Inventor · disambiguated record
Asad Haider
Also filed as: HAIDER ASAD · HAIDER ASAD M · HAIDER ASAD MAHMOOD
22 granted patents·16 pending applications·223 citations·filing 1998–2023
95Inventor score
Top patents by PatentIndex Score
38 records- 0194US6803641B2MIM capacitors and methods for fabricating sameTEXAS INSTRUMENTS INC·Filed 2003·Granted Oct 12, 2004·100 cites·7 claims
- 0291US9337023B1Buffer stack for group IIIA-N devicesTEXAS INSTRUMENTS INC·Filed 2014·Granted May 10, 2016·9 cites·9 claims
- 0390US7960840B2Double wafer carrier process for creating integrated circuit die with through-silicon vias and micro-electro-mechanical systems protected by a hermetic cavity created at the wafer levelTEXAS INSTRUMENTS INC·Filed 2009·Granted Jun 14, 2011·26 cites·19 claims
- 0489US9583336B1Process to enable ferroelectric layers on large area substratesTEXAS INSTRUMENTS INC·Filed 2016·Granted Feb 28, 2017·8 cites·19 claims
- 0586US8907446B2Integrated circuit structure with capacitor and resistor and method for formingSUMMERFELT SCOTT R·Filed 2010·Granted Dec 9, 2014·9 cites·10 claims
- 0680US10251280B2Integrated circuit with micro inductor and micro transformer with magnetic coreTEXAS INSTRUMENTS INC·Filed 2014·Granted Apr 2, 2019·3 cites·4 claims
- 0778US7601629B2Semiconductive device fabricated using subliming materials to form interlevel dielectricsTEXAS INSTRUMENTS INC·Filed 2005·Granted Oct 13, 2009·8 cites·16 claims
- 0875US10529561B2Method of fabricating non-etch gas cooled epitaxial stack for group IIIA-N devicesTEXAS INSTRUMENTS INC·Filed 2015·Granted Jan 7, 2020·2 cites·15 claims
- 0975US6919233B2MIM capacitors and methods for fabricating sameTEXAS INSTRUMENTS INC·Filed 2002·Granted Jul 19, 2005·18 cites·31 claims
- 1074US9005698B2Piezoelectric thin film processHAIDER ASAD MAHMOOD·Filed 2011·Granted Apr 14, 2015·4 cites·11 claims
- 1172US7396755B2Process and integration scheme for a high sidewall coverage ultra-thin metal seed layerTEXAS INSTRUMENTS INC·Filed 2005·Granted Jul 8, 2008·5 cites·18 claims
- 1267US10349526B2Integrated circuit with micro inductor and micro transformer with magnetic coreTEXAS INSTRUMENTS INC·Filed 2019·Granted Jul 9, 2019·0 cites·20 claims
- 1367US7144802B2Vapor deposition of benzotriazole (BTA) for protecting copper interconnectsTEXAS INSTRUMENTS INC·Filed 2003·Granted Dec 5, 2006·11 cites·13 claims
- 1466US7332425B2Simultaneous deposition and etch process for barrier layer formation in microelectronic device interconnectsTEXAS INSTRUMENTS INC·Filed 2005·Granted Feb 19, 2008·2 cites·18 claims
- 1559US2025185263A1Robust ono films and methods of making thereofTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 1658US9847223B2Buffer stack for group IIIA-N devicesTEXAS INSTRUMENTS INC·Filed 2017·Granted Dec 19, 2017·0 cites·18 claims
- 1756US2025140560A1Integrated circuit (ic) with corrugated channel structureTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 1855US9590086B2Buffer stack for group IIIA-N devicesTEXAS INSTRUMENTS INC·Filed 2016·Granted Mar 7, 2017·0 cites·8 claims
- 1955US9112011B2FET dielectric reliability enhancementTEXAS INSTRUMENTS INC·Filed 2014·Granted Aug 18, 2015·0 cites·8 claims
- 2054US2024145293A1Merged trenches surrounded by wider trench for isolating semiconductor devicesTEXAS INSTRUMENTS INC·Filed 2022·Application pending·0 cites
- 2153US2024038580A1Locos or siblk to protect deep trench polysilicon in deep trench after sti processTEXAS INSTRUMENTS INC·Filed 2022·Application pending·0 cites
- 2253US2024038579A1Die size reduction and deep trench density increase using deep trench isolation after shallow trench isolation integrationTEXAS INSTRUMENTS INC·Filed 2022·Application pending·0 cites
- 2352US8916427B2FET dielectric reliability enhancementTEXAS INSTRUMENTS INC·Filed 2013·Granted Dec 23, 2014·0 cites·12 claims
- 2450US6069095AUltra-clean wafer chuck assembly for moisture-sensitive processes conducted in rapid thermal processorsTEXAS INSTRUMENTS INC·Filed 1998·Granted May 30, 2000·15 cites·17 claims
- 2548US10354858B2Process for forming PZT or PLZT thinfilms with low defectivityTEXAS INSTRUMENTS INC·Filed 2014·Granted Jul 16, 2019·0 cites·11 claims
- 2648US2013302965A1Method for forming integrated circuit structure with capacitor and resistor and method for formingTEXAS INSTRUMENTS INC·Filed 2013·Application pending·0 cites
- 2747US9728423B2Piezoelectric thin film processTEXAS INSTRUMENTS INC·Filed 2015·Granted Aug 8, 2017·0 cites·8 claims
- 2847US2006009030A1Novel barrier integration scheme for high-reliability viasTEXAS INSTRUMENTS INC·Filed 2005·Application pending·0 cites
- 2945US2011114597A1Barrier integration scheme for high-reliability viasTEXAS INSTRUMENTS INC·Filed 2010·Application pending·0 cites
- 3042US2008014739A1Silicon nitride/oxygen doped silicon carbide etch stop bi-layer for improved interconnect reliabilityTEXAS INSTRUMENTS INC·Filed 2006·Application pending·0 cites
- 3139US2019288089A9Methods for transistor epitaxial stack fabricationTEXAS INSTRUMENTS INC·Filed 2017·Application pending·0 cites
- 3238US6467490B1Process for using a high nitrogen concentration plasma for fluorine removal from a reactorTEXAS INSTRUMENTS INC·Filed 1999·Granted Oct 22, 2002·3 cites·22 claims
- 3338US2004157456A1Surface defect elimination using directed beam methodFiled 2004·Application pending·0 cites
- 3437US2006014378A1System and method to form improved seed layerAGGARWAL SANJEEV·Filed 2004·Application pending·0 cites
- 3537US2018358257A1Ic with trenches filled with essentially crack-free dielectricTEXAS INSTRUMENTS INC·Filed 2017·Application pending·0 cites
- 3637US2018358258A1Single mask level forming both top-side-contact and isolation trenchesTEXAS INSTRUMENTS INC·Filed 2017·Application pending·0 cites
- 3733US2002058409A1Elimination of overhang in liner/barrier/seed layers using post-deposition sputter etchFiled 2001·Application pending·0 cites
- 3832US2005233563A1Recess reduction for leakage improvement in high density capacitorsTEXAS INSTRUMENTS INC·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →