Inventor · disambiguated record
Asma Hajji
Also filed as: HAJJI ASMA
5 granted patents·5 pending applications·1 citations·filing 2017–2025
67Inventor score
Top patents by PatentIndex Score
10 records- 0184US2025070081A1Method for forming an electrical connection between an electronic chip and a carrier substrate and electronic deviceST MICROELECTRONICS GRENOBLE 2·Filed 2024·Application pending·0 cites
- 0277US12278155B2Integrated circuit package with heat sink and manufacturing method thereofST MICROELECTRONICS GRENOBLE 2·Filed 2021·Granted Apr 15, 2025·1 cites·18 claims
- 0377US12170262B2Method for forming an electrical connection between an electronic chip and a carrier substrate and electronic deviceST MICROELECTRONICS GRENOBLE 2·Filed 2022·Granted Dec 17, 2024·0 cites·10 claims
- 0466US11557566B2Method for forming an electrical connection between an electronic chip and a carrier substrate and electronic deviceST MICROELECTRONICS GRENOBLE 2·Filed 2020·Granted Jan 17, 2023·0 cites·14 claims
- 0561US10643970B2Method for forming an electrical connection between an electronic chip and a carrier substrate and electronic deviceST MICROELECTRONICS GRENOBLE 2·Filed 2019·Granted May 5, 2020·0 cites·5 claims
- 0660US2025218884A1Integrated circuit package with heat sink and manufacturing method thereofST MICROELECTRONICS GRENOBLE 2·Filed 2025·Application pending·0 cites
- 0757US2024391229A1Optical deviceST MICROELECTRONICS INT NV·Filed 2024·Application pending·0 cites
- 0854US10224306B2Method for forming an electrical connection between an electronic chip and a carrier substrate and electronic deviceST MICROELECTRONICS GRENOBLE 2·Filed 2017·Granted Mar 5, 2019·0 cites·6 claims
- 0949US2023318165A1Electronic deviceST MICROELECTRONICS GRENOBLE 2·Filed 2023·Application pending·0 cites
- 1038US2020196433A1Method for mounting componentST MICROELECTRONICS GRENOBLE 2·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →