Inventor · disambiguated record
Bill Ahearn
Also filed as: AHEARN BILL
4 granted patents·1 pending application·119 citations·filing 1997–2002
81Inventor score
Technology areasH10W
Top patents by PatentIndex Score
5 records- 0178US6016256AMulti-chip module having interconnect diesPANDA PROJECT·Filed 1997·Granted Jan 18, 2000·44 cites·31 claims
- 0276US6421254B2Multi-chip module having interconnect diesSILICON BANDWIDTH INC·Filed 2001·Granted Jul 16, 2002·19 cites·20 claims
- 0373US6031720ACooling system for semiconductor die carrierPANDA PROJECT·Filed 1997·Granted Feb 29, 2000·47 cites·17 claims
- 0463US6266246B1Multi-chip module having interconnect diesSILICON BANDWIDTH INC·Filed 2000·Granted Jul 24, 2001·9 cites·12 claims
- 0538US2002176238A1Multi-chip module having interconnect diesPANDA PROJECT INC·Filed 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →