Inventor · disambiguated record
Bernd Goller
Also filed as: GOLLER BERND
32 granted patents·10 pending applications·538 citations·filing 1996–2024
97Inventor score
Top patents by PatentIndex Score
42 records- 0198US7795717B2Electronic component embedded within a plastic compound and including copper columns within the plastic compound extending between upper and lower rewiring layers, and system carrier and panel for producing an electronic componentINFINEON TECHNOLOGIES AG·Filed 2005·Granted Sep 14, 2010·116 cites·8 claims
- 0297US11117798B2MEMS-sensorINFINEON TECHNOLOGIES AG·Filed 2019·Granted Sep 14, 2021·10 cites·11 claims
- 0391US6902951B2Electronic device configured as a multichip module, leadframe, panel with leadframe positions, and method for producing the electronic deviceINFINEON TECHNOLOGIES AG·Filed 2003·Granted Jun 7, 2005·67 cites·6 claims
- 0490US6710455B2Electronic component with at least two stacked semiconductor chips and method for fabricating the electronic componentINFINEON TECHNOLOGIES AG·Filed 2002·Granted Mar 23, 2004·65 cites·15 claims
- 0589US7575173B2Smart card, smart card module, and a method for production of a smart card moduleINFINEON TECHNOLOGIES AG·Filed 2006·Granted Aug 18, 2009·22 cites·6 claims
- 0689US5681060APlug-in connector for a pressure pipe systemVOSS ARMATUREN·Filed 1996·Granted Oct 28, 1997·72 cites·6 claims
- 0788US10549985B2Semiconductor package with a through port for sensor applicationsINFINEON TECHNOLOGIES AG·Filed 2017·Granted Feb 4, 2020·4 cites·15 claims
- 0887US7276783B2Electronic component with a plastic package and method for productionINFINEON TECHNOLOGIES AG·Filed 2002·Granted Oct 2, 2007·54 cites·36 claims
- 0986US7517722B2Method of producing a universal semiconductor housing with precrosslinked plastic embedding compoundsINFINEON TECHNOLOGIES AG·Filed 2006·Granted Apr 14, 2009·13 cites·23 claims
- 1085US10793419B2MEMS assemblyINFINEON TECHNOLOGIES AG·Filed 2019·Granted Oct 6, 2020·4 cites·16 claims
- 1182US10435292B2Method for producing a semiconductor moduleINFINEON TECHNOLOGIES AG·Filed 2017·Granted Oct 8, 2019·2 cites·21 claims
- 1282US6867471B2Universal package for an electronic component with a semiconductor chip and method for producing the universal packageINFINEON TECHNOLOGIES AG·Filed 2003·Granted Mar 15, 2005·33 cites·38 claims
- 1380US6683374B2Electronic component and process for producing the electronic componentINFINEON TECHNOLOGIES AG·Filed 2002·Granted Jan 27, 2004·30 cites·15 claims
- 1477US7781899B2Leadframe having mold lock ventINFINEON TECHNOLOGIES AG·Filed 2008·Granted Aug 24, 2010·9 cites·21 claims
- 1576US7732937B2Semiconductor package with mold lock ventINFINEON TECHNOLOGIES AG·Filed 2008·Granted Jun 8, 2010·7 cites·6 claims
- 1675US10570007B2MEMS assembly and method for producing a MEMS assemblyINFINEON TECHNOLOGIES AG·Filed 2019·Granted Feb 25, 2020·2 cites·20 claims
- 1770US10161908B2Apparatus for determining a characteristic of a fluid having a device configured to measure a hydrodynamic pressure of the fluidINFINEON TECHNOLOGIES AG·Filed 2016·Granted Dec 25, 2018·2 cites·20 claims
- 1865US11040872B2Semiconductor moduleINFINEON TECHNOLOGIES AG·Filed 2019·Granted Jun 22, 2021·0 cites·17 claims
- 1961US8753901B2Semiconductor wafer with electrically connected contact and test areasWERNER ERTLE·Filed 2011·Granted Jun 17, 2014·3 cites·12 claims
- 2060US8466009B2Method of fabricating a semiconductor package with mold lock openingGOLLER BERND·Filed 2010·Granted Jun 18, 2013·2 cites·14 claims
- 2155US2025346483A1Pressure transducer package having a rigid transfer block for assembly toleranceINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 2252US11574879B2Device package with reduced radio frequency lossesINFINEON TECHNOLOGIES AG·Filed 2019·Granted Feb 7, 2023·0 cites·21 claims
- 2351US7700956B2Sensor component and panel used for the production thereofINFINEON TECHNOLOGIES AG·Filed 2004·Granted Apr 20, 2010·4 cites·8 claims
- 2450US12063474B2Methods of environmental protection for silicon MEMS structures in cavity packagesINFINEON TECHNOLOGIES AG·Filed 2022·Granted Aug 13, 2024·0 cites·19 claims
- 2550US7524699B2Electronic component and a panelINFINEON TECHNOLOGIES AG·Filed 2004·Granted Apr 28, 2009·4 cites·4 claims
- 2650US2019079055A1Apparatus for determining a characteristic of a fluid having a device configured to measure a hydrostatic pressure of the fluidINFINEON TECHNOLOGIES AG·Filed 2018·Application pending·0 cites
- 2748US10377626B2Apparatus with a high heat capacity and method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2018·Granted Aug 13, 2019·0 cites·21 claims
- 2848US7566968B2Biosensor with smart card configurationSIEMENS AG·Filed 2005·Granted Jul 28, 2009·0 cites·10 claims
- 2948US7190077B2Semiconductor structure integrated under a padINFINEON TECHNOLOGIES AG·Filed 2003·Granted Mar 13, 2007·6 cites·18 claims
- 3047US7391103B2Electronic module having plug contacts and method for producing itINFINEON TECHNOLOGIES AG·Filed 2004·Granted Jun 24, 2008·2 cites·21 claims
- 3145US8044394B2Semiconductor wafer with electrically connected contact and test areasINFINEON TECHNOLOGIES AG·Filed 2003·Granted Oct 25, 2011·3 cites·20 claims
- 3245US7701066B2Semiconductor wafer, panel and electronic component with stacked semiconductor chips, and also method for producing sameINFINEON TECHNOLOGIES AG·Filed 2004·Granted Apr 20, 2010·1 cites·22 claims
- 3345US2005184375A1Electronic device configured as a multichip module, leadframe and panel with leadframe positionsINFINEON TECHNOLOGIES AG·Filed 2005·Application pending·0 cites
- 3443US6953992B2Electronic component with at least one semiconductor chip and method for its manufactureINFINEON TECHNOLOGIES AG·Filed 2002·Granted Oct 11, 2005·1 cites·8 claims
- 3542US2018366424A1Device Package with Reduced Radio Frequency LossesINFINEON TECHNOLOGIES AG·Filed 2017·Application pending·0 cites
- 3639US10707158B2Package with vertical interconnect between carrier and clipINFINEON TECHNOLOGIES AG·Filed 2017·Granted Jul 7, 2020·0 cites·20 claims
- 3739US2004043515A1Universal semiconductor housing with precrosslinked plastic embedding compounds, and method of producing the semiconductor housingFiled 2003·Application pending·0 cites
- 3835US2007120268A1Intermediate connection for flip chip in packagesIRSIGLER ROLAND·Filed 2006·Application pending·0 cites
- 3935US2003042591A1Electronic component with at least two stacked semiconductor chips, and fabrication methodFiled 2002·Application pending·0 cites
- 4035US2003043555A1Electronic component with at least two stacked semiconductor chips and process for producing the electronic componentFiled 2002·Application pending·0 cites
- 4135US2006157849A1Electronic component with semiconductor chip and semiconductor wafer with contact pads, and method for the production thereofGOLLER BERND·Filed 2006·Application pending·0 cites
- 4232US2005285199A1Method for producing a semiconductor circuit, and corresponding semiconductor circuitSTADLER WOLFGANG·Filed 2005·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Bernd Goller files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →