Inventor · disambiguated record
Benjamin Duong
Also filed as: DUONG BENJAMIN · DUONG BENJAMIN T · DUONG BENJAMIN TAYLOR
11 granted patents·90 pending applications·1 citations·filing 2019–2024
78Inventor score
Top patents by PatentIndex Score
101 records- 0183US12504581B2Photonic interconnect and components in glassINTEL CORP·Filed 2021·Granted Dec 23, 2025·1 cites·21 claims
- 0263US12353070B2Glass interposer optical switching device and methodINTEL CORP·Filed 2021·Granted Jul 8, 2025·0 cites·15 claims
- 0362US12345932B2Die last and waveguide last architecture for silicon photonic packagingINTEL CORP·Filed 2021·Granted Jul 1, 2025·0 cites·19 claims
- 0461US12057252B2Electronic substrates having embedded inductorsINTEL CORP·Filed 2020·Granted Aug 6, 2024·0 cites·11 claims
- 0561US2025022786A1Methods and apparatus for edge protected glass coresINTEL CORP·Filed 2024·Application pending·0 cites
- 0661US2024347402A1Methods and apparatus to reduce delamination in hybrid coresINTEL CORP·Filed 2024·Application pending·0 cites
- 0761US2025105074A1Glass cores including protruding through glass vias and related methodsINTEL CORP·Filed 2024·Application pending·0 cites
- 0860US2025391716A1Riveted edge core for semiconductor packagingINTEL CORP·Filed 2024·Application pending·0 cites
- 0959US12349282B2Capacitors in through glass viasINTEL CORP·Filed 2021·Granted Jul 1, 2025·0 cites·23 claims
- 1059US2025391718A1Integrated circuit packages including substrates with reinforced glass coresINTEL CORP·Filed 2024·Application pending·0 cites
- 1159US2025300086A1Optical and electrical glass interposer with embedded bridgeINTEL CORP·Filed 2024·Application pending·0 cites
- 1259US2025298202A1Technologies for bridge dies for optical interconnectsINTEL CORP·Filed 2024·Application pending·0 cites
- 1359US2025285987A1On-the-fly angular alignment for writing 3d features in a mounted substrateINTEL CORP·Filed 2024·Application pending·0 cites
- 1458US2025218898A1Reconstituted passive with mechanical support structuresINTEL CORP·Filed 2023·Application pending·0 cites
- 1558US2025219032A1Technologies for back side micro-led assembliesDUONG BENJAMIN T·Filed 2023·Application pending·0 cites
- 1658US2025266395A1Multi-die bridge assemblies and methods for three-dimensional packagingINTEL CORP·Filed 2024·Application pending·0 cites
- 1758US2025112100A1Die embedded in glass layer with two-side connectivityINTEL CORP·Filed 2023·Application pending·0 cites
- 1857US12449600B2Position controlled waveguides and methods of manufacturing the sameINTEL CORP·Filed 2021·Granted Oct 21, 2025·0 cites·25 claims
- 1957US2025096053A1Microelectronic assemblies having a bridge die over a glass patchINTEL CORP·Filed 2023·Application pending·0 cites
- 2057US2025218963A1Die and conductive vias embedded in a substrateINTEL CORP·Filed 2023·Application pending·0 cites
- 2157US2025218915A1Pedestal structure for passive circuit component structureINTEL CORP·Filed 2023·Application pending·0 cites
- 2257US2025112124A1Deep cavity arrangements on integrated circuit packagingINTEL CORP·Filed 2023·Application pending·0 cites
- 2357US2025306295A1Detachable optical connector with integrated strain relief featuresINTEL CORP·Filed 2024·Application pending·0 cites
- 2457US2025293172A1Semiconductor package with bridge die over embedded interposerINTEL CORP·Filed 2024·Application pending·0 cites
- 2557US2025285926A1Core joining for embedded die within package substratesINTEL CORP·Filed 2024·Application pending·0 cites
- 2657US2025216608A1Technologies for micro-led optical communication via glass waveguidesDUONG BENJAMIN T·Filed 2023·Application pending·0 cites
- 2757US2025273582A1Interconnections to package substrates for interconnect bridgesINTEL CORP·Filed 2024·Application pending·0 cites
- 2856US2025218952A1Spacer for embedded component in coreINTEL CORP·Filed 2023·Application pending·0 cites
- 2956US2025201732A1Microelectronic assemblies with crack-healing materials for glass coresINTEL CORP·Filed 2023·Application pending·0 cites
- 3056US2025309989A1Technologies for optical equalizersINTEL CORP·Filed 2024·Application pending·0 cites
- 3156US2025006781A1Carbon nanofiber capacitor apparatus and related methodsINTEL CORP·Filed 2023·Application pending·0 cites
- 3256US2025218983A1Microelectronic structures including embedded integrated capacitor in multilayer coreINTEL CORP·Filed 2023·Application pending·0 cites
- 3356US2025183180A1Direct bonding for embedded bridges with viasINTEL CORP·Filed 2023·Application pending·0 cites
- 3456US2025218961A1Methods and apparatus to facilitate semiconductor device alignment in an integrated circuit packageINTEL CORP·Filed 2023·Application pending·0 cites
- 3556US2025006671A1Semiconductor layer with dry deposition layerINTEL CORP·Filed 2023·Application pending·0 cites
- 3656US2025210469A1Mixed depth cavity for embedded bridge structuresINTEL CORP·Filed 2023·Application pending·0 cites
- 3755US2025105209A1High performance microelectronic assemblies including through-silicon via bridges with top die first approachINTEL CORP·Filed 2023·Application pending·0 cites
- 3855US2025112165A1Anisotropic conductive connections for interconnect bridges and related methodsINTEL CORP·Filed 2023·Application pending·0 cites
- 3955US2025105222A1High performance microelectronic assemblies including through-silicon via bridges with top die last approachINTEL CORP·Filed 2023·Application pending·0 cites
- 4055US2025192069A1Microelectronic assemblies with pre-singulation edge features in glass coresINTEL CORP·Filed 2023·Application pending·0 cites
- 4155US2025183179A1Passive structures in embedded bridge architecturesINTEL CORP·Filed 2023·Application pending·0 cites
- 4255US2024345324A1Optical fiber mounts for printed circuit boards and integrated circuit device packagesINTEL CORP·Filed 2023·Application pending·0 cites
- 4355US2025201787A1Apparatus and methods for embedding deep trench capacitor (dtc) components in a substrateINTEL CORP·Filed 2023·Application pending·0 cites
- 4455US2025110289A1Optical connector ferruleINTEL CORP·Filed 2023·Application pending·0 cites
- 4554US2024176167A1Integrated optical phase change materials for reconfigurable optics in glass coresINTEL CORP·Filed 2022·Application pending·0 cites
- 4654US2024213132A1Thin film capacitors (tfcs) in etched back deep viaINTEL CORP·Filed 2022·Application pending·0 cites
- 4754US2024219644A1Electro-optical circuits with modular switchable photonic interfaceINTEL CORP·Filed 2022·Application pending·0 cites
- 4854US2025219040A1Technologies for Components Embedded in a Substrate CoreINTEL CORP·Filed 2023·Application pending·0 cites
- 4953US2024105625A1Open cavity interconnects for mib connectionsINTEL CORP·Filed 2022·Application pending·0 cites
- 5053US2024178146A1Integrated circuit packages including substrates with strengthened glass coresINTEL CORP·Filed 2022·Application pending·0 cites
Showing the top 50 of 101 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when Benjamin Duong files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →