Inventor · disambiguated record
Andreas Wolter
Also filed as: WOLTER ANDREAS
70 granted patents·23 pending applications·630 citations·filing 1984–2025
98Inventor score
Files withINTEL IP CORP34INTEL CORP29SIGMA ALDRICH CO5INFINEON TECHNOLOGIES AG3VORWERK CO INTERHOLDING3
Top patents by PatentIndex Score
93 records- 0197US11955462B2Package stacking using chip to wafer bondingINTEL CORP·Filed 2021·Granted Apr 9, 2024·3 cites·20 claims
- 0297US9997444B2Microelectronic package having a passive microelectronic device disposed within a package bodyINTEL CORP·Filed 2014·Granted Jun 12, 2018·41 cites·24 claims
- 0397US9312198B2Chip package-in-package and method thereofINTEL MOBILE COMM GMBH·Filed 2013·Granted Apr 12, 2016·39 cites·11 claims
- 0495US9985005B2Chip package-in-packageINTEL DEUTSCHLAND GMBH·Filed 2016·Granted May 29, 2018·14 cites·14 claims
- 0593US10319688B2Antenna on ceramics for a packaged dieINTEL CORP·Filed 2013·Granted Jun 11, 2019·21 cites·18 claims
- 0692US7427678B2Method for immobilizing oligonucleotides employing the cycloaddition bioconjugation methodSIGMA ALDRICH CO·Filed 2001·Granted Sep 23, 2008·247 cites·20 claims
- 0791US8779564B1Semiconductor device with capacitive coupling structureINTEL IP CORP·Filed 2013·Granted Jul 15, 2014·14 cites·26 claims
- 0890US8093711B2Semiconductor deviceZUDOCK FRANK·Filed 2009·Granted Jan 10, 2012·32 cites·22 claims
- 0990US6902900B2Nucleic acid probes and methods to detect and/or quantify nucleic acid analytesPROLICO LLC·Filed 2002·Granted Jun 7, 2005·62 cites·25 claims
- 1089US10403609B2System-in-package devices and methods for forming system-in-package devicesINTEL IP CORP·Filed 2015·Granted Sep 3, 2019·7 cites·25 claims
- 1189US9711492B2Three dimensional structures within mold compoundINTEL CORP·Filed 2014·Granted Jul 18, 2017·8 cites·20 claims
- 1287US2025323155A1Bare-die smart bridge connected with copper pillars for system-in-package apparatusINTEL CORP·Filed 2025·Application pending·0 cites
- 1385US11270941B2Bare-die smart bridge connected with copper pillars for system-in-package apparatusINTEL CORP·Filed 2016·Granted Mar 8, 2022·4 cites·20 claims
- 1485US2025285972A1Bare-die smart bridge connected with copper pillars for system-in-package apparatusINTEL CORP·Filed 2025·Application pending·0 cites
- 1585US2025285971A1Bare-die smart bridge connected with copper pillars for system-in-package apparatusINTEL CORP·Filed 2025·Application pending·0 cites
- 1682US10867934B2Component magnetic shielding for microelectronic devicesINTEL IP CORP·Filed 2018·Granted Dec 15, 2020·4 cites·12 claims
- 1781US10209466B2Integrated circuit packages including an optical redistribution layerINTEL IP CORP·Filed 2016·Granted Feb 19, 2019·3 cites·17 claims
- 1881US2024213225A1Package stacking using chip to wafer bondingINTEL CORP·Filed 2024·Application pending·0 cites
- 1980US10896780B2Resonant LC tank package and method of manufactureINTEL IP CORP·Filed 2018·Granted Jan 19, 2021·2 cites·25 claims
- 2080US7928590B2Integrated circuit package with a heat dissipation deviceQIMONDA AG·Filed 2006·Granted Apr 19, 2011·9 cites·15 claims
- 2179US10522485B2Electrical device and a method for forming an electrical deviceINTEL IP CORP·Filed 2015·Granted Dec 31, 2019·3 cites·25 claims
- 2279US8786105B1Semiconductor device with chip having low-k-layersMEYER THORSTEN·Filed 2013·Granted Jul 22, 2014·5 cites·30 claims
- 2378US11239199B2Package stacking using chip to wafer bondingINTEL CORP·Filed 2015·Granted Feb 1, 2022·2 cites·18 claims
- 2478US9576918B2Conductive paths through dielectric with a high aspect ratio for semiconductor devicesINTEL IP CORP·Filed 2015·Granted Feb 21, 2017·2 cites·17 claims
- 2577US7897758B2Activators for oligonucleotide and phosphoramidite synthesisSIGMA ALDRICH CO·Filed 2006·Granted Mar 1, 2011·3 cites·16 claims
- 2676US12341096B2Bare-die smart bridge connected with copper pillars for system-in-package apparatusINTEL CORP·Filed 2022·Granted Jun 24, 2025·0 cites·10 claims
- 2776US11984246B2Vertical inductor for WLCSPINTEL CORP·Filed 2021·Granted May 14, 2024·0 cites·13 claims
- 2876US11784143B2Single metal cavity antenna in package connected to an integrated transceiver front-endINTEL CORP·Filed 2019·Granted Oct 10, 2023·2 cites·15 claims
- 2975US11646498B2Package integrated cavity resonator antennaINTEL CORP·Filed 2019·Granted May 9, 2023·2 cites·16 claims
- 3075US10403602B2Monolithic silicon bridge stack including a hybrid baseband die supporting processors and memoryINTEL CORP·Filed 2017·Granted Sep 3, 2019·2 cites·9 claims
- 3175US9865387B2Electronic package with coil formed on coreINTEL IP CORP·Filed 2015·Granted Jan 9, 2018·1 cites·9 claims
- 3274US9819327B2Bulk acoustic wave resonator tuner circuitsMARUTHAMUTHU SARAVANA·Filed 2013·Granted Nov 14, 2017·5 cites·22 claims
- 3374US7274107B2Semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2005·Granted Sep 25, 2007·6 cites·18 claims
- 3473US9397019B2Integrated circuit package configurations to reduce stiffnessINTEL IP CORP·Filed 2014·Granted Jul 19, 2016·2 cites·14 claims
- 3573US8138330B2Process for the synthesis of oligonucleotidesLEUCK MICHAEL·Filed 2007·Granted Mar 20, 2012·7 cites·23 claims
- 3673US7080988B2Flexible contact-connection deviceINFINEON TECHNOLOGIES AG·Filed 2005·Granted Jul 25, 2006·5 cites·10 claims
- 3771US11250981B2Vertical inductor for WLCSPINTEL CORP·Filed 2020·Granted Feb 15, 2022·0 cites·5 claims
- 3870US4655952ADetergent and method for producing the sameVORWERK CO INTERHOLDING·Filed 1985·Granted Apr 7, 1987·32 cites·4 claims
- 3968US10290412B2Vertical inductor for WLCSPINTEL IP CORP·Filed 2015·Granted May 14, 2019·1 cites·7 claims
- 4067US10366968B2Interconnect structure for a microelectronic deviceINTEL IP CORP·Filed 2016·Granted Jul 30, 2019·1 cites·13 claims
- 4166US12125815B2Assembly of 2XD module using high density interconnect bridgesINTEL CORP·Filed 2020·Granted Oct 22, 2024·0 cites·21 claims
- 4266US11521793B2Resonant LC tank package and method of manufactureINTEL CORP·Filed 2020·Granted Dec 6, 2022·0 cites·24 claims
- 4366US11469213B2Systems, methods, and apparatuses for implementing reduced height semiconductor packages for mobile electronicsINTEL CORP·Filed 2016·Granted Oct 11, 2022·1 cites·25 claims
- 4466US8049310B2Semiconductor device with an interconnect element and method for manufactureQIMONDA AG·Filed 2008·Granted Nov 1, 2011·3 cites·7 claims
- 4565US12406925B2Bare-die smart bridge connected with copper pillars for system-in-package apparatusINTEL CORP·Filed 2021·Granted Sep 2, 2025·0 cites·17 claims
- 4665US10490527B2Vertical wire connections for integrated circuit packageINTEL IP CORP·Filed 2015·Granted Nov 26, 2019·1 cites·22 claims
- 4765US2022294115A1Patch antennas stitched to systems in packages and methods of assembling sameINTEL CORP·Filed 2022·Application pending·0 cites
- 4863US7098326B2Methods for the integrated synthesis and purification of oligonucleotidesSIGMA ALDRICH CO·Filed 2003·Granted Aug 29, 2006·1 cites·22 claims
- 4962US10784033B2Vertical inductor for WLCSPINTEL IP CORP·Filed 2019·Granted Sep 22, 2020·0 cites·7 claims
- 5062US7329515B2Solid support for the synthesis of 3′-amino oligonucleotidesSIGMA ALDRICH CO·Filed 2004·Granted Feb 12, 2008·1 cites·28 claims
Showing the top 50 of 93 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →