Inventor · disambiguated record
Atsuo Ikeda
Also filed as: IKEDA ATSUO
12 granted patents·151 citations·filing 1979–2021
89Inventor score
Top patents by PatentIndex Score
12 records- 0197US8653668B2Copper bonding wire for semiconductor device and bonding structure thereofUNO TOMOHIRO·Filed 2011·Granted Feb 18, 2014·51 cites·14 claims
- 0296US8836147B2Bonding structure of multilayer copper bonding wireUNO TOMOHIRO·Filed 2011·Granted Sep 16, 2014·44 cites·29 claims
- 0380US10069445B2Motor controller and method for controlling motorYASKAWA ELECTRIC CORP·Filed 2015·Granted Sep 4, 2018·2 cites·22 claims
- 0469US4661943AOptical data readerPIONEER ELECTRONIC CORP·Filed 1985·Granted Apr 28, 1987·17 cites·6 claims
- 0561US9331049B2Bonding structure of bonding wireUNO TOMOHIRO·Filed 2009·Granted May 3, 2016·2 cites·15 claims
- 0657US4404671ALinear drive motor control systemPIONEER ELECTRONIC CORP·Filed 1980·Granted Sep 13, 1983·9 cites·6 claims
- 0753US4259602AElectromagnetic linear-motion devicePIONEER ELECTRONIC CORP·Filed 1979·Granted Mar 31, 1981·12 cites·4 claims
- 0851US11718433B2Bag supply system and bag supply methodYASKAWA ELECTRIC CORP·Filed 2021·Granted Aug 8, 2023·0 cites·13 claims
- 0950US8097960B2Semiconductor mounting bonding wireTERASHIMA SHINICHI·Filed 2008·Granted Jan 17, 2012·0 cites·17 claims
- 1050US4323997ALinear-tracking pick-up arm drive assemblyPIONEER ELECTRONIC CORP·Filed 1980·Granted Apr 6, 1982·14 cites·5 claims
- 1145US11591118B2Layered food packaging system, temporary placement apparatus, and carrier deviceYASKAWA ELECTRIC CORP·Filed 2021·Granted Feb 28, 2023·0 cites·4 claims
- 1230US4580257ADual drive system for phono pickup armPIONEER ELECTRONIC CORP·Filed 1983·Granted Apr 1, 1986·0 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →