Inventor · disambiguated record
Bai Nie
Also filed as: NIE BAI
15 granted patents·74 pending applications·25 citations·filing 2013–2025
88Inventor score
Top patents by PatentIndex Score
89 records- 0197US11521931B2Microelectronic structures including bridgesINTEL CORP·Filed 2020·Granted Dec 6, 2022·7 cites·18 claims
- 0286US2025323166A1Lithographic cavity formation to enable emib bump pitch scalingINTEL CORP·Filed 2025·Application pending·0 cites
- 0385US12422615B2Nested glass packaging architecture for hybrid electrical and optical communication devicesINTEL CORP·Filed 2021·Granted Sep 23, 2025·1 cites·11 claims
- 0483US12504581B2Photonic interconnect and components in glassINTEL CORP·Filed 2021·Granted Dec 23, 2025·1 cites·21 claims
- 0583US12354963B2Lithographic cavity formation to enable EMIB bump pitch scalingINTEL CORP·Filed 2024·Granted Jul 8, 2025·0 cites·19 claims
- 0683US12334443B2Lithographic cavity formation to enable EMIB bump pitch scalingINTEL CORP·Filed 2024·Granted Jun 17, 2025·0 cites·18 claims
- 0778US9048632B1Ultrafast laser apparatusDANTUS MARCOS·Filed 2013·Granted Jun 2, 2015·13 cites·14 claims
- 0875US11929330B2Lithographic cavity formation to enable EMIB bump pitch scalingINTEL CORP·Filed 2022·Granted Mar 12, 2024·0 cites·20 claims
- 0972US11837534B2Substrate with variable height conductive and dielectric elementsINTEL CORP·Filed 2017·Granted Dec 5, 2023·2 cites·7 claims
- 1072US11322444B2Lithographic cavity formation to enable EMIB bump pitch scalingINTEL CORP·Filed 2018·Granted May 3, 2022·1 cites·16 claims
- 1162US12345932B2Die last and waveguide last architecture for silicon photonic packagingINTEL CORP·Filed 2021·Granted Jul 1, 2025·0 cites·19 claims
- 1261US2025022786A1Methods and apparatus for edge protected glass coresINTEL CORP·Filed 2024·Application pending·0 cites
- 1361US2025132239A1Porous liners for through-glass vias and associated methodsINTEL CORP·Filed 2024·Application pending·0 cites
- 1459US2025391718A1Integrated circuit packages including substrates with reinforced glass coresINTEL CORP·Filed 2024·Application pending·0 cites
- 1559US2024184209A1Lithographic processes for making polymer-based elementsINTEL CORP·Filed 2022·Application pending·0 cites
- 1659US2025218678A1Die within a hole in a substrate core attached to metal features over the holeINTEL CORP·Filed 2023·Application pending·0 cites
- 1759US2024105571A1Implantation of species on glass core surface for low loss and high strength applicationsINTEL CORP·Filed 2022·Application pending·0 cites
- 1858US12394719B2Methods and apparatus to increase glass core thicknessINTEL CORP·Filed 2021·Granted Aug 19, 2025·0 cites·23 claims
- 1957US12354883B2Omni directional interconnect with magnetic fillers in mold matrixINTEL CORP·Filed 2021·Granted Jul 8, 2025·0 cites·18 claims
- 2057US2025218963A1Die and conductive vias embedded in a substrateINTEL CORP·Filed 2023·Application pending·0 cites
- 2157US2025218915A1Pedestal structure for passive circuit component structureINTEL CORP·Filed 2023·Application pending·0 cites
- 2257US2025210426A1Microelectronic assemblies with strengthened glass coresINTEL CORP·Filed 2023·Application pending·0 cites
- 2357US2025112124A1Deep cavity arrangements on integrated circuit packagingINTEL CORP·Filed 2023·Application pending·0 cites
- 2457US2025216608A1Technologies for micro-led optical communication via glass waveguidesDUONG BENJAMIN T·Filed 2023·Application pending·0 cites
- 2557US2025218960A1Methods and apparatus to embed semiconductor devices in cores of package substratesINTEL CORP·Filed 2023·Application pending·0 cites
- 2656US11923312B2Patternable die attach materials and processes for patterningINTEL CORP·Filed 2019·Granted Mar 5, 2024·0 cites·12 claims
- 2756US2025218879A1Resist tenting and plating in core cavity for component attachmentINTEL CORP·Filed 2023·Application pending·0 cites
- 2856US2025218959A1Pad design for embedded interconnect bridges in package substratesINTEL CORP·Filed 2023·Application pending·0 cites
- 2956US2025183180A1Direct bonding for embedded bridges with viasINTEL CORP·Filed 2023·Application pending·0 cites
- 3055US2024176084A1Photonic integrated circuit (pic) first patch architectureINTEL CORP·Filed 2022·Application pending·0 cites
- 3155US2025112165A1Anisotropic conductive connections for interconnect bridges and related methodsINTEL CORP·Filed 2023·Application pending·0 cites
- 3255US2025113434A1Through glass via (tgv) with modulated profile for core stress reductionINTEL CORP·Filed 2023·Application pending·0 cites
- 3355US2024329333A1Co-packaging of photonic & electronic integrated circuit dieINTEL CORP·Filed 2023·Application pending·0 cites
- 3455US2025192069A1Microelectronic assemblies with pre-singulation edge features in glass coresINTEL CORP·Filed 2023·Application pending·0 cites
- 3554US2024219653A1Photonic alignment device and methodINTEL CORP·Filed 2022·Application pending·0 cites
- 3654US2024222301A1Methods and apparatus for optical thermal treatment in semiconductor packagesINTEL CORP·Filed 2022·Application pending·0 cites
- 3754US2024222136A1Electrical layer with roughened surfacesINTEL CORP·Filed 2022·Application pending·0 cites
- 3854US2024219629A1Photonic integrated circuits with glass coresINTEL CORP·Filed 2022·Application pending·0 cites
- 3954US2024312865A1Methods, systems, apparatus, and articles of manufacture to improve reliability of vias in a glass substrate of an integrated circuit packageINTEL CORP·Filed 2023·Application pending·0 cites
- 4054US2024332125A12d fillers for reduced cte for pidINTEL CORP·Filed 2023·Application pending·0 cites
- 4153US2024213116A1Methods, systems, apparatus, and articles of manufacture to cool integrated circuit packages having glass substratesINTEL CORP·Filed 2022·Application pending·0 cites
- 4253US2024213169A1Low die height glass substrate device and methodINTEL CORP·Filed 2022·Application pending·0 cites
- 4353US2024222210A1Glass substrate fabrication using hybrid bondingINTEL CORP·Filed 2022·Application pending·0 cites
- 4453US2024222238A1Apparatus and method for attaching an optical component using no remelt metallurgyINTEL CORP·Filed 2022·Application pending·0 cites
- 4553US2024192453A1Photonic integrated circuit package substrate with vertical optical couplersINTEL CORP·Filed 2022·Application pending·0 cites
- 4653US2024219660A1Optical semiconductor package and methodINTEL CORP·Filed 2022·Application pending·0 cites
- 4753US2024222345A1Die attach in glass core package through organic-to-organic bondingINTEL CORP·Filed 2022·Application pending·0 cites
- 4853US2024219654A1Optical semiconductor package and methodINTEL CORP·Filed 2022·Application pending·0 cites
- 4953US2024112971A1Singulation of integrated circuit package substrates with glass coresINTEL CORP·Filed 2022·Application pending·0 cites
- 5053US2024112972A1Microelectronics packages with photo-integrated glass interposerINTEL CORP·Filed 2022·Application pending·0 cites
Showing the top 50 of 89 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →