Inventor · disambiguated record
Atsushi Moriya
Also filed as: MORIYA ATSUSHI
34 granted patents·22 pending applications·577 citations·filing 1987–2025
96Inventor score
Files withHITACHI INT ELECTRIC INC26KOKUSAI ELECTRIC CORP9MORIYA ATSUSHI5NEC CORP4ISHIBASHI KIYOHISA2
Top patents by PatentIndex Score
56 records- 0196US6503079B2Substrate processing apparatus and method for manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2002·Granted Jan 7, 2003·478 cites·18 claims
- 0288US9255011B2Method for producing lithium carbonateKAWATA MASANOBU·Filed 2012·Granted Feb 9, 2016·24 cites·8 claims
- 0387US9412587B2Method of manufacturing semiconductor device, substrate processing apparatus, gas supply system, and recording mediumHITACHI INT ELECTRIC INC·Filed 2015·Granted Aug 9, 2016·4 cites·19 claims
- 0482US8071477B2Method of manufacturing semiconductor device and substrate processing apparatusMORIYA ATSUSHI·Filed 2009·Granted Dec 6, 2011·6 cites·5 claims
- 0581US9691609B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2016·Granted Jun 27, 2017·2 cites·20 claims
- 0679US10529560B2Method of manufacturing semiconductor device, substrate processing apparatus and recording mediumHITACHI INT ELECTRIC INC·Filed 2018·Granted Jan 7, 2020·3 cites·20 claims
- 0778US4740290AProcess for thermal cracking of heavy oilTOYO ENGINEERING CORP·Filed 1987·Granted Apr 26, 1988·27 cites·20 claims
- 0875US9941119B2Method of forming silicon layer in manufacturing semiconductor device and recording mediumHITACHI INT ELECTRIC INC·Filed 2017·Granted Apr 10, 2018·1 cites·18 claims
- 0974US6872636B2Method for fabricating a semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2002·Granted Mar 29, 2005·13 cites·10 claims
- 1073US8293646B2Semiconductor device manufacturing method and substrate processing apparatusOZAKI TAKASHI·Filed 2005·Granted Oct 23, 2012·4 cites·13 claims
- 1172US8025739B2Method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2009·Granted Sep 27, 2011·1 cites·2 claims
- 1270US11017218B2Suspicious person detection device, suspicious person detection method, and programNEC CORP·Filed 2017·Granted May 25, 2021·1 cites·10 claims
- 1370US9997354B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2017·Granted Jun 12, 2018·1 cites·14 claims
- 1468US10090152B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2017·Granted Oct 2, 2018·1 cites·9 claims
- 1567US8466049B2Semiconductor device producing method with selective epitaxial growthINOKUCHI YASUHIRO·Filed 2006·Granted Jun 18, 2013·4 cites·11 claims
- 1665US12435439B2Substrate processing method, method of manufacturing semiconductor device, non-transitory computer-readable recording medium and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2023·Granted Oct 7, 2025·0 cites·20 claims
- 1762US8790463B2Substrate processing apparatus and semiconductor device producing methodMORIYA ATSUSHI·Filed 2005·Granted Jul 29, 2014·2 cites·2 claims
- 1862US2024404802A1Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 1961US8012885B2Manufacturing method of semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2008·Granted Sep 6, 2011·1 cites·8 claims
- 2061US2025105007A1Substrate processing method, method of manufacturing semiconductor device, recording medium, and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 2161US2011199486A1Customer behavior recording device, customer behavior recording method, and recording mediumNEC CORP·Filed 2009·Application pending·0 cites
- 2258US8497192B2Method of manufacturing a semiconductor device and substrate processing apparatusISHIBASHI KIYOHISA·Filed 2011·Granted Jul 30, 2013·1 cites·11 claims
- 2358US2011264534A1Behavioral analysis device, behavioral analysis method, and recording mediumMORIYA ATSUSHI·Filed 2009·Application pending·0 cites
- 2458US2024093372A1Substrate processing apparatus, method of processing substrate, method of manufacturing semiconductor device, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2023·Application pending·0 cites
- 2557US2024093370A1Substrate processing method, method of manufacturing semiconductor device, non-transitory computer-readable recording medium and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2023·Application pending·0 cites
- 2657US2010313214A1Display system, system for measuring display effect, display method, method for measuring display effect, and recording mediumMORIYA ATSUSHI·Filed 2009·Application pending·0 cites
- 2756US9540728B2Substrate processing apparatus, apparatus for manufacturing semiconductor device, and gas supply systemHITACHI INT ELECTRIC INC·Filed 2016·Granted Jan 10, 2017·0 cites·20 claims
- 2855US11164744B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2019·Granted Nov 2, 2021·0 cites·18 claims
- 2953US11915852B2Electronic componentTDK CORP·Filed 2020·Granted Feb 27, 2024·0 cites·10 claims
- 3053US2025188597A1Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 3152US10262857B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2017·Granted Apr 16, 2019·0 cites·9 claims
- 3252US2011226418A1Method of manufacturing semiconductor deviceISHIBASHI KIYOHISA·Filed 2011·Application pending·0 cites
- 3351US7851379B2Substrate processing method and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2009·Granted Dec 14, 2010·0 cites·8 claims
- 3451US6949474B2Method of manufacturing a semiconductor device and a semiconductor manufacture systemHITACHI INT ELECTRIC INC·Filed 2003·Granted Sep 27, 2005·3 cites·10 claims
- 3550US2013305991A1Substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2013·Application pending·0 cites
- 3650US2011196745A1Electronic advertisement system, electronic advertisement distribution apparatus, electronic advertisement distribution method, and recording mediumMORIYA ATSUSHI·Filed 2009·Application pending·0 cites
- 3747US11581200B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2020·Granted Feb 14, 2023·0 cites·17 claims
- 3847US11043392B2Method of manufacturing semiconductor device, substrate processing apparatus and recording mediumKOKUSAI ELECTRIC CORP·Filed 2019·Granted Jun 22, 2021·0 cites·17 claims
- 3947US2009253265A1Method for fabricating semiconductor device and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2008·Application pending·0 cites
- 4047US2008199610A1Substrate processing apparatus, and substrate processing methodHITACHI INT ELECTRIC INC·Filed 2008·Application pending·0 cites
- 4147US2010058984A1Substrate Processing ApparatusMARUBAYASHI TETSUYA·Filed 2009·Application pending·0 cites
- 4245US10163910B2Method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2017·Granted Dec 25, 2018·0 cites·13 claims
- 4345US10035710B2Method for producing lithium carbonateKAWATA MASANOBU·Filed 2016·Granted Jul 31, 2018·0 cites·6 claims
- 4444US10262872B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2017·Granted Apr 16, 2019·0 cites·17 claims
- 4544US10114936B2Information processing device, authentication system, authentication method, and programNEC CORP·Filed 2014·Granted Oct 30, 2018·0 cites·18 claims
- 4644US10090322B2Method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2017·Granted Oct 2, 2018·0 cites·8 claims
- 4743US2016243669A1Clamp jig and method of polishing workpieceHITACHI INFORMATION & TELECOMMUNICATION ENG LTD·Filed 2016·Application pending·0 cites
- 4842US10134584B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2016·Granted Nov 20, 2018·0 cites·12 claims
- 4942US2015147873A1Method of manufacturing semiconductor device, substrate processing apparatus, and non-transitory computer-readable storage mediumHITACHI INT ELECTRIC INC·Filed 2014·Application pending·0 cites
- 5042US2016126337A1Substrate processing apparatus, semiconductor device manufacturing method, and substrate processing methodHITACHI INT ELECTRIC INC·Filed 2014·Application pending·0 cites
Showing the top 50 of 56 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →