Integrated circuit and method of making

Abstract

Circuits and methods of fabricating circuits are disclosed herein. An embodiment of the circuit includes a die having a side, wherein a connection point is located on the side. A dielectric layer having a first side, a second side, and at least one via extending between the first side and the second side, is located proximate the side of the die. The via is electrically connected to the connection point. A conductive layer is located adjacent the second side of the first dielectric layer, wherein at least a portion of the conductive layer is electrically connected to the via.

What is claimed is: 
     
         1 . A circuit comprising:
 a die having a side, wherein a connection point is located on said side;   a first dielectric layer having a first side, a second side, and at least one first via extending between said first side and said second side, wherein said first side of said first dielectric layer is located proximate said side of said die, and wherein said first via is electrically connected to said connection point; and   a conductive layer having a first side and a second side, wherein said first side is located adjacent said second side of said first dielectric layer, at least a portion of said conductive layer being electrically connected to said first via.   
     
     
         2 . The circuit of  claim 1 , wherein said first dielectric layer is adhered to said side of said die. 
     
     
         3 . The circuit of  claim 1 , and further comprising a connection mechanism electrically connected to at least a portion of said conductive layer. 
     
     
         4 . The circuit of  claim 1 , wherein at least a portion of said die is encapsulated with an encapsulant. 
     
     
         5 . The circuit of  claim 4 , wherein at least a portion of a said first dielectric layer contacts said encapsulant. 
     
     
         6 . The circuit of  claim 1  and further comprising a second dielectric layer having a first side and a second side, wherein said first side is located adjacent said conductive layer, wherein said second dielectric layer has a second via extending between said first side and said second side, and wherein said second via is electrically connected to said conductive layer. 
     
     
         7 . The circuit of  claim 6 , and further comprising a connection mechanism electrically connected to at said second via. 
     
     
         8 . The circuit of  claim 7 , wherein said connection mechanism is mechanically connected to said second dielectric layer. 
     
     
         9 . A method of fabricating a circuit, said method comprising:
 providing a die, said die having a side, wherein a connection point is located on said side;   affixing a first dielectric layer to said first side of said die, said first dielectric layer having a first side and a second side, wherein said first side of said first dielectric layer is affixed to said side of said die; and   forming a first via through said first dielectric layer between said first side and said second side, wherein said first via is electrically connected to said connection point.   
     
     
         10 . The method of  claim 9  and further comprising encapsulating said die prior to said affixing said first dielectric layer to said side of said die wherein said encapsulating comprises substantially encapsulating said die, except for said side. 
     
     
         11 . The method of  claim 9 , and further comprising locating said die proximate a heat spreader. 
     
     
         12 . The method of  claim 9  and wherein said first dielectric layer is affixed to said die in an uncured state and further comprising:
 applying an uncured encapsulant to said die; and 
 curing said encapsulant and said first dielectric layer simultaneously. 
 
     
     
         13 . The method of  claim 9 , wherein said first dielectric layer has a conductive layer affixed to said second side and further comprising electrically connecting said conductive layer to said first via. 
     
     
         14 . The method of  claim 13  and further comprising:
 affixing a second dielectric layer to said conductive layer, said second dielectric layer having a first side and a second side, wherein said first side of said second dielectric layer is located adjacent said conductive layer; and 
 forming a second via between said conductive layer and said second side of said second dielectric layer. 
 
     
     
         15 . The method of  claim 14  and further comprising affixing a connection mechanism to said second side of said second dielectric layer, said connection mechanism being electrically connected to said second via. 
     
     
         16 . The method of  claim 9 , wherein said affixing a first dielectric layer comprises affixing a first dielectric material to a carrier and applying said dielectric material with said carrier to said side of said die. 
     
     
         17 . The method of  claim 16  and further comprising removing said carrier. 
     
     
         18 . A method of fabricating a circuit, said method comprising:
 encapsulating a die with encapsulant except for a first side of said die; and   after said encapsulating, attaching a dielectric substrate to said die and said encapsulant.   
     
     
         19 . The method of  claim 18 , and further comprising electrically connecting said die to a connection mechanism using conductive material that extends through said dielectric substrate. 
     
     
         20 . The method of  claim 19  wherein said electrically connecting comprises attaching a conductive layer to one side of said dielectric substrate after said attaching said dielectric substrate to said die and said encapsulant.