 cites
- 1857US12394618B2Method of adjusting wafer shape using multi-directional actuation filmsTOKYO ELECTRON LTD·Filed 2022·Granted Aug 19, 2025·0 cites·20 claims
- 1957US11721551B2Localized stress regions for three-dimension chiplet formationTOKYO ELECTRON LTD·Filed 2021·Granted Aug 8, 2023·0 cites·16 claims
- 2057US2025308949A1Die to wafer bonding method and apparatus with thermal contact die shape controlTOKYO ELECTRON LTD·Filed 2024·Application pending·0 cites
- 2157US2025226265A1Correcting of design and mask shape position due to die and wafer distortion for bondingTOKYO ELECTRON LTD·Filed 2024·Application pending·0 cites
- 2256US2025140614A1Method for creating product-like stressed surrogate test wafersTOKYO ELECTRON LTD·Filed 2023·Application pending·0 cites
- 2355US11688642B2Localized stress regions for three-dimension chiplet formationTOKYO ELECTRON LTD·Filed 2021·Granted Jun 27, 2023·0 cites·8 claims
- 2454US12381118B23D multiple location compressing bonded arm for advanced integrationTOKYO ELECTRON LTD·Filed 2022·Granted Aug 5, 2025·0 cites·12 claims
- 2554US6435431B1Pulverizing system purgingSTURTEVANT INC·Filed 2000·Granted Aug 20, 2002·4 cites·10 claims
- 2654US2023251574A1Method to enhance lithography pattern creation using semiconductor stress film tuningTOKYO ELECTRON LTD·Filed 2022·Application pending·0 cites
- 2748US11776808B2Planarization of spin-on filmsTOKYO ELECTRON LTD·Filed 2020·Granted Oct 3, 2023·0 cites·18 claims
- 2843US2020328102A1Method for die-level unique authentication and serialization of semiconductor devicesTOKYO ELECTRON LTD·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →