Inventor · disambiguated record
Baiwei Wang
Also filed as: WANG BAIWEI
6 granted patents·6 pending applications·0 citations·filing 2021–2025
64Inventor score
Technology areasH10P
Files withAPPLIED MATERIALS INC12
Top patents by PatentIndex Score
12 records- 0166US2025183053A1Metal oxide directional removalAPPLIED MATERIALS INC·Filed 2025·Application pending·0 cites
- 0265US12272563B2Metal oxide directional removalAPPLIED MATERIALS INC·Filed 2021·Granted Apr 8, 2025·0 cites·9 claims
- 0359US12087595B2Metal deposition and etch in high aspect-ratio featuresAPPLIED MATERIALS INC·Filed 2022·Granted Sep 10, 2024·0 cites·20 claims
- 0457US2025391666A1Residue removal after etch processes using a boron-containing etchantAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 0555US2025293046A1Prime step for metal etch in high aspect-ratio featuresAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 0654US11798813B2Selective removal of ruthenium-containing materialsAPPLIED MATERIALS INC·Filed 2021·Granted Oct 24, 2023·0 cites·17 claims
- 0754US11631589B2Metal etch in high aspect-ratio featuresAPPLIED MATERIALS INC·Filed 2021·Granted Apr 18, 2023·0 cites·18 claims
- 0852US2024258116A1Systems and methods for titanium-containing film removalAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 0951US11984325B2Selective removal of transition metal nitride materialsAPPLIED MATERIALS INC·Filed 2021·Granted May 14, 2024·0 cites·20 claims
- 1049US11728177B2Systems and methods for nitride-containing film removalAPPLIED MATERIALS INC·Filed 2021·Granted Aug 15, 2023·0 cites·20 claims
- 1149US2025299969A1Systems and methods for selective metal-containing material removalAPPLIED MATERIALS INC·Filed 2025·Application pending·0 cites
- 1248US2023386830A1Highly conformal metal etch in high aspect ratio semiconductor featuresAPPLIED MATERIALS INC·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →