Inventor · disambiguated record
Ara Philipossian
Also filed as: PHILIPOSSIAN ARA
18 granted patents·18 pending applications·732 citations·filing 1989–2022
95Inventor score
Top patents by PatentIndex Score
36 records- 0196US5596218AHot carrier-hard gate oxides by nitrogen implantation before gate oxidationDIGITAL EQUIPMENT CORP·Filed 1993·Granted Jan 21, 1997·178 cites·8 claims
- 0290US5316965AMethod of decreasing the field oxide etch rate in isolation technologyDIGITAL EQUIPMENT CORP·Filed 1993·Granted May 31, 1994·117 cites·23 claims
- 0389US5330920AMethod of controlling gate oxide thickness in the fabrication of semiconductor devicesDIGITAL EQUIPMENT CORP·Filed 1993·Granted Jul 19, 1994·125 cites·6 claims
- 0488US8845395B2Method and device for the injection of CMP slurryBORUCKI LEONARD JOHN·Filed 2012·Granted Sep 30, 2014·12 cites·15 claims
- 0588US5387530AThreshold optimization for soi transistors through use of negative charge in the gate oxideDIGITAL EQUIPMENT CORP·Filed 1993·Granted Feb 7, 1995·72 cites·1 claims
- 0685US4950156AInert gas curtain for a thermal processing furnaceDIGITAL EQUIPMENT CORP·Filed 1989·Granted Aug 21, 1990·32 cites·17 claims
- 0783US9296088B2Method and device for the injection of CMP slurryBORUCKI LEONARD JOHN·Filed 2010·Granted Mar 29, 2016·7 cites·18 claims
- 0876US4992044AReactant exhaust system for a thermal processing furnaceDIGITAL EQUIPMENT CORP·Filed 1989·Granted Feb 12, 1991·30 cites·17 claims
- 0974US5385630AProcess for increasing sacrificial oxide etch rate to reduce field oxide lossDIGITAL EQUIPMENT CORP·Filed 1993·Granted Jan 31, 1995·52 cites·14 claims
- 1070US8197306B2Method and device for the injection of CMP slurryBORUCKI LEONARD·Filed 2008·Granted Jun 12, 2012·7 cites·21 claims
- 1167US5064367AConical gas inlet for thermal processing furnaceDIGITAL EQUIPMENT CORP·Filed 1990·Granted Nov 12, 1991·27 cites·12 claims
- 1259US12448545B2Silicon carbide (SIC) wafer polishing with slurry formulation and processARACA INC·Filed 2022·Granted Oct 21, 2025·0 cites·22 claims
- 1359US7070486B2Polishing apparatus and method of polishing work pieceFUJIKOSHI MACHINERY CORP·Filed 2004·Granted Jul 4, 2006·7 cites·4 claims
- 1456US5248253AThermal processing furnace with improved plug flowDIGITAL EQUIPMENT CORP·Filed 1992·Granted Sep 28, 1993·31 cites·10 claims
- 1555US5407850ASOI transistor threshold optimization by use of gate oxide having positive chargeDIGITAL EQUIPMENT CORP·Filed 1993·Granted Apr 18, 1995·16 cites·1 claims
- 1654US2024425723A1Pad-in-a-bottle chemical mechanical planarization polishing with cost-effective non-porous solid polishing padsVERSUM MAT US LLC·Filed 2022·Application pending·0 cites
- 1754US2025014911A1Pad-in-a-bottle and single platen chemical mechanical-planarization for back-end applicationsVERSUM MAT US LLC·Filed 2022·Application pending·0 cites
- 1853US2024352279A1Pad-in-a-bottle (pib) technology for copper barrier slurriesVERSUM MAT US LLC·Filed 2022·Application pending·0 cites
- 1948US2023287242A1Pad-in-a-bottle (pib) technology for copper and through-silicon via (tsv) chemical-mechanical planarization (cmp)VERSUM MAT US LLC·Filed 2021·Application pending·0 cites
- 2046US7195546B2Polishing apparatus and method of polishing work pieceFUJIKOSHI MACHINERY CORP·Filed 2006·Granted Mar 27, 2007·0 cites·4 claims
- 2146US2010240283A1Method of Chemical Mechanical PolishingARACA INC·Filed 2009·Application pending·0 cites
- 2246US2010099333A1Method and apparatus for determining shear force between the wafer head and polishing pad in chemical mechanical polishingSUDARGHO FRANSISCA MARIA ASTRID·Filed 2008·Application pending·0 cites
- 2345US5256060AReducing gas recirculation in thermal processing furnaceDIGITAL EQUIPMENT CORP·Filed 1992·Granted Oct 26, 1993·13 cites·17 claims
- 2445US2025101261A1Chemical mechanical planarization slurry processing techniques and systems and methods for polishing substrate using the sameARACA INC·Filed 2022·Application pending·0 cites
- 2544US2010159804A1Method of observing pattern evolution using variance and fourier transform spectra of friction forces in cmpARACA INC·Filed 2008·Application pending·0 cites
- 2643US2010107726A1Device for determining the coefficient of friction of diamond conditioner discs and a method of use thereofMITSUBISHI MATERIALS CORP·Filed 2008·Application pending·0 cites
- 2743US2010186479A1Method for counting and characterizing aggressive diamonds in cmp diamond conditioner discsARACA INC·Filed 2009·Application pending·0 cites
- 2841US2010112905A1Wafer head template for chemical mechanical polishing and a method for its useBORUCKI LEONARD·Filed 2008·Application pending·0 cites
- 2941US2008200032A1Polishing method of semiconductor substrateHITACHI CHEMICAL CO LTD·Filed 2008·Application pending·0 cites
- 3041US2010216373A1Method for cmp uniformity controlARACA INC·Filed 2009·Application pending·0 cites
- 3138US2010203811A1Method and apparatus for accelerated wear testing of aggressive diamonds on diamond conditioning discs in cmpARACA INC·Filed 2009·Application pending·0 cites
- 3238US2024379371A1Chemical mechanical planarization slurry processing techniques and systems and methods for polishing substrate using the sameARACA INC·Filed 2022·Application pending·0 cites
- 3337US2011076924A1Method of determining the lubrication mechanism in cmpARACA INC·Filed 2009·Application pending·0 cites
- 3434US5420065AProcess for filling an isolation trenchDIGITAL EQUIPMENT CORP·Filed 1993·Granted May 30, 1995·6 cites·3 claims
- 3534US2011312182A1Method and apparatus for chemical-mechanical planarizationBORUCKI LEONARD JOHN·Filed 2011·Application pending·0 cites
- 3630US2005164613A1Method of conditioning polishing pad for semiconductor waferTOSHIRO DOI·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →