Inventor · disambiguated record
Binod B. De
Also filed as: DE BINOD · DE BINOD B
28 granted patents·16 pending applications·123 citations·filing 2002–2025
95Inventor score
Files withFUJIFILM ELECTRONIC MAT USA INC31ARCH SPEC CHEM INC5FUJIFILM ELECTRONIC MATERIALS3DE BINOD B2ARCH SPECIALITY CHEMICALS INC1
Top patents by PatentIndex Score
44 records- 0192US10604628B2Polymer and thermosetting composition containing sameFUJIFILM ELECTRONIC MAT USA INC·Filed 2017·Granted Mar 31, 2020·2 cites·39 claims
- 0292US10563014B2Dielectric film forming compositionFUJIFILM ELECTRONIC MAT USA INC·Filed 2018·Granted Feb 18, 2020·3 cites·37 claims
- 0391US9617386B2Process for the production of polyimide and polyamic ester polymersFUJIFILM ELECTRONIC MAT USA INC·Filed 2014·Granted Apr 11, 2017·4 cites·20 claims
- 0491US2025189892A1Poly-o-hydroxyamides comprising novel indane bis-o-aminophenols, photosensitive compositions, dielectric films, and buffer coatings containing the sameFUJIFILM ELECTRONIC MAT USA INC·Filed 2024·Application pending·0 cites
- 0591US2025188311A1Poly-o-hydroxyamides comprising novel indane bis-o-aminophenols, photosensitive compositions, dielectric films, and buffer coatings containing the sameFUJIFILM ELECTRONIC MAT USA INC·Filed 2024·Application pending·0 cites
- 0691US2025188312A1Poly-o-hydroxyamides comprising novel indane bis-o-aminophenols, photosensitive compositions, dielectric films, and buffer coatings containing the sameFUJIFILM ELECTRONIC MAT USA INC·Filed 2024·Application pending·0 cites
- 0790US9695284B2Polymer and thermosetting composition containing sameFUJIFILM ELECTRONIC MAT USA INC·Filed 2014·Granted Jul 4, 2017·3 cites·22 claims
- 0887US10036952B2Photosensitive polyimide compositionsFUJIFILM ELECTRONIC MAT USA INC·Filed 2016·Granted Jul 31, 2018·4 cites·45 claims
- 0986US6610808B2Thermally cured underlayer for lithographic applicationARCH SPEC CHEM INC·Filed 2002·Granted Aug 26, 2003·28 cites·6 claims
- 1085US6916543B2Copolymer, photoresist compositions thereof and deep UV bilayer system thereofARCH SPEC CHEM INC·Filed 2003·Granted Jul 12, 2005·28 cites·68 claims
- 1183US11899364B2Photosensitive polyimide compositionsFUJIFILM ELECTRONIC MAT USA INC·Filed 2020·Granted Feb 13, 2024·1 cites·22 claims
- 1278US10781341B2Polyimide compositionsFUJIFILM ELECTRONIC MAT USA INC·Filed 2015·Granted Sep 22, 2020·2 cites·33 claims
- 1377US12338309B2Dielectric film-forming compositionFUJIFILM ELECTRONIC MAT USA INC·Filed 2024·Granted Jun 24, 2025·0 cites·18 claims
- 1477US6830870B2Acetal protected polymers and photoresists compositions thereofARCH SPECIALITY CHEMICALS INC·Filed 2003·Granted Dec 14, 2004·19 cites·42 claims
- 1576US2025188015A1Indane bis-o-aminophenols and polymers prepared therefromFUJIFILM ELECTRONIC MAT USA INC·Filed 2024·Application pending·0 cites
- 1675US2025051532A1Dielectric film-forming compositionFUJIFILM ELECTRONIC MAT USA INC·Filed 2024·Application pending·0 cites
- 1775US2025065365A1Dielectric film-forming compositionFUJIFILM ELECTRONIC MAT USA INC·Filed 2024·Application pending·0 cites
- 1874US2025285785A1Dry filmFUJIFILM ELECTRONIC MAT USA INC·Filed 2025·Application pending·0 cites
- 1973US6924339B2Thermally cured underlayer for lithographic applicationARCH SPEC CHEM INC·Filed 2003·Granted Aug 2, 2005·12 cites·18 claims
- 2071US9777117B2Process for the production of polyimide and polyamic ester polymersFUJIFILM ELECTRONIC MAT USA INC·Filed 2017·Granted Oct 3, 2017·0 cites·27 claims
- 2168US11945894B2Dielectric film-forming compositionFUJIFILM ELECTRONIC MAT USA INC·Filed 2021·Granted Apr 2, 2024·0 cites·14 claims
- 2267US2024408590A1Bioderived organic solventsFUJIFILM ELECTRONIC MAT USA INC·Filed 2024·Application pending·0 cites
- 2365US2025188223A1Polyimides comprising novel indane bis-o-aminophenols, photosensitive compositions, dielectric films, and buffer coatings containing the sameFUJIFILM ELECTRONIC MAT USA INC·Filed 2024·Application pending·0 cites
- 2464US8153346B2Thermally cured underlayer for lithographic applicationDE BINOD B·Filed 2008·Granted Apr 10, 2012·2 cites·8 claims
- 2564US6929897B2Photosensitive bilayer compositionARCH SPEC CHEM INC·Filed 2004·Granted Aug 16, 2005·7 cites·64 claims
- 2663US11939428B2PolyimidesFUJIFILM ELECTRONIC MAT USA INC·Filed 2021·Granted Mar 26, 2024·0 cites·33 claims
- 2762US7727705B2High etch resistant underlayer compositions for multilayer lithographic processesFUJIFILM ELECTRONIC MATERIALS·Filed 2008·Granted Jun 1, 2010·2 cites·18 claims
- 2861US11782344B2Photosensitive polyimide compositionsFUJIFILM ELECTRONIC MAT USA INC·Filed 2018·Granted Oct 10, 2023·0 cites·21 claims
- 2960US2024248400A1Dielectric film forming composition containing acyl germanium compoundFUJIFILM ELECTRONIC MAT USA INC·Filed 2023·Application pending·0 cites
- 3060US2025046717A1Microelectronic Devices with Good Reliability and Related Compositions and MethodsFUJIFILM ELECTRONIC MAT USA INC·Filed 2024·Application pending·0 cites
- 3160US2023053355A1Dry FilmFUJIFILM ELECTRONIC MAT USA INC·Filed 2020·Application pending·0 cites
- 3256US6803434B2Process for producing anhydride-containing polymers for radiation sensitive compositionsARCH SPEC CHEM INC·Filed 2003·Granted Oct 12, 2004·3 cites·27 claims
- 3356US2022127459A1Dielectric Film-Forming CompositionFUJIFILM ELECTRONIC MAT USA INC·Filed 2021·Application pending·0 cites
- 3450US10793676B2PolyimidesFUJIFILM ELECTRONIC MAT USA INC·Filed 2017·Granted Oct 6, 2020·0 cites·38 claims
- 3549US10696932B2Cleaning compositionFUJIFILM ELECTRONIC MAT USA INC·Filed 2016·Granted Jun 30, 2020·0 cites·40 claims
- 3649US7491783B2Process for highly purified polyhedral oligomeric silsesquioxane monomersSCHWAB JOSEPH J·Filed 2005·Granted Feb 17, 2009·0 cites·15 claims
- 3749US7416821B2Thermally cured undercoat for lithographic applicationFUJIFILM ELECTRONIC MATERIALS·Filed 2005·Granted Aug 26, 2008·3 cites·24 claims
- 3849US2020262978A1PolyimidesFUJIFILM ELECTRONIC MAT USA INC·Filed 2017·Application pending·0 cites
- 3949US2022017673A1Dielectric Film Forming CompositionsFUJIFILM ELECTRONIC MAT USA INC·Filed 2021·Application pending·0 cites
- 4048US8535872B2Thermally cured underlayer for lithographic applicationDE BINOD B·Filed 2012·Granted Sep 17, 2013·0 cites·9 claims
- 4145US11175582B2Photosensitive stacked structureFUJIFILM ELECTRONIC MAT USA INC·Filed 2016·Granted Nov 16, 2021·0 cites·24 claims
- 4245US2008199805A1Photosensitive compositions employing silicon-containing additivesFUJIFILM ELECTRONIC MATERIALS·Filed 2008·Application pending·0 cites
- 4338US11061327B2PolyimidesFUJIFILM ELECTRONIC MAT USA INC·Filed 2017·Granted Jul 13, 2021·0 cites·37 claims
- 4429US9034557B2Chemically amplified positive photoresist compositionDIMOV OGNIAN N·Filed 2010·Granted May 19, 2015·0 cites·27 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →