Inventor · disambiguated record
Avi Tepman
Also filed as: SINHA ASHOK K · TEPMAN AVI
88 granted patents·21 pending applications·10,180 citations·filing 1991–2013
99Inventor score
Top patents by PatentIndex Score
109 records- 0199US6129044AApparatus for substrate processing with improved throughput and yieldAPPLIED MATERIALS INC·Filed 1999·Granted Oct 10, 2000·578 cites·21 claims
- 0299US5846332AThermally floating pedestal collar in a chemical vapor deposition chamberAPPLIED MATERIALS INC·Filed 1996·Granted Dec 8, 1998·863 cites·22 claims
- 0399US5730801ACompartnetalized substrate processing chamberAPPLIED MATERIALS INC·Filed 1994·Granted Mar 24, 1998·836 cites·47 claims
- 0499US5186718AStaged-vacuum wafer processing system and methodAPPLIED MATERIALS INC·Filed 1991·Granted Feb 16, 1993·998 cites·23 claims
- 0598US6603269B1Resonant chamber applicator for remote plasma sourceAPPLIED MATERIALS INC·Filed 2000·Granted Aug 5, 2003·252 cites·7 claims
- 0698US6440261B1Dual buffer chamber cluster tool for semiconductor wafer processingAPPLIED MATERIALS INC·Filed 1999·Granted Aug 27, 2002·482 cites·9 claims
- 0798US6379466B1Temperature controlled gas distribution plateAPPLIED MATERIALS INC·Filed 1994·Granted Apr 30, 2002·468 cites·2 claims
- 0898US6350353B2Alternate steps of IMP and sputtering process to improve sidewall coverageAPPLIED MATERIALS INC·Filed 1999·Granted Feb 26, 2002·175 cites·21 claims
- 0998US6258220B1Electro-chemical deposition systemAPPLIED MATERIALS INC·Filed 1999·Granted Jul 10, 2001·443 cites·26 claims
- 1098US6136163AApparatus for electro-chemical deposition with thermal anneal chamberAPPLIED MATERIALS INC·Filed 1999·Granted Oct 24, 2000·569 cites·14 claims
- 1198US5885358AGas injection slit nozzle for a plasma process reactorAPPLIED MATERIALS INC·Filed 1996·Granted Mar 23, 1999·203 cites·30 claims
- 1297US6866746B2Clamshell and small volume chamber with fixed substrate supportAPPLIED MATERIALS INC·Filed 2002·Granted Mar 15, 2005·130 cites·27 claims
- 1397US5746875AGas injection slit nozzle for a plasma process reactorAPPLIED MATERIALS INC·Filed 1995·Granted May 5, 1998·169 cites·18 claims
- 1497US5540821AMethod and apparatus for adjustment of spacing between wafer and PVD target during semiconductor processingAPPLIED MATERIALS INC·Filed 1993·Granted Jul 30, 1996·365 cites·50 claims
- 1597US5320728APlanar magnetron sputtering source producing improved coating thickness uniformity, step coverage and step coverage uniformityAPPLIED MATERIALS INC·Filed 1993·Granted Jun 14, 1994·148 cites·15 claims
- 1696US6777352B2Variable flow deposition apparatus and method in semiconductor substrate processingAPPLIED MATERIALS INC·Filed 2002·Granted Aug 17, 2004·119 cites·6 claims
- 1796US5964947ARemovable pumping channel liners within a chemical vapor deposition chamberAPPLIED MATERIALS INC·Filed 1997·Granted Oct 12, 1999·96 cites·20 claims
- 1896US5228501APhysical vapor deposition clamping mechanism and heater/coolerAPPLIED MATERIALS INC·Filed 1992·Granted Jul 20, 1993·357 cites·24 claims
- 1995US6641701B1Cooling system for magnetron sputtering apparatusAPPLIED MATERIALS INC·Filed 2000·Granted Nov 4, 2003·52 cites·27 claims
- 2094US5447409ARobot assemblyAPPLIED MATERIALS INC·Filed 1994·Granted Sep 5, 1995·144 cites·5 claims
- 2193US6270687B1RF plasma methodAPPLIED MATERIALS INC·Filed 2000·Granted Aug 7, 2001·42 cites·28 claims
- 2293US5803977AApparatus for full wafer depositionAPPLIED MATERIALS INC·Filed 1995·Granted Sep 8, 1998·137 cites·26 claims
- 2392US6935466B2Lift pin alignment and operation methods and apparatusAPPLIED MATERIALS INC·Filed 2001·Granted Aug 30, 2005·59 cites·8 claims
- 2492US6071372ARF plasma etch reactor with internal inductive coil antenna and electrically conductive chamber wallsAPPLIED MATERIALS INC·Filed 1997·Granted Jun 6, 2000·69 cites·49 claims
- 2592US6045620ATwo-piece slit valve insert for vacuum processing systemAPPLIED MATERIALS INC·Filed 1997·Granted Apr 4, 2000·116 cites·17 claims
- 2691US6635157B2Electro-chemical deposition systemAPPLIED MATERIALS INC·Filed 2001·Granted Oct 21, 2003·43 cites·68 claims
- 2791US5632873ATwo piece anti-stick clamp ringFiled 1995·Granted May 27, 1997·128 cites·43 claims
- 2889US8500975B2Method and apparatus for sputtering onto large flat panelsLE HIEN MINH HUU·Filed 2006·Granted Aug 6, 2013·13 cites·19 claims
- 2989US6430468B1Method and apparatus for accurate placement of semiconductor wafers onto respective platforms within a single reaction chamberAPPLIED MATERIALS INC·Filed 2000·Granted Aug 6, 2002·45 cites·10 claims
- 3089US6368469B1Coils for generating a plasma and for sputteringAPPLIED MATERIALS INC·Filed 1997·Granted Apr 9, 2002·48 cites·54 claims
- 3189US5171412AMaterial deposition method for integrated circuit manufacturingAPPLIED MATERIALS INC·Filed 1991·Granted Dec 15, 1992·138 cites·21 claims
- 3288US6254746B1Recessed coil for generating a plasmaAPPLIED MATERIALS INC·Filed 1997·Granted Jul 3, 2001·47 cites·60 claims
- 3388US6228235B1Magnetron for low pressure, full face erosionAPPLIED MATERIALS INC·Filed 1999·Granted May 8, 2001·48 cites·12 claims
- 3488US5922133AMultiple edge deposition exclusion ringsAPPLIED MATERIALS INC·Filed 1997·Granted Jul 13, 1999·95 cites·11 claims
- 3588US5589224AApparatus for full wafer depositionAPPLIED MATERIALS INC·Filed 1994·Granted Dec 31, 1996·78 cites·13 claims
- 3687US7497932B2Electro-chemical deposition systemAPPLIED MATERIALS INC·Filed 2006·Granted Mar 3, 2009·9 cites·4 claims
- 3787US6939210B2Slurry delivery armAPPLIED MATERIALS INC·Filed 2003·Granted Sep 6, 2005·21 cites·31 claims
- 3887US6783639B2Coils for generating a plasma and for sputteringAPPLIED MATERIALS INC·Filed 2002·Granted Aug 31, 2004·21 cites·32 claims
- 3987US5883017ACompartmentalized substrate processing chamberAPPLIED MATERIALS INC·Filed 1997·Granted Mar 16, 1999·73 cites·49 claims
- 4087US5879575ASelf-cleaning plasma processing reactorAPPLIED MATERIALS INC·Filed 1997·Granted Mar 9, 1999·97 cites·26 claims
- 4185US8398832B2Coils for generating a plasma and for sputteringNULMAN JAIM·Filed 2005·Granted Mar 19, 2013·10 cites·25 claims
- 4285US5907220AMagnetron for low pressure full face erosionAPPLIED MATERIALS INC·Filed 1996·Granted May 25, 1999·60 cites·21 claims
- 4385US5380414AShield and collimator pasting deposition chamber with a wafer support periodically used as an acceptorAPPLIED MATERIALS INC·Filed 1993·Granted Jan 10, 1995·43 cites·15 claims
- 4484US6571657B1Multiple blade robot adjustment apparatus and associated methodAPPLIED MATERIALS INC·Filed 2000·Granted Jun 3, 2003·29 cites·38 claims
- 4584US5401319ALid and door for a vacuum chamber and pretreatment thereforAPPLIED MATERIALS INC·Filed 1992·Granted Mar 28, 1995·69 cites·4 claims
- 4683US6296712B1Chemical vapor deposition hardware and processAPPLIED MATERIALS INC·Filed 1998·Granted Oct 2, 2001·68 cites·23 claims
- 4783US5762748ALid and door for a vacuum chamber and pretreatment thereforAPPLIED MATERIALS INC·Filed 1996·Granted Jun 9, 1998·56 cites·1 claims
- 4883USD381030SSputtering targetTEPMAN AVI·Filed 1995·Granted Jul 15, 1997·30 cites·1 claims
- 4982US6270859B2Plasma treatment of titanium nitride formed by chemical vapor depositionAPPLIED MATERIALS INC·Filed 1998·Granted Aug 7, 2001·42 cites·22 claims
- 5082US5527438ACylindrical sputtering shieldAPPLIED MATERIALS INC·Filed 1994·Granted Jun 18, 1996·37 cites·33 claims
Showing the top 50 of 109 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →