Inventor · disambiguated record
Awnish Gupta
Also filed as: GUPTA AWNISH
7 granted patents·17 pending applications·6 citations·filing 2018–2024
73Inventor score
Files withLAM RES CORP24
Top patents by PatentIndex Score
24 records- 0181US12412742B2Impurity reduction in silicon-containing filmsLAM RES CORP·Filed 2021·Granted Sep 9, 2025·1 cites·20 claims
- 0280US10615169B2Selective deposition of SiN on horizontal surfacesLAM RES CORP·Filed 2018·Granted Apr 7, 2020·5 cites·16 claims
- 0374US2024368761A1Selective carbon depositionLAM RES CORP·Filed 2024·Application pending·0 cites
- 0463US12037686B2Selective carbon depositionLAM RES CORP·Filed 2020·Granted Jul 16, 2024·0 cites·15 claims
- 0557US12431349B2In-situ control of film properties during atomic layer depositionLAM RES CORP·Filed 2020·Granted Sep 30, 2025·0 cites·9 claims
- 0655US12417943B2Reducing intralevel capacitance in semiconductor devicesLAM RES CORP·Filed 2021·Granted Sep 16, 2025·0 cites·20 claims
- 0755US2025069882A1Silicon nitride depositionLAM RES CORP·Filed 2022·Application pending·0 cites
- 0855US2024410053A1Conformal silicon oxide deposition using aminosilane and chlorosilane precursorsLAM RES CORP·Filed 2022·Application pending·0 cites
- 0954US2025285858A1Single wafer reactor, low temperature, thermal silicon nitride depositionLAM RES CORP·Filed 2023·Application pending·0 cites
- 1054US2025197996A1Low-k dielectric protection during plasma deposition of silicon nitrideLAM RES CORP·Filed 2023·Application pending·0 cites
- 1153US2025014890A1Conformal, carbon-doped silicon nitride films and methods thereofLAM RES CORP·Filed 2022·Application pending·0 cites
- 1253US2025054751A1Ald pulse sequence engineering for improved conformality for low temp precursorsLAM RES CORP·Filed 2022·Application pending·0 cites
- 1352US12157945B2Thermal atomic layer deposition of silicon-containing filmsLAM RES CORP·Filed 2020·Granted Dec 3, 2024·0 cites·21 claims
- 1452US2025054747A1Conformal deposition of silicon nitrideLAM RES CORP·Filed 2022·Application pending·0 cites
- 1551US2024387226A1Remote plasma deposition with electrostatic clampingLAM RES CORP·Filed 2022·Application pending·0 cites
- 1651US2025087481A1Increasing deposition rates of oxide filmsLAM RES CORP·Filed 2022·Application pending·0 cites
- 1751US2024167153A1In-situ film annealing in substrate processingLAM RES CORP·Filed 2022·Application pending·0 cites
- 1850US2023002901A1Pressure batch compensation to stabilize cd variation for trim and deposition processesLAM RES CORP·Filed 2020·Application pending·0 cites
- 1949US12288685B2Modifying hydrophobicity of a wafer surface using an organosilicon precursorLAM RES CORP·Filed 2019·Granted Apr 29, 2025·0 cites·14 claims
- 2049US2025166989A1Thermal film depositionLAM RES CORP·Filed 2023·Application pending·0 cites
- 2148US2025188609A1Seam-free and crack-free depositionLAM RES CORP·Filed 2023·Application pending·0 cites
- 2245US2023220544A1In-feature wet etch rate ratio reductionLAM RES CORP·Filed 2021·Application pending·0 cites
- 2345US2023087976A1Non-plasma enhanced deposition for recess etch matchingLAM RES CORP·Filed 2021·Application pending·0 cites
- 2444US2022375721A1Radio frequency (rf) power imbalancing in a multi-station integrated circuit fabrication chamberLAM RES CORP·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →