Inventor · disambiguated record
Atsuro Seino
Also filed as: SEINO ATSURO
19 granted patents·8 pending applications·9 citations·filing 2014–2025
89Inventor score
Top patents by PatentIndex Score
27 records- 0187US9508555B2Method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2014·Granted Nov 29, 2016·8 cites·8 claims
- 0284US12451360B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2024·Granted Oct 21, 2025·0 cites·19 claims
- 0382US2025389026A1Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 0481US2024267705A1Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 0579US11915938B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2022·Granted Feb 27, 2024·0 cites·17 claims
- 0675US12148621B2Method of processing substrate, method of manufacturing semiconductor device, recording medium, and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2023·Granted Nov 19, 2024·0 cites·19 claims
- 0774US12084757B2Method of manufacturing semiconductor device, substrate processing apparatus, method of processing substrate, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2022·Granted Sep 10, 2024·0 cites·17 claims
- 0874US11538688B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2020·Granted Dec 27, 2022·0 cites·20 claims
- 0972US2025069898A1Method of processing substrate, method of manufacturing semiconductor device, recording medium, and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 1071US11967500B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2020·Granted Apr 23, 2024·0 cites·20 claims
- 1171US10410870B2Method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2018·Granted Sep 10, 2019·1 cites·19 claims
- 1270US11424127B2Method of manufacturing semiconductor device, substrate processing apparatus, method of processing substrate, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2021·Granted Aug 23, 2022·0 cites·18 claims
- 1369US12170206B2Method of processing substrate, method of manufacturing semiconductor device, recording medium, and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2022·Granted Dec 17, 2024·0 cites·9 claims
- 1468US12421609B2Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2022·Granted Sep 23, 2025·0 cites·16 claims
- 1564US11621169B2Method of manufacturing semiconductor device, recording medium, and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2021·Granted Apr 4, 2023·0 cites·16 claims
- 1663US12084760B2Method of processing substrate, recording medium, substrate processing apparatus, and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2023·Granted Sep 10, 2024·0 cites·16 claims
- 1762US10734218B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2018·Granted Aug 4, 2020·0 cites·10 claims
- 1862US2025011929A1Substrate processing apparatus, substrate processing method, method of manufacturing semiconductor device and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 1959US12463031B2Method of processing substrate, recording medium, and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2021·Granted Nov 4, 2025·0 cites·16 claims
- 2059US2024332024A1Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 2157US2023335404A1Substrate processing method, non-transitory computer-readable recording medium, substrate processing apparatus and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2023·Application pending·0 cites
- 2256US2025215564A1Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 2356US2023295800A1Method of processing substrate, method of manufacturing semiconductor device, recording medium and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2023·Application pending·0 cites
- 2452US9972500B2Method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2016·Granted May 15, 2018·0 cites·6 claims
- 2546US9966268B2Method of manufacturing semiconductor device and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2014·Granted May 8, 2018·0 cites·11 claims
- 2640US9653351B2Method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2016·Granted May 16, 2017·0 cites·6 claims
- 2739US9970107B2Method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2017·Granted May 15, 2018·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →