Inventor · disambiguated record
Benedict W. Pang
Also filed as: PANG BENEDICT W
2 granted patents·2 pending applications·0 citations·filing 2020–2024
25Inventor score
Files withAPPLIED MATERIALS INC4
Top patents by PatentIndex Score
4 records- 0167US2025001547A1Face-up wafer electrochemical planarization apparatusAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 0264US12090600B2Face-up wafer electrochemical planarization apparatusAPPLIED MATERIALS INC·Filed 2022·Granted Sep 17, 2024·0 cites·14 claims
- 0359US12257664B2Controlling chemical mechanical polishing pad stiffness by adjusting wetting in the backing layerAPPLIED MATERIALS INC·Filed 2020·Granted Mar 25, 2025·0 cites·20 claims
- 0441US2023024009A1Face-up wafer edge polishing apparatusAPPLIED MATERIALS INC·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →