Inventor · disambiguated record
Benson Q. Tong
Also filed as: TONG BENSON Q · TONG BENSON QUYEN
3 granted patents·2 pending applications·2 citations·filing 2016–2025
53Inventor score
Technology areasH10P
Files withLAM RES CORP5
Top patents by PatentIndex Score
5 records- 0176US12217944B2High power cable for heated components in RF environmentLAM RES CORP·Filed 2023·Granted Feb 4, 2025·0 cites·15 claims
- 0276US11837446B2High power cable for heated components in RF environmentLAM RES CORP·Filed 2018·Granted Dec 5, 2023·2 cites·8 claims
- 0367US2025183015A1High power cable for heated components in rf environmentLAM RES CORP·Filed 2025·Application pending·0 cites
- 0437US12444588B2Method and apparatus for processing wafersLAM RES CORP·Filed 2019·Granted Oct 14, 2025·0 cites·6 claims
- 0533US2018005851A1Chamber filler kit for dielectric etch chamberLAM RES CORP·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →