Inventor · disambiguated record
Atsushi Yabe
Also filed as: YABE ATSUSHI
12 granted patents·4 pending applications·25 citations·filing 2000–2011
85Inventor score
Top patents by PatentIndex Score
16 records- 0180US7968150B2Method of surface treatment using imidazole compoundNIPPON MINING CO·Filed 2008·Granted Jun 28, 2011·2 cites·2 claims
- 0274US8537708B2Packet transmission method and nodesYABE ATSUSHI·Filed 2011·Granted Sep 17, 2013·7 cites·11 claims
- 0369US7179741B2Electroless plating method and semiconductor wafer on which metal plating layer is formedNIKKO MATERIALS CO LTD·Filed 2003·Granted Feb 20, 2007·9 cites·16 claims
- 0461US8283051B2Plated product having copper thin film formed thereon by electroless platingITO JUNICHI·Filed 2009·Granted Oct 9, 2012·1 cites·5 claims
- 0560US7867564B2Metal plating method and pretreatment agentNIPPON MINING CO·Filed 2003·Granted Jan 11, 2011·4 cites·7 claims
- 0649US8736057B2Substrate and manufacturing method thereforITO JUNICHI·Filed 2008·Granted May 27, 2014·0 cites·8 claims
- 0749US8247301B2Substrate and manufacturing method thereforITO JUNICHI·Filed 2008·Granted Aug 21, 2012·0 cites·9 claims
- 0849US8182873B2Method for electroless plating and metal-plated articleIMORI TORU·Filed 2004·Granted May 22, 2012·2 cites·14 claims
- 0945US8394508B2Plated article having metal thin film formed by electroless platingYABE ATSUSHI·Filed 2008·Granted Mar 12, 2013·0 cites·10 claims
- 1045US8163400B2Plated article having metal thin film formed by electroless plating, and manufacturing method thereofYABE ATSUSHI·Filed 2008·Granted Apr 24, 2012·0 cites·22 claims
- 1145US2006135584A1Novel imidazole alcohol compound, process for producing the same, and surface-treating agent comprising the sameIMORI TORU·Filed 2003·Application pending·0 cites
- 1244US2008224313A1Method for forming a seed layer for damascene copper wiring, and semiconductor wafer with damascene copper wiring formed using the methodYABE ATSUSHI·Filed 2008·Application pending·0 cites
- 1342US8521098B2Receiving apparatus, transmitting apparatus, receiving method, transmitting method, communications system, and communication methodYABE ATSUSHI·Filed 2011·Granted Aug 27, 2013·0 cites·15 claims
- 1441US8404035B2Electroless copper plating solutionYABE ATSUSHI·Filed 2004·Granted Mar 26, 2013·0 cites·1 claims
- 1537US2001013543A1Communication control apparatus having a plurality of communication processing cards and controlling data output by pollingFUJITSU LTD·Filed 2000·Application pending·0 cites
- 1634US2007071904A1Electroless copper plating solution and electroless copper plating methodYABE ATSUSHI·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →