Inventor · disambiguated record
Atsushi Kinase
Also filed as: KINASE ATSUSHI
12 granted patents·1 pending application·127 citations·filing 1989–2019
89Inventor score
Top patents by PatentIndex Score
13 records- 0186US8038267B2Droplet jetting applicator and method for manufacturing coated bodyTOSHIBA KK·Filed 2008·Granted Oct 18, 2011·11 cites·10 claims
- 0284US9553003B2Substrate processing device and substrate processing methodSHIBAURA MECHATRONICS CORP·Filed 2014·Granted Jan 24, 2017·6 cites·9 claims
- 0380US6045315ARobot apparatus and treating apparatusSHIBAURA ENG WORKS LTD·Filed 1998·Granted Apr 4, 2000·80 cites·6 claims
- 0476US7314264B2Ink jet application device and ink jet application methodTOSHIBA KK·Filed 2005·Granted Jan 1, 2008·5 cites·4 claims
- 0570US7677691B2Droplet jetting applicator and method of manufacturing coated bodyTOSHIBA KK·Filed 2006·Granted Mar 16, 2010·3 cites·6 claims
- 0669US9607865B2Substrate processing device and substrate processing methodSHIBAURA MECHATRONICS CORP·Filed 2014·Granted Mar 28, 2017·2 cites·7 claims
- 0766US8007861B2Ink jet applicatorTOSHIBA KK·Filed 2008·Granted Aug 30, 2011·2 cites·4 claims
- 0865US7481512B2Ink jet applicatorTOSHIBA KK·Filed 2005·Granted Jan 27, 2009·2 cites·3 claims
- 0964US7921801B2Droplet jetting applicator and method for manufacturing coated bodyTOSHIBA KK·Filed 2006·Granted Apr 12, 2011·1 cites·4 claims
- 1057US5036836ALithotripter with shock-wave generator movement mechanismTOSHIBA KK·Filed 1989·Granted Aug 6, 1991·15 cites·8 claims
- 1156US11193850B2Heater pipe gas leak detecting device and heater pipe gas leak detecting methodSHIBAURA MECHATRONICS CORP·Filed 2019·Granted Dec 7, 2021·0 cites·15 claims
- 1244US10276406B2Substrate processing device and substrate processing methodSHIBAURA MECHATRONICS CORP·Filed 2014·Granted Apr 30, 2019·0 cites·12 claims
- 1337US2007200903A1Droplet jetting applicator and method for manufacturing coated bodyTOSHIBA KK·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →