Inventor · disambiguated record
Bernd Waidhas
Also filed as: WAIDHAS BERND
60 granted patents·57 pending applications·216 citations·filing 2001–2025
98Inventor score
Top patents by PatentIndex Score
117 records- 0196US9385105B2Semiconductor devicesINTEL DEUTSCHLAND GMBH·Filed 2013·Granted Jul 5, 2016·52 cites·8 claims
- 0296US8716859B2Enhanced flip chip packageMEYER THORSTEN·Filed 2012·Granted May 6, 2014·22 cites·13 claims
- 0389US10394280B2Wearable electronic devices and components thereofINTEL CORP·Filed 2018·Granted Aug 27, 2019·6 cites·6 claims
- 0488US11031699B2Antenna with graded dielectirc and method of making the sameINTEL IP CORP·Filed 2018·Granted Jun 8, 2021·4 cites·12 claims
- 0588US2025309017A1Fan out package with integrated peripheral devices and methodsINTEL CORP·Filed 2025·Application pending·0 cites
- 0687US10115668B2Semiconductor package having a variable redistribution layer thicknessINTEL IP CORP·Filed 2015·Granted Oct 30, 2018·5 cites·10 claims
- 0787US9904321B2Wearable electronic devices and components thereofINTEL CORP·Filed 2014·Granted Feb 27, 2018·6 cites·10 claims
- 0887US9059304B2Enhanced flip chip packageINTEL MOBILE COMM GMBH·Filed 2014·Granted Jun 16, 2015·6 cites·33 claims
- 0987US2025323155A1Bare-die smart bridge connected with copper pillars for system-in-package apparatusINTEL CORP·Filed 2025·Application pending·0 cites
- 1085US12362251B2Fan out package with integrated peripheral devices and methodsINTEL CORP·Filed 2024·Granted Jul 15, 2025·0 cites·20 claims
- 1185US11270941B2Bare-die smart bridge connected with copper pillars for system-in-package apparatusINTEL CORP·Filed 2016·Granted Mar 8, 2022·4 cites·20 claims
- 1285US2025285972A1Bare-die smart bridge connected with copper pillars for system-in-package apparatusINTEL CORP·Filed 2025·Application pending·0 cites
- 1385US2025285971A1Bare-die smart bridge connected with copper pillars for system-in-package apparatusINTEL CORP·Filed 2025·Application pending·0 cites
- 1483US2024355697A1Package formation methods including coupling a molded routing layer to an integrated routing layerINTEL CORP·Filed 2024·Application pending·0 cites
- 1582US10867934B2Component magnetic shielding for microelectronic devicesINTEL IP CORP·Filed 2018·Granted Dec 15, 2020·4 cites·12 claims
- 1682US10546817B2Face-up fan-out electronic package with passive components using a supportINTEL IP CORP·Filed 2017·Granted Jan 28, 2020·2 cites·12 claims
- 1781US12057364B2Package formation methods including coupling a molded routing layer to an integrated routing layerINTEL CORP·Filed 2022·Granted Aug 6, 2024·0 cites·20 claims
- 1881US10665522B2Package including an integrated routing layer and a molded routing layerINTEL IP CORP·Filed 2017·Granted May 26, 2020·2 cites·13 claims
- 1980US6550982B2Optoelectronic surface-mountable module and optoelectronic coupling unitINFINEON TECHNOLOGIES AG·Filed 2001·Granted Apr 22, 2003·35 cites·11 claims
- 2079US11735570B2Fan out packaging pop mechanical attach methodINTEL CORP·Filed 2018·Granted Aug 22, 2023·2 cites·9 claims
- 2179US10553538B2Semiconductor package having a variable redistribution layer thicknessINTEL IP CORP·Filed 2018·Granted Feb 4, 2020·2 cites·19 claims
- 2279US7064429B2Electronic package having integrated cooling element with clearance for engaging packageINFINEON TECHNOLOGIES AG·Filed 2002·Granted Jun 20, 2006·28 cites·24 claims
- 2378US11955395B2Fan out package with integrated peripheral devices and methodsINTEL CORP·Filed 2022·Granted Apr 9, 2024·0 cites·18 claims
- 2477US12243856B2Fan out packaging pop mechanical attach methodINTEL CORP·Filed 2023·Granted Mar 4, 2025·0 cites·20 claims
- 2577US11134573B2Printed wiring-board islands for connecting chip packages and methods of assembling sameINTEL CORP·Filed 2017·Granted Sep 28, 2021·2 cites·23 claims
- 2677US8471393B2Semiconductor component including a semiconductor chip and a passive componentMEYER THORSTEN·Filed 2006·Granted Jun 25, 2013·8 cites·20 claims
- 2776US12341096B2Bare-die smart bridge connected with copper pillars for system-in-package apparatusINTEL CORP·Filed 2022·Granted Jun 24, 2025·0 cites·10 claims
- 2876US12080655B2Method to implement wafer-level chip-scale packages with grounded conformal shieldINTEL CORP·Filed 2019·Granted Sep 3, 2024·2 cites·22 claims
- 2976US11581287B2Chip scale thin 3D die stacked packageINTEL CORP·Filed 2018·Granted Feb 14, 2023·2 cites·23 claims
- 3076US7183652B2Electronic component and electronic configurationINFINEON TECHNOLOGIES AG·Filed 2005·Granted Feb 27, 2007·13 cites·30 claims
- 3176US2025132259A1Microelectronic assemblies having topside power delivery structuresINTEL CORP·Filed 2024·Application pending·0 cites
- 3275US10403602B2Monolithic silicon bridge stack including a hybrid baseband die supporting processors and memoryINTEL CORP·Filed 2017·Granted Sep 3, 2019·2 cites·9 claims
- 3373US10629731B2Power mesh-on-die trace bumpingINTEL IP CORP·Filed 2019·Granted Apr 21, 2020·1 cites·19 claims
- 3472US12394726B2Method to implement wafer-level chip-scale packages with grounded conformal shieldINTEL CORP·Filed 2023·Granted Aug 19, 2025·0 cites·20 claims
- 3572US11404339B2Fan out package with integrated peripheral devices and methodsINTEL IP CORP·Filed 2020·Granted Aug 2, 2022·0 cites·18 claims
- 3672US2025167183A1Fan out packaging pop mechanical attach methodINTEL CORP·Filed 2025·Application pending·0 cites
- 3771US11508637B2Fan out package and methodsINTEL CORP·Filed 2020·Granted Nov 22, 2022·0 cites·19 claims
- 3870US12191571B2Antenna with graded dielectirc and method of making the sameINTEL CORP·Filed 2021·Granted Jan 7, 2025·0 cites·22 claims
- 3970US10403580B2Molded substrate package in fan-out wafer level packageINTEL IP CORP·Filed 2017·Granted Sep 3, 2019·1 cites·20 claims
- 4069US11877403B2Printed wiring-board islands for connecting chip packages and methods of assembling sameINTEL CORP·Filed 2021·Granted Jan 16, 2024·0 cites·20 claims
- 4169US10263106B2Power mesh-on-die trace bumpingINTEL IP CORP·Filed 2017·Granted Apr 16, 2019·1 cites·21 claims
- 4268US2022051990A1Face-up fan-out electronic package with passive components using a supportINTEL CORP·Filed 2021·Application pending·0 cites
- 4367US11380616B2Fan out package-on-package with adhesive die attachINTEL IP CORP·Filed 2018·Granted Jul 5, 2022·1 cites·20 claims
- 4467US10366968B2Interconnect structure for a microelectronic deviceINTEL IP CORP·Filed 2016·Granted Jul 30, 2019·1 cites·13 claims
- 4566US12211796B2Microelectronic assemblies having topside power delivery structuresINTEL CORP·Filed 2021·Granted Jan 28, 2025·0 cites·20 claims
- 4666US12125815B2Assembly of 2XD module using high density interconnect bridgesINTEL CORP·Filed 2020·Granted Oct 22, 2024·0 cites·21 claims
- 4766US11469213B2Systems, methods, and apparatuses for implementing reduced height semiconductor packages for mobile electronicsINTEL CORP·Filed 2016·Granted Oct 11, 2022·1 cites·25 claims
- 4866US11211337B2Face-up fan-out electronic package with passive components using a supportINTEL CORP·Filed 2019·Granted Dec 28, 2021·0 cites·20 claims
- 4965US12406925B2Bare-die smart bridge connected with copper pillars for system-in-package apparatusINTEL CORP·Filed 2021·Granted Sep 2, 2025·0 cites·17 claims
- 5065US12243828B2Microelectronic assemblies having topside power delivery structuresINTEL CORP·Filed 2021·Granted Mar 4, 2025·0 cites·20 claims
Showing the top 50 of 117 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →