Inventor · disambiguated record
Armin Saeedi Vahdat
Also filed as: SAEEDI VAHDAT ARMIN
12 granted patents·2 pending applications·28 citations·filing 2019–2022
85Inventor score
Top patents by PatentIndex Score
14 records- 0198US11227864B1Storage node after three-node access device formation for vertical three dimensional (3D) memoryMICRON TECHNOLOGY INC·Filed 2020·Granted Jan 18, 2022·12 cites·26 claims
- 0296US11289491B1Epitaxtal single crystalline silicon growth for a horizontal access deviceMICRON TECHNOLOGY INC·Filed 2020·Granted Mar 29, 2022·5 cites·29 claims
- 0396US11239117B1Replacement gate dielectric in three-node access device formation for vertical three dimensional (3D) memoryMICRON TECHNOLOGY INC·Filed 2020·Granted Feb 1, 2022·4 cites·20 claims
- 0493US11942361B2Semiconductor device cavity formation using directional depositionAPPLIED MATERIALS INC·Filed 2021·Granted Mar 26, 2024·2 cites·15 claims
- 0593US11476251B2Channel integration in a three-node access device for vertical three dimensional (3D) memoryMICRON TECHNOLOGY INC·Filed 2020·Granted Oct 18, 2022·3 cites·43 claims
- 0685US11329051B2Gate dielectric repair on three-node access device formation for vertical three-dimensional (3D) memoryMICRON TECHNOLOGY INC·Filed 2020·Granted May 10, 2022·2 cites·23 claims
- 0769US12279410B2Epitaxial single crystalline silicon growth for a horizontal access deviceMICRON TECHNOLOGY INC·Filed 2022·Granted Apr 15, 2025·0 cites·14 claims
- 0865US12369299B2Devices and methods for DRAM leakage reductionAPPLIED MATERIALS INC·Filed 2022·Granted Jul 22, 2025·0 cites·15 claims
- 0961US12096622B2Directional etch for improved dual deck three-dimensional NAND architecture marginAPPLIED MATERIALS INC·Filed 2021·Granted Sep 17, 2024·0 cites·10 claims
- 1059US11987879B2High aspect ratio taper improvement using directional depositionAPPLIED MATERIALS INC·Filed 2022·Granted May 21, 2024·0 cites·20 claims
- 1156US11778832B2Wordline contact formation in NAND devicesAPPLIED MATERIALS INC·Filed 2021·Granted Oct 3, 2023·0 cites·20 claims
- 1250US11127588B2Semiconductor processing applying supercritical dryingMICRON TECHNOLOGY INC·Filed 2019·Granted Sep 21, 2021·0 cites·25 claims
- 1346US2022045069A1Source/drain integration in a three-node access device for vertical three dimensional (3d) memoryMICRON TECHNOLOGY INC·Filed 2020·Application pending·0 cites
- 1446US2022045061A1Three-node access device for vertical three dimensional (3d) memoryMICRON TECHNOLOGY INC·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →