Inventor · disambiguated record
Arkalgud R. Sitaram
Also filed as: SITARAM ARKALGUD · SITARAM ARKALGUD R
74 granted patents·14 pending applications·1,794 citations·filing 1992–2025
99Inventor score
Files withINVENSAS CORP41ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC12MOTOROLA INC9TOKYO ELECTRON LTD8INVENSAS BONDING TECH INC7
Top patents by PatentIndex Score
88 records- 0199US12113056B2Stacked dies and methods for forming bonded structuresADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2022·Granted Oct 8, 2024·6 cites·53 claims
- 0299US11837596B2Stacked dies and methods for forming bonded structuresADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2022·Granted Dec 5, 2023·10 cites·35 claims
- 0399US11658173B2Stacked dies and methods for forming bonded structuresADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2020·Granted May 23, 2023·19 cites·27 claims
- 0499US10446456B2Integrated circuits protected by substrates with cavities, and methods of manufactureINVENSAS CORP·Filed 2018·Granted Oct 15, 2019·172 cites·8 claims
- 0599US10204893B2Stacked dies and methods for forming bonded structuresINVENSAS BONDING TECH INC·Filed 2016·Granted Feb 12, 2019·203 cites·30 claims
- 0698US12266650B2Stacked dies and methods for forming bonded structuresADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2023·Granted Apr 1, 2025·3 cites·19 claims
- 0798US12100684B2Bonded structuresADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2022·Granted Sep 24, 2024·3 cites·26 claims
- 0898US11670615B2Bonded structuresADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2020·Granted Jun 6, 2023·6 cites·23 claims
- 0998US11610846B2Protective elements for bonded structures including an obstructive elementADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2020·Granted Mar 21, 2023·9 cites·18 claims
- 1098US11056390B2Structures and methods for reliable packagesINVENSAS CORP·Filed 2019·Granted Jul 6, 2021·38 cites·22 claims
- 1198US10879226B2Stacked dies and methods for forming bonded structuresINVENSAS BONDING TECH INC·Filed 2019·Granted Dec 29, 2020·21 cites·24 claims
- 1298US10522499B2Bonded structuresINVENSAS BONDING TECH INC·Filed 2017·Granted Dec 31, 2019·137 cites·28 claims
- 1398US10002844B1Bonded structuresINVENSAS BONDING TECH INC·Filed 2016·Granted Jun 19, 2018·167 cites·20 claims
- 1498US9824974B2Integrated circuit assemblies with rigid layers used for protection against mechanical thinning and for other purposes, and methods of fabricating such assembliesINVENSAS CORP·Filed 2016·Granted Nov 21, 2017·54 cites·20 claims
- 1598US9741620B2Structures and methods for reliable packagesINVENSAS CORP·Filed 2015·Granted Aug 22, 2017·186 cites·20 claims
- 1698US9397038B1Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substratesINVENSAS CORP·Filed 2015·Granted Jul 19, 2016·27 cites·25 claims
- 1798US9355997B2Integrated circuit assemblies with reinforcement frames, and methods of manufactureINVENSAS CORP·Filed 2014·Granted May 31, 2016·53 cites·22 claims
- 1898US9252127B1Microelectronic assemblies with integrated circuits and interposers with cavities, and methods of manufactureINVENSAS CORP·Filed 2014·Granted Feb 2, 2016·53 cites·14 claims
- 1997US9741696B2Thermal vias disposed in a substrate proximate to a well thereofINVENSAS CORP·Filed 2016·Granted Aug 22, 2017·20 cites·13 claims
- 2096US9368479B2Thermal vias disposed in a substrate proximate to a well thereofINVENSAS CORP·Filed 2014·Granted Jun 14, 2016·23 cites·19 claims
- 2195US10546832B2Bonded structuresINVENSAS BONDING TECH INC·Filed 2018·Granted Jan 28, 2020·5 cites·20 claims
- 2294US10811388B2Capacitive coupling in a direct-bonded interface for microelectronic devicesINVENSAS CORP·Filed 2018·Granted Oct 20, 2020·6 cites·17 claims
- 2393US10879207B2Bonded structuresINVENSAS BONDING TECH INC·Filed 2019·Granted Dec 29, 2020·5 cites·21 claims
- 2493US9548273B2Integrated circuit assemblies with rigid layers used for protection against mechanical thinning and for other purposes, and methods of fabricating such assembliesINVENSAS CORP·Filed 2015·Granted Jan 17, 2017·10 cites·20 claims
- 2593US5352631AMethod for forming a transistor having silicided regionsMOTOROLA INC·Filed 1992·Granted Oct 4, 1994·172 cites·20 claims
- 2692US10879210B2Bonded structuresINVENSAS BONDING TECH INC·Filed 2019·Granted Dec 29, 2020·7 cites·28 claims
- 2792US10381326B2Structure and method for integrated circuits packaging with increased densityINVENSAS CORP·Filed 2014·Granted Aug 13, 2019·19 cites·5 claims
- 2891US9899281B2Integrated circuits protected by substrates with cavities, and methods of manufactureINVENSAS CORP·Filed 2016·Granted Feb 20, 2018·4 cites·17 claims
- 2991US9402312B2Circuit assemblies with multiple interposer substrates, and methods of fabricationINVENSAS CORP·Filed 2014·Granted Jul 26, 2016·11 cites·16 claims
- 3090US10600760B2Ultrathin layer for forming a capacitive interface between joined integrated circuit componentINVENSAS CORP·Filed 2018·Granted Mar 24, 2020·5 cites·20 claims
- 3189US9331043B1Localized sealing of interconnect structures in small gapsINVENSAS CORP·Filed 2015·Granted May 3, 2016·6 cites·20 claims
- 3288US2025079385A1Bonded structuresADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2024·Application pending·0 cites
- 3387US11495579B2Capacitive coupling in a direct-bonded interface for microelectronic devicesINVENSAS LLC·Filed 2020·Granted Nov 8, 2022·1 cites·12 claims
- 3487US10256177B2Integrated interposer solutions for 2D and 3D IC packagingINVENSAS CORP·Filed 2017·Granted Apr 9, 2019·4 cites·20 claims
- 3585US9536862B2Microelectronic assemblies with integrated circuits and interposers with cavities, and methods of manufactureINVENSAS CORP·Filed 2015·Granted Jan 3, 2017·4 cites·13 claims
- 3685US5441914AMethod of forming conductive interconnect structureMOTOROLA INC·Filed 1994·Granted Aug 15, 1995·79 cites·22 claims
- 3784US9502347B2Microelectronic assemblies formed using metal silicide, and methods of fabricationINVENSAS CORP·Filed 2015·Granted Nov 22, 2016·4 cites·21 claims
- 3883US9887166B2Integrated circuit assemblies with reinforcement frames, and methods of manufactureINVENSAS CORP·Filed 2016·Granted Feb 6, 2018·3 cites·18 claims
- 3983US2025266416A1Stacked dies and methods for forming bonded structuresADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2025·Application pending·0 cites
- 4081US12272673B2Capacitive coupling in a direct-bonded interface for microelectronic devicesADEIA SEMICONDUCTOR TECH LLC·Filed 2022·Granted Apr 8, 2025·0 cites·19 claims
- 4181US9865548B2Polymer member based interconnectINVENSAS CORP·Filed 2016·Granted Jan 9, 2018·3 cites·19 claims
- 4281US9373585B2Polymer member based interconnectINVENSAS CORP·Filed 2014·Granted Jun 21, 2016·4 cites·24 claims
- 4380US5872385AConductive interconnect structure and method of formationMOTOROLA INC·Filed 1996·Granted Feb 16, 1999·52 cites·28 claims
- 4479US2025349773A1Sealed bonded structures and methods for forming the sameADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2025·Application pending·0 cites
- 4577US5605865AMethod for forming self-aligned silicide in a semiconductor device using vapor phase reactionMOTOROLA INC·Filed 1995·Granted Feb 25, 1997·39 cites·16 claims
- 4675US12451439B2Bonded structure including an obstructive element directly bonded to a semiconductor element without an adhesiveADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2022·Granted Oct 21, 2025·0 cites·20 claims
- 4774US7068533B2Resistive memory cell configuration and method for sensing resistance valuesALTIS SEMICONDUCTOR SNC·Filed 2004·Granted Jun 27, 2006·21 cites·20 claims
- 4871US9691702B2Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substratesINVENSAS CORP·Filed 2016·Granted Jun 27, 2017·1 cites·20 claims
- 4971US5384285AProcess for fabricating a silicide layer in a semiconductor deviceMOTOROLA INC·Filed 1993·Granted Jan 24, 1995·31 cites·14 claims
- 5068US10032751B2Ultrathin layer for forming a capacitive interface between joined integrated circuit componentsINVENSAS CORP·Filed 2016·Granted Jul 24, 2018·1 cites·15 claims
Showing the top 50 of 88 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →