Inventor · disambiguated record
Arnold Reisman
Also filed as: REISMAN ARNOLD
36 granted patents·1 pending application·1,939 citations·filing 1970–2001
98Inventor score
Top patents by PatentIndex Score
37 records- 0198US4007464AInk jet nozzleIBM·Filed 1975·Granted Feb 8, 1977·157 cites·20 claims
- 0297US4329706ADoped polysilicon silicide semiconductor integrated circuit interconnectionsIBM·Filed 1979·Granted May 11, 1982·121 cites·7 claims
- 0395US5325265AHigh performance integrated circuit chip packageMCNC·Filed 1992·Granted Jun 28, 1994·252 cites·29 claims
- 0495US4891329AMethod of forming a nonsilicon semiconductor on insulator structureUNIV NORTH CAROLINA·Filed 1988·Granted Jan 2, 1990·153 cites·19 claims
- 0595US4592628AMirror array light valveIBM·Filed 1981·Granted Jun 3, 1986·147 cites·2 claims
- 0690US5112439AMethod for selectively depositing material on substratesMCNC·Filed 1990·Granted May 12, 1992·136 cites·28 claims
- 0789US4018490AGas discharge display panel fabricationIBM·Filed 1975·Granted Apr 19, 1977·29 cites·19 claims
- 0889US3964942AChemical polishing of single crystal dielectricsIBM·Filed 1970·Granted Jun 22, 1976·38 cites·8 claims
- 0988US4232057ASemiconductor plasma oxidationIBM·Filed 1979·Granted Nov 4, 1980·51 cites·4 claims
- 1087US3974769AMethod and apparatus for recording information on a recording surface through the use of mistsIBM·Filed 1975·Granted Aug 17, 1976·39 cites·30 claims
- 1185US5037775AMethod for selectively depositing single elemental semiconductor material on substratesMCNC·Filed 1989·Granted Aug 6, 1991·68 cites·56 claims
- 1283US4774630AApparatus for mounting a semiconductor chip and making electrical connections theretoMICROELECTRONICS CENTER OF NOR·Filed 1985·Granted Sep 27, 1988·69 cites·20 claims
- 1383US4323589APlasma oxidationIBM·Filed 1980·Granted Apr 6, 1982·54 cites·14 claims
- 1481US4449580AVertical wall elevated pressure heat dissipation systemIBM·Filed 1981·Granted May 22, 1984·51 cites·15 claims
- 1579US4351805ASingle gas flow elevated pressure reactorIBM·Filed 1981·Granted Sep 28, 1982·20 cites·5 claims
- 1678US4364166ASemiconductor integrated circuit interconnectionsIBM·Filed 1981·Granted Dec 21, 1982·29 cites·4 claims
- 1775US4106975AProcess for etching holesIBM·Filed 1977·Granted Aug 15, 1978·26 cites·17 claims
- 1874US4155866AMethod of controlling silicon wafer etching rates-utilizing a diazine catalyzed etchantIBM·Filed 1978·Granted May 22, 1979·28 cites·12 claims
- 1973US5168078AMethod of making high density semiconductor structureMCNC·Filed 1990·Granted Dec 1, 1992·48 cites·43 claims
- 2072US4316209AMetal/silicon contact and methods of fabrication thereofIBM·Filed 1979·Granted Feb 16, 1982·19 cites·5 claims
- 2172US4123571AMethod for forming smooth self limiting and pin hole free SiC films on SiIBM·Filed 1977·Granted Oct 31, 1978·25 cites·12 claims
- 2270US4764644AMicroelectronics apparatusMICROELECTRONICS CENTER OF NOR·Filed 1987·Granted Aug 16, 1988·39 cites·9 claims
- 2368US5201995AAlternating cyclic pressure modulation process for selective area depositionMCNC·Filed 1992·Granted Apr 13, 1993·44 cites·29 claims
- 2468US5039625AMaximum areal density recessed oxide isolation (MADROX) processMCNC·Filed 1990·Granted Aug 13, 1991·33 cites·33 claims
- 2567US4187140AMethod for etching silicon and a residue and oxidation resistant etchant thereforIBM·Filed 1978·Granted Feb 5, 1980·22 cites·21 claims
- 2667US3961114AGlass compositionIBM·Filed 1974·Granted Jun 1, 1976·11 cites·1 claims
- 2766US5317938AMethod for making microstructural surgical instrumentsUNIV DUKE·Filed 1992·Granted Jun 7, 1994·122 cites·49 claims
- 2866US5098494ABonding of ceramic partsMCNC·Filed 1989·Granted Mar 24, 1992·17 cites·15 claims
- 2958US4576884AMethod and apparatus for exposing photoresist by using an electron beam and controlling its voltage and chargeMICROELECTRONICS CENTER OF NOR·Filed 1984·Granted Mar 18, 1986·16 cites·3 claims
- 3052US4667404AMethod of interconnecting wiring planesMICROELECTRONICS CENTER OF NOR·Filed 1985·Granted May 26, 1987·18 cites·14 claims
- 3151US6271150B1Methods of raising reflow temperature of glass alloys by thermal treatment in steam, and microelectronic structures formed therebyUNIV NORTH CAROLINA STATE·Filed 1998·Granted Aug 7, 2001·16 cites·44 claims
- 3248US5145714AMetal-organic chemical vapor deposition for repairing broken lines in microelectronic packagesMCNC·Filed 1990·Granted Sep 8, 1992·18 cites·19 claims
- 3347US5025304AHigh density semiconductor structure and method of making the sameMCNC·Filed 1988·Granted Jun 18, 1991·13 cites·3 claims
- 3434US5009360AMetal-to-metal bonding method and resulting structureMCNC·Filed 1990·Granted Apr 23, 1991·4 cites·11 claims
- 3534US2001048143A1Integrated circuits and microelectronic structures including one or more layers of germanium-containing glassFiled 2001·Application pending·0 cites
- 3633US4011060AMethod of controlling the softening point of solder glassIBM·Filed 1975·Granted Mar 8, 1977·6 cites·22 claims
- 3730US4065840AMethod for fabricating a DSDT targetIBM·Filed 1976·Granted Jan 3, 1978·0 cites·22 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →