Inventor · disambiguated record
Asahi Nomoto
Also filed as: NOMOTO ASAHI
4 granted patents·11 pending applications·12 citations·filing 2019–2025
64Inventor score
Top patents by PatentIndex Score
15 records- 0194US11881407B2Processed wafer and method of manufacturing chip formation waferDENSO CORP·Filed 2021·Granted Jan 23, 2024·10 cites·5 claims
- 0290US11901231B2Separation method of waferDISCO CORP·Filed 2021·Granted Feb 13, 2024·2 cites·18 claims
- 0369US2025001520A1Laser processing methodDISCO CORP·Filed 2024·Application pending·0 cites
- 0465US2024308893A1Water refining apparatus and method of manufacturing waferDISCO CORP·Filed 2024·Application pending·0 cites
- 0564US2024269768A1Wafer manufacturing methodDISCO CORP·Filed 2024·Application pending·0 cites
- 0663US2024149379A1Manufacturing method of gallium nitride substrateDISCO CORP·Filed 2023·Application pending·0 cites
- 0761US2024326175A1Wafer thinning methodDISCO CORP·Filed 2024·Application pending·0 cites
- 0858US2025187230A1Manufacturing method of waferDISCO CORP·Filed 2024·Application pending·0 cites
- 0954US2023321871A1Wafer manufacturing methodDISCO CORP·Filed 2023·Application pending·0 cites
- 1052US2021323098A1Wafer production methodDISCO CORP·Filed 2021·Application pending·0 cites
- 1151US2024009773A1Manufacturing method of substrateDISCO CORP·Filed 2023·Application pending·0 cites
- 1251US2025297405A1Method for manufacturing gallium nitride substrateDISCO CORP·Filed 2025·Application pending·0 cites
- 1351US2023398640A1Manufacturing method of waferDISCO CORP·Filed 2023·Application pending·0 cites
- 1450US12427604B2Processing method and processing apparatus for ingotDISCO CORP·Filed 2022·Granted Sep 30, 2025·0 cites·3 claims
- 1543US10950462B2Diamond substrate producing methodDISCO CORP·Filed 2019·Granted Mar 16, 2021·0 cites·2 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →