Inventor · disambiguated record
Atsushi Miki
Also filed as: MIKI ATSUSHI
63 granted patents·15 pending applications·1,445 citations·filing 1984–2023
98Inventor score
Files withJX NIPPON MINING & METALS CORP22FUJITSU LTD16SUMITOMO ELECTRIC INDUSTRIES15NIPPON SHEET GLASS CO LTD5ARAI HIDETA4
Top patents by PatentIndex Score
78 records- 0199US5214308ASubstrate for packaging a semiconductor deviceSUMITOMO ELECTRIC INDUSTRIES·Filed 1991·Granted May 25, 1993·473 cites·21 claims
- 0298US11124450B2Glass panel and glass windowNIPPON SHEET GLASS CO LTD·Filed 2018·Granted Sep 21, 2021·61 cites·10 claims
- 0398US5196726ASubstrate for packaging a semiconductor device having particular terminal and bump structureSUMITOMO ELECTRIC INDUSTRIES·Filed 1991·Granted Mar 23, 1993·280 cites·15 claims
- 0493US7406198B2Image capture apparatusFUJITSU LTD·Filed 2004·Granted Jul 29, 2008·133 cites·19 claims
- 0590US10925171B2Surface treated copper foil, surface treated copper foil with resin layer, copper foil with carrier, laminate, method for manufacturing printed wiring board, heat dissipation substrate, and method for manufacturing electronic deviceJX NIPPON MINING & METALS CORP·Filed 2018·Granted Feb 16, 2021·3 cites·22 claims
- 0690USD837685SEyeletMORITO CO LTD·Filed 2016·Granted Jan 8, 2019·34 cites·1 claims
- 0790US9060431B2Liquid crystal polymer copper-clad laminate and copper foil used for said laminateARAI HIDETA·Filed 2012·Granted Jun 16, 2015·7 cites·34 claims
- 0890US8252166B2Method of roughening rolled copper or copper alloy foilKOBAYASHI YOUSUKE·Filed 2011·Granted Aug 28, 2012·5 cites·24 claims
- 0989US9724896B2Copper heat dissipation material, carrier-attached copper foil, connector, terminal, laminate, shield material, printed-wiring board, metal processed member, electronic device and method for manufacturing the printed wiring boardJX NIPPON MINING & METALS CORP·Filed 2015·Granted Aug 8, 2017·8 cites·21 claims
- 1089US8449987B2Rolled copper or copper alloy foil with roughened surface and method of roughening rolled copper or copper alloy foilKOBAYASHI YOUSUKE·Filed 2007·Granted May 28, 2013·8 cites·10 claims
- 1180US11337314B2Surface treated copper foil, copper clad laminate, and printed circuit boardJX NIPPON MINING & METALS CORP·Filed 2019·Granted May 17, 2022·0 cites·20 claims
- 1279US11375624B2Surface treated copper foil, copper clad laminate, and printed circuit boardJX NIPPON MINING & METALS CORP·Filed 2019·Granted Jun 28, 2022·1 cites·19 claims
- 1379US10581555B2Information processing device and burst error reproducing methodFUJITSU LTD·Filed 2018·Granted Mar 3, 2020·2 cites·18 claims
- 1478US9504149B2Surface treated copper foil and laminate using the sameJX NIPPON MINING & METALS CORP·Filed 2013·Granted Nov 22, 2016·3 cites·19 claims
- 1577US11382217B2Surface treated copper foil, copper clad laminate, and printed circuit boardJX NIPPON MINING & METALS CORP·Filed 2019·Granted Jul 5, 2022·0 cites·18 claims
- 1677US11337315B2Surface treated copper foil, copper clad laminate, and printed circuit boardJX NIPPON MINING & METALS CORP·Filed 2019·Granted May 17, 2022·0 cites·8 claims
- 1777US5298460ASubstrate for packaging a semiconductor deviceSUMITOMO ELECTRIC INDUSTRIES·Filed 1992·Granted Mar 29, 1994·47 cites·6 claims
- 1876US6805494B2Optical module and optical deviceSUMITOMO ELECTRIC INDUSTRIES·Filed 2002·Granted Oct 19, 2004·13 cites·28 claims
- 1975US7415202B2Image taking device, method for controlling light sources and computer programFUJITSU LTD·Filed 2005·Granted Aug 19, 2008·11 cites·16 claims
- 2075US7340159B2Image taking device and personal identification systemFUJITSU LTD·Filed 2005·Granted Mar 4, 2008·12 cites·4 claims
- 2175US5302854APackaging structure of a semiconductor deviceSUMITOMO ELECTRIC INDUSTRIES·Filed 1991·Granted Apr 12, 1994·42 cites·17 claims
- 2272US6400011B1Semiconductor laser moduleSUMITOMO ELECTRIC INDUSTRIES·Filed 1995·Granted Jun 4, 2002·36 cites·4 claims
- 2372US5401099AMethod of measuring junction temperatureSUMITOMO ELECTRIC INDUSTRIES·Filed 1992·Granted Mar 28, 1995·54 cites·3 claims
- 2469US5212880AApparatus for packaging a semiconductor deviceSUMITOMO ELECTRIC INDUSTRIES·Filed 1991·Granted May 25, 1993·41 cites·5 claims
- 2568US10464291B2Copper heat dissipation material, carrier-attached copper foil, connector, terminal, laminate, shield material, printed-wiring board, metal processed member, electronic device and method for manufacturing the printed wiring boardJX NIPPON MINING & METALS CORP·Filed 2017·Granted Nov 5, 2019·1 cites·24 claims
- 2667US10472728B2Copper foil for printed circuitJX NIPPON MINING & METALS CORP·Filed 2016·Granted Nov 12, 2019·0 cites·26 claims
- 2767US10476391B2Voltage converting deviceAUTONETWORKS TECHNOLOGIES LTD·Filed 2017·Granted Nov 12, 2019·1 cites·15 claims
- 2864US6094515AOptical moduleSUMITOMO ELECTRIC INDUSTRIES·Filed 1998·Granted Jul 25, 2000·30 cites·13 claims
- 2963US10383222B2Surface-treated copper foilJX NIPPON MINING & METALS CORP·Filed 2017·Granted Aug 13, 2019·0 cites·38 claims
- 3061US7522824B2Photographing apparatus photographing method and computer programFUJITSU LTD·Filed 2003·Granted Apr 21, 2009·4 cites·16 claims
- 3160US10529992B2Surface-treated copper foil, and current collector, electrode, and battery cell using the surface-treated copper foilJX NIPPON MINING & METALS CORP·Filed 2018·Granted Jan 7, 2020·0 cites·16 claims
- 3260US9049795B2Rolled copper or copper-alloy foil provided with roughened surfaceARAI HIDETA·Filed 2012·Granted Jun 2, 2015·0 cites·17 claims
- 3357US11637566B2Storage device and control method for storage deviceFUJITSU LTD·Filed 2022·Granted Apr 25, 2023·0 cites·6 claims
- 3457US5153892AHigh-pressure gas laser apparatus and method of laser processingHITACHI LTD·Filed 1991·Granted Oct 6, 1992·17 cites·50 claims
- 3557US5092033AMethod for packaging semiconductor deviceSUMITOMO ELECTRIC INDUSTRIES·Filed 1991·Granted Mar 3, 1992·21 cites·7 claims
- 3657US2024426168A1Double-pane glass panelNIPPON SHEET GLASS CO LTD·Filed 2023·Application pending·0 cites
- 3756US5262355AMethod for packaging a semiconductor deviceSUMITOMO ELECTRIC INDUSTRIES·Filed 1993·Granted Nov 16, 1993·26 cites·5 claims
- 3853US10925170B2Surface treated copper foil, surface treated copper foil with resin layer, copper foil with carrier, laminate, method for manufacturing printed wiring board, and method for manufacturing electronic deviceJX NIPPON MINING & METALS CORP·Filed 2018·Granted Feb 16, 2021·0 cites·25 claims
- 3953US9730332B2Surface treated copper foil and laminate using the same, printed wiring board, and copper clad laminateJX NIPPON MINING & METALS CORP·Filed 2013·Granted Aug 8, 2017·0 cites·20 claims
- 4052US11279653B2Method for manufacturing glass panel, and glass panelNIPPON SHEET GLASS CO LTD·Filed 2018·Granted Mar 22, 2022·0 cites·6 claims
- 4152US10820414B2Surface treated copper foil, copper foil with carrier, laminate, method for manufacturing printed wiring board, and method for manufacturing electronic deviceJX NIPPON MINING & METALS CORP·Filed 2017·Granted Oct 27, 2020·0 cites·24 claims
- 4252US9580829B2Copper foil for printed circuitARAI HIDETA·Filed 2011·Granted Feb 28, 2017·0 cites·20 claims
- 4352US2024301745A1Depressurized multilayered glass panelNIPPON SHEET GLASS CO LTD·Filed 2022·Application pending·0 cites
- 4451US10791631B2Surface treated copper foil, copper foil with carrier, laminate, method for manufacturing printed wiring board, and method for manufacturing electronic deviceJX NIPPON MINING & METALS CORP·Filed 2017·Granted Sep 29, 2020·0 cites·25 claims
- 4551US9232650B2Surface treated copper foil and laminate using the sameJX NIPPON MINING & METALS CORP·Filed 2013·Granted Jan 5, 2016·0 cites·12 claims
- 4650US10992378B2Information processing apparatus and optical fiber inspection methodFUJITSU LTD·Filed 2019·Granted Apr 27, 2021·0 cites·9 claims
- 4750US10194534B2Printed wiring board, electronic device, catheter, and metallic materialJX NIPPON MINING & METALS CORP·Filed 2017·Granted Jan 29, 2019·0 cites·20 claims
- 4850US5348214AMethod of mounting semiconductor elementsSUMITOMO ELECTRIC INDUSTRIES·Filed 1993·Granted Sep 20, 1994·15 cites·2 claims
- 4949US5165791AMethod and apparatus for measuring temperature based on infrared lightSUMITOMO ELECTRIC INDUSTRIES·Filed 1991·Granted Nov 24, 1992·14 cites·13 claims
- 5049US2012276412A1Surface-Treated Copper FoilMIKI ATSUSHI·Filed 2010·Application pending·0 cites
Showing the top 50 of 78 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →