Inventor · disambiguated record
Bernardo Gallegos
Also filed as: GALLEGOS BERNARDO
19 granted patents·7 pending applications·135 citations·filing 2001–2024
92Inventor score
Top patents by PatentIndex Score
26 records- 0196US7851928B2Semiconductor device having substrate with differentially plated copper and selective solderTEXAS INSTRUMENTS INC·Filed 2008·Granted Dec 14, 2010·64 cites·20 claims
- 0291US9165873B1Semiconductor package having etched foil capacitor integrated into leadframeTEXAS INSTRUMENTS INC·Filed 2014·Granted Oct 20, 2015·10 cites·14 claims
- 0390US7939939B1Stable gold bump solder connectionsTEXAS INSTRUMENTS INC·Filed 2007·Granted May 10, 2011·36 cites·4 claims
- 0487US9934989B1Process for forming leadframe having organic, polymerizable photo-imageable adhesion layerTEXAS INSTRUMENTS INC·Filed 2016·Granted Apr 3, 2018·6 cites·24 claims
- 0581US12154845B2Semiconductor package with nickel-silver pre-plated leadframeTEXAS INSTRUMENTS INC·Filed 2023·Granted Nov 26, 2024·0 cites·12 claims
- 0680US2025087563A1Semiconductor package with nickel-silver pre-plated leadframeTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 0778US9373572B2Semiconductor package having etched foil capacitor integrated into leadframeTEXAS INSTRUMENTS INC·Filed 2015·Granted Jun 21, 2016·2 cites·20 claims
- 0877US9054092B2Method and apparatus for stopping resin bleed and mold flash on integrated circuit lead finishesTEXAS INSTRUMENTS INC·Filed 2013·Granted Jun 9, 2015·5 cites·12 claims
- 0976US8298874B2Packaged electronic devices having die attach regions with selective thin dielectric layerGALLEGOS BERNARDO·Filed 2012·Granted Oct 30, 2012·4 cites·14 claims
- 1071US7808113B2Flip chip semiconductor device having workpiece adhesion promoter layer for improved underfill adhesionTEXAS INSTRUMENTS INC·Filed 2008·Granted Oct 5, 2010·5 cites·18 claims
- 1169US11848258B2Semiconductor package with nickel-silver pre-plated leadframeTEXAS INSTRUMENTS INC·Filed 2020·Granted Dec 19, 2023·0 cites·10 claims
- 1266US11930590B2Stress relief for flip-chip packaged devicesTEXAS INSTRUMENTS INC·Filed 2021·Granted Mar 12, 2024·0 cites·12 claims
- 1365US9875930B2Method of packaging a circuitTEXAS INSTRUMENTS INC·Filed 2014·Granted Jan 23, 2018·1 cites·17 claims
- 1462US8222748B2Packaged electronic devices having die attach regions with selective thin dielectric layerGALLEGOS BERNARDO·Filed 2009·Granted Jul 17, 2012·2 cites·10 claims
- 1554US10672692B2Leadframe having organic, polymerizable photo-imageable adhesion layerTEXAS INSTRUMENTS INC·Filed 2017·Granted Jun 2, 2020·0 cites·30 claims
- 1653US11244881B2Package terminal cavitiesTEXAS INSTRUMENTS INC·Filed 2019·Granted Feb 8, 2022·0 cites·18 claims
- 1752US9536781B2Method of making integrated circuitTEXAS INSTRUMENTS INC·Filed 2015·Granted Jan 3, 2017·0 cites·12 claims
- 1851US9142472B2Integrated circuit and method of makingGALLEGOS BERNARDO·Filed 2012·Granted Sep 22, 2015·0 cites·8 claims
- 1948US2013075928A1Integrated circuit and method of makingGALLEGOS BERNARDO·Filed 2012·Application pending·0 cites
- 2047US9142496B1Semiconductor package having etched foil capacitor integrated into leadframeTEXAS INSTRUMENTS INC·Filed 2014·Granted Sep 22, 2015·0 cites·4 claims
- 2146US2013075894A1Integrated circuit and method of makingGALLEGOS BERNARDO·Filed 2012·Application pending·0 cites
- 2245US2011177686A1Stable Gold Bump Solder ConnectionsTEXAS INSTRUMENTS INC·Filed 2011·Application pending·0 cites
- 2343US12237249B2Substrates with solder barriers on leadsTEXAS INSTRUMENTS INC·Filed 2018·Granted Feb 25, 2025·0 cites·15 claims
- 2442US2010007015A1Integrated circuit device with improved underfill coverageGALLEGOS BERNARDO·Filed 2008·Application pending·0 cites
- 2541US2003183418A1Electrical circuit and method of formationFiled 2003·Application pending·0 cites
- 2639US2003066679A1Electrical circuit and method of formationFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →