Inventor · disambiguated record
Atila Mertol
Also filed as: MERTOL ATILA
15 granted patents·2 pending applications·1,488 citations·filing 1997–2012
96Inventor score
Top patents by PatentIndex Score
17 records- 0195US6011304AStiffener ring attachment with holes and removable snap-in heat sink or heat spreader/lidLSI LOGIC CORP·Filed 1997·Granted Jan 4, 2000·210 cites·19 claims
- 0295US5909056AHigh performance heat spreader for flip chip packagesLSI LOGIC CORP·Filed 1997·Granted Jun 1, 1999·223 cites·1 claims
- 0395US5907189AConformal diamond coating for thermal improvement of electronic packagesLSI LOGIC CORP·Filed 1997·Granted May 25, 1999·232 cites·7 claims
- 0495US5866943ASystem and method for forming a grid array device package employing electomagnetic shieldingLSI LOGIC CORP·Filed 1997·Granted Feb 2, 1999·201 cites·12 claims
- 0593US6008536AGrid array device package including advanced heat transfer mechanismsLSI LOGIC CORP·Filed 1997·Granted Dec 28, 1999·163 cites·16 claims
- 0692US6114761AThermally-enhanced flip chip IC package with extruded heatspreaderLSI LOGIC CORP·Filed 1998·Granted Sep 5, 2000·152 cites·10 claims
- 0791US7787252B2Preferentially cooled electronic deviceLSI CORP·Filed 2008·Granted Aug 31, 2010·23 cites·20 claims
- 0890US5940271AStiffener with integrated heat sink attachmentLSI LOGIC CORP·Filed 1997·Granted Aug 17, 1999·115 cites·7 claims
- 0977US5834839APreserving clearance between encapsulant and PCB for cavity-down single-tier package assemblyLSI LOGIC CORP·Filed 1997·Granted Nov 10, 1998·53 cites·14 claims
- 1068US5898571AApparatus and method for clip-on attachment of heat sinks to encapsulated semiconductor packagesLSI LOGIC CORP·Filed 1997·Granted Apr 27, 1999·35 cites·11 claims
- 1166US6818996B2Multi-level redistribution layer traces for reducing current crowding in flipchip solder bumpsLSI LOGIC CORP·Filed 2002·Granted Nov 16, 2004·12 cites·18 claims
- 1266US6069027AFixture for lid-attachment for encapsulated packagesLSI LOGIC CORP·Filed 1997·Granted May 30, 2000·35 cites·6 claims
- 1363US7065721B2Optimized bond out method for flip chip wafersLSI LOGIC CORP·Filed 2004·Granted Jun 20, 2006·13 cites·25 claims
- 1459US8946871B2Thermal improvement of integrated circuit packagesLSI CORP·Filed 2012·Granted Feb 3, 2015·1 cites·20 claims
- 1555US5977622AStiffener with slots for clip-on heat sink attachmentLSI LOGIC CORP·Filed 1997·Granted Nov 2, 1999·20 cites·2 claims
- 1646US2009030660A1Method and apparatus for generating fully detailed three-dimensional electronic package and pcb board modelsLSI LOGIC CORP·Filed 2007·Application pending·0 cites
- 1739US2005017368A1Multi-level redistribution layer traces for reducing current crowding in flipchip solder bumpsFiled 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →