Inventor · disambiguated record
Bhupender Singh
Also filed as: SINGH BHUPENDER
17 granted patents·3 pending applications·4 citations·filing 2018–2024
86Inventor score
Top patents by PatentIndex Score
20 records- 0187US11282773B2Enlarged conductive pad structures for enhanced chip bond assembly yieldIBM·Filed 2020·Granted Mar 22, 2022·2 cites·13 claims
- 0271US11410894B2Polygon integrated circuit (IC) packagingIBM·Filed 2019·Granted Aug 9, 2022·1 cites·8 claims
- 0371US11031373B2Spacer for die-to-die communication in an integrated circuitIBM·Filed 2019·Granted Jun 8, 2021·1 cites·18 claims
- 0467US11521952B2Spacer for die-to-die communication in an integrated circuit and method for fabricating the sameIBM·Filed 2021·Granted Dec 6, 2022·0 cites·20 claims
- 0566US2025069678A1Built-in self test circuit for segmented static random access memory (sram) array input/outputST MICROELECTRONICS INT NV·Filed 2024·Application pending·0 cites
- 0664US11756930B2High bandwidth moduleIBM·Filed 2021·Granted Sep 12, 2023·0 cites·11 claims
- 0763US12437825B2At-speed transition fault testing for a multi-port and multi-clock memoryST MICROELECTRONICS INT NV·Filed 2023·Granted Oct 7, 2025·0 cites·40 claims
- 0862US12170120B2Built-in self test circuit for segmented static random access memory (SRAM) array input/outputST MICROELECTRONICS INT NV·Filed 2023·Granted Dec 17, 2024·0 cites·38 claims
- 0962US11201136B2High bandwidth moduleIBM·Filed 2020·Granted Dec 14, 2021·0 cites·14 claims
- 1062US2025391811A1Utilizing formate shells for metal structures on integrated circuit componentsIBM·Filed 2024·Application pending·0 cites
- 1156US12353341B2Tuning of read/write cycle time delay for a memory circuit dependent on operational mode selectionST MICROELECTRONICS INT NV·Filed 2023·Granted Jul 8, 2025·0 cites·19 claims
- 1253US11694992B2Near tier decoupling capacitorsIBM·Filed 2021·Granted Jul 4, 2023·0 cites·14 claims
- 1353US11211262B2Electronic apparatus having inter-chip stiffenerIBM·Filed 2020·Granted Dec 28, 2021·0 cites·19 claims
- 1447US2022119337A1Process for preparation of halogenated benzylamine and intermediates therofSRF LTD·Filed 2020·Application pending·0 cites
- 1546US11031343B2Fins for enhanced die communicationIBM·Filed 2019·Granted Jun 8, 2021·0 cites·10 claims
- 1644US11004614B2Stacked capacitors for use in integrated circuit modules and the likeIBM·Filed 2018·Granted May 11, 2021·0 cites·24 claims
- 1743US11404365B2Direct attachment of capacitors to flip chip diesIBM·Filed 2019·Granted Aug 2, 2022·0 cites·8 claims
- 1841US11393759B2Alignment carrier for interconnect bridge assemblyIBM·Filed 2019·Granted Jul 19, 2022·0 cites·11 claims
- 1938US11195576B2Robust adaptive method and circuit for controlling a timing window for enabling operation of sense amplifierST MICROELECTRONICS INT NV·Filed 2019·Granted Dec 7, 2021·0 cites·20 claims
- 2037US10626074B2Process for preparation of halo substituted benzoic acid compound and intermediates thereofSFR LTD·Filed 2018·Granted Apr 21, 2020·0 cites·6 claims
Join the waitlist — get patent alerts
Get an alert when Bhupender Singh files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →