Inventor · disambiguated record
Ardavan Niroomand
Also filed as: NIROOMAND ARDAVAN
45 granted patents·1 pending application·1,289 citations·filing 1992–2024
98Inventor score
Files withMICRON TECHNOLOGY INC36ALAPATI RAMAKANTH3LODESTAR LICENSING GROUP LLC2ZHOU BAOSUO2INTEL CORP1
Top patents by PatentIndex Score
46 records- 0199US7732343B2Simplified pitch doubling process flowMICRON TECHNOLOGY INC·Filed 2007·Granted Jun 8, 2010·572 cites·13 claims
- 0297US7790360B2Methods of forming multiple linesMICRON TECHNOLOGY INC·Filed 2007·Granted Sep 7, 2010·60 cites·30 claims
- 0396US7902074B2Simplified pitch doubling process flowMICRON TECHNOLOGY INC·Filed 2006·Granted Mar 8, 2011·26 cites·19 claims
- 0496US7538036B2Methods of forming openings, and methods of forming container capacitorsMICRON TECHNOLOGY INC·Filed 2005·Granted May 26, 2009·36 cites·8 claims
- 0596US7321149B2Capacitor structures, and DRAM arraysMICRON TECHNOLOGY INC·Filed 2005·Granted Jan 22, 2008·34 cites·7 claims
- 0695US9761457B2Pitch reduction technology using alternating spacer depositions during the formation of a semiconductor device and systems including sameMICRON TECHNOLOGY INC·Filed 2016·Granted Sep 12, 2017·7 cites·8 claims
- 0795US8852851B2Pitch reduction technology using alternating spacer depositions during the formation of a semiconductor device and systems including sameZHOU BAOSUO·Filed 2006·Granted Oct 7, 2014·23 cites·10 claims
- 0894US10096483B2Pitch reduction technology using alternating spacer depositions during the formation of a semiconductor device and systems including sameMICRON TECHNOLOGY INC·Filed 2017·Granted Oct 9, 2018·6 cites·8 claims
- 0992US10607844B2Pitch reduction technology using alternating spacer depositions during the formation of a semiconductor device and systems including sameMICRON TECHNOLOGY INC·Filed 2018·Granted Mar 31, 2020·4 cites·4 claims
- 1092US8431456B2Methods of forming high density structures and low density structures with a single photomaskALAPATI RAMAKANTH·Filed 2012·Granted Apr 30, 2013·11 cites·11 claims
- 1192US8207570B2Semiconductor constructionsALAPATI RAMAKANTH·Filed 2010·Granted Jun 26, 2012·12 cites·20 claims
- 1292US7659208B2Method for forming high density patternsMICRON TECHNOLOGY INC·Filed 2007·Granted Feb 9, 2010·14 cites·35 claims
- 1391US9184159B2Simplified pitch doubling process flowMICRON TECHNOLOGY INC·Filed 2012·Granted Nov 10, 2015·7 cites·20 claims
- 1491US8324107B2Method for forming high density patternsZHOU BAOSUO·Filed 2010·Granted Dec 4, 2012·9 cites·19 claims
- 1590US12463044B2Pitch reduction technology using alternating spacer depositions during the formation of a semiconductor device and systems including sameLODESTAR LICENSING GROUP LLC·Filed 2024·Granted Nov 4, 2025·0 cites·12 claims
- 1690US8039399B2Methods of forming patterns utilizing lithography and spacersMICRON TECHNOLOGY INC·Filed 2008·Granted Oct 18, 2011·15 cites·28 claims
- 1790US8003310B2Masking techniques and templates for dense semiconductor fabricationMICRON TECHNOLOGY INC·Filed 2006·Granted Aug 23, 2011·15 cites·8 claims
- 1890US7799694B2Methods of forming semiconductor constructionsMICRON TECHNOLOGY INC·Filed 2006·Granted Sep 21, 2010·14 cites·35 claims
- 1989US7153778B2Methods of forming openings, and methods of forming container capacitorsMICRON TECHNOLOGY INC·Filed 2004·Granted Dec 26, 2006·34 cites·29 claims
- 2087US8598043B2Methods of forming semiconductor constructionsALAPATI RAMAKANTH·Filed 2010·Granted Dec 3, 2013·7 cites·20 claims
- 2187US8030217B2Simplified pitch doubling process flowMICRON TECHNOLOGY INC·Filed 2010·Granted Oct 4, 2011·5 cites·25 claims
- 2287US6281100B1Semiconductor processing methodsMICRON TECHNOLOGY INC·Filed 1998·Granted Aug 28, 2001·62 cites·19 claims
- 2385US6383723B1Method to clean substrate and improve photoresist profileMICRON TECHNOLOGY INC·Filed 1998·Granted May 7, 2002·75 cites·43 claims
- 2484US7408265B2Use of a dual-tone resist to form photomasks including alignment mark protection, intermediate semiconductor device structures and bulk semiconductor device substratesMICRON TECHNOLOGY INC·Filed 2004·Granted Aug 5, 2008·28 cites·15 claims
- 2583US9305782B2Pitch reduction technology using alternating spacer depositions during the formation of a semiconductor device and systems including sameMICRON TECHNOLOGY INC·Filed 2014·Granted Apr 5, 2016·3 cites·10 claims
- 2682US11935756B2Pitch reduction technology using alternating spacer depositions during the formation of a semiconductor device and systems including sameLODESTAR LICENSING GROUP LLC·Filed 2022·Granted Mar 19, 2024·0 cites·8 claims
- 2781US6451504B2Semiconductor processing method of promoting photoresist adhesion to an outer substrate layer predominately comprising silicon nitrideMICRON TECHNOLOGY INC·Filed 2001·Granted Sep 17, 2002·19 cites·4 claims
- 2880US6461950B2Semiconductor processing methods, semiconductor circuitry, and gate stacksMICRON TECHNOLOGY INC·Filed 2001·Granted Oct 8, 2002·16 cites·19 claims
- 2976US8871648B2Method for forming high density patternsMICRON TECHNOLOGY INC·Filed 2012·Granted Oct 28, 2014·2 cites·20 claims
- 3074US11335563B2Pitch reduction technology using alternating spacer depositions during the formation of a semiconductor device and systems including sameMICRON TECHNOLOGY INC·Filed 2020·Granted May 17, 2022·0 cites·7 claims
- 3172US6417559B1Semiconductor wafer assemblies comprising photoresist over silicon nitride materialsMICRON TECHNOLOGY INC·Filed 2000·Granted Jul 9, 2002·10 cites·15 claims
- 3272US5926739ASemiconductor processing method of promoting photoresist adhesion to an outer substrate layer predominately comprising silicon nitrideMICRON TECHNOLOGY INC·Filed 1995·Granted Jul 20, 1999·31 cites·3 claims
- 3368US5886391AAntireflective structureMICRON TECHNOLOGY INC·Filed 1997·Granted Mar 23, 1999·27 cites·27 claims
- 3465US5990002AMethod of making an antireflective structureMICRON TECHNOLOGY INC·Filed 1998·Granted Nov 23, 1999·23 cites·28 claims
- 3564US8338959B2Simplified pitch doubling process flowNIROOMAND ARDAVAN·Filed 2011·Granted Dec 25, 2012·1 cites·19 claims
- 3664US6693345B2Semiconductor wafer assemblies comprising photoresist over silicon nitride materialsMICRON TECHNOLOGY INC·Filed 2001·Granted Feb 17, 2004·6 cites·12 claims
- 3761US6228740B1Method of making an antireflective structureMICRON TECHNOLOGY INC·Filed 1999·Granted May 8, 2001·19 cites·34 claims
- 3861US6107002AReducing resist shrinkage during device fabricationMICRON TECHNOLOGY INC·Filed 1998·Granted Aug 22, 2000·19 cites·21 claims
- 3957US5259924AIntegrated circuit fabrication process to reduce critical dimension loss during etchingMICRON TECHNOLOGY INC·Filed 1992·Granted Nov 9, 1993·27 cites·9 claims
- 4057US2009294878A1Circuitry and gate stacksYIN ZHIPING·Filed 2009·Application pending·0 cites
- 4155US7821142B2Intermediate semiconductor device structuresMICRON TECHNOLOGY INC·Filed 2008·Granted Oct 26, 2010·0 cites·11 claims
- 4252US7057263B2Semiconductor wafer assemblies comprising photoresist over silicon nitride materialsMICRON TECHNOLOGY INC·Filed 2003·Granted Jun 6, 2006·2 cites·9 claims
- 4348US7576400B1Circuitry and gate stacksMICRON TECHNOLOGY INC·Filed 2000·Granted Aug 18, 2009·1 cites·13 claims
- 4443US7867843B2Gate structures for flash memory and methods of making sameINTEL CORP·Filed 2006·Granted Jan 11, 2011·0 cites·15 claims
- 4540US6323139B1Semiconductor processing methods of forming photoresist over silicon nitride materialsMICRON TECHNOLOGY INC·Filed 1999·Granted Nov 27, 2001·5 cites·9 claims
- 4633US6297171B1Semiconductor processing method of promoting photoresist adhesion to an outer substrate layer predominately comprising silicon nitrideMICRON TECHNOLOGY INC·Filed 1999·Granted Oct 2, 2001·2 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →