Inventor · disambiguated record
Bin-Siang Tsai
Also filed as: TSAI BIN-SIANG
77 granted patents·48 pending applications·55 citations·filing 2008–2025
98Inventor score
Top patents by PatentIndex Score
125 records- 0196US11818960B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2021·Granted Nov 14, 2023·2 cites·9 claims
- 0295US12089512B2Semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2023·Granted Sep 10, 2024·1 cites·8 claims
- 0395US9379182B1Method for forming nanowire and semiconductor device formed with the nanowireUNITED MICROELECTRONICS CORP·Filed 2015·Granted Jun 28, 2016·13 cites·8 claims
- 0494US10665546B1Semiconductor device and method to fabricate the semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2018·Granted May 26, 2020·13 cites·10 claims
- 0592US11793091B2Semiconductor structure and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2020·Granted Oct 17, 2023·2 cites·11 claims
- 0689US2025113494A1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 0788US2025386531A1Semiconductor device including iii-v compound semiconductor layerUNITED MICROELECTRONICS CORP·Filed 2025·Application pending·0 cites
- 0888US2025374579A1Manufacturing method of semiconductor device including iii-v compound semiconductor layerUNITED MICROELECTRONICS CORP·Filed 2025·Application pending·0 cites
- 0988US2025017022A1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 1086US12127414B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2023·Granted Oct 22, 2024·0 cites·9 claims
- 1186US12108681B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2023·Granted Oct 1, 2024·0 cites·9 claims
- 1285US12207475B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2023·Granted Jan 21, 2025·0 cites·5 claims
- 1385US12014995B2Warpage-reducing semiconductor structure and fabricating method of the sameUNITED MICROELECTRONICS CORP·Filed 2021·Granted Jun 18, 2024·1 cites·8 claims
- 1485US10916694B2Magnetoresistive random access memory (MRAM) deviceUNITED MICROELECTRONICS CORP·Filed 2019·Granted Feb 9, 2021·2 cites·5 claims
- 1585US2024423094A1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 1684US11521895B2Semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2021·Granted Dec 6, 2022·1 cites·10 claims
- 1783US12471498B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2023·Granted Nov 11, 2025·0 cites·5 claims
- 1883US11688802B2High electron mobility transistor and fabrication method thereofUNITED MICROELECTRONICS CORP·Filed 2021·Granted Jun 27, 2023·1 cites·13 claims
- 1983US2025008743A1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 2082US2025331216A1Semiconductor structure and the forming method thereofUNITED MICROELECTRONICS CORP·Filed 2025·Application pending·0 cites
- 2182US2025386526A1Mim capacitor structure and fabricating method of the sameUNITED MICROELECTRONICS CORP·Filed 2025·Application pending·0 cites
- 2281US12120962B2Method for fabricating semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2023·Granted Oct 15, 2024·0 cites·5 claims
- 2381US9530696B1Method of fabricating semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2015·Granted Dec 27, 2016·4 cites·11 claims
- 2481US2025364515A1Structure with photodiode, high electron mobility transistor, surface acoustic wave device and fabricating method of the sameUNITED MICROELECTRONICS CORP·Filed 2025·Application pending·0 cites
- 2581US2025324646A1Method for forming semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2025·Application pending·0 cites
- 2680US12300633B2Warpage-reducing semiconductor structure and fabricating method of the sameUNITED MICROELECTRONICS CORP·Filed 2024·Granted May 13, 2025·0 cites·20 claims
- 2780US12205909B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2023·Granted Jan 21, 2025·0 cites·5 claims
- 2880US12127413B2Magnetoresistive random access memory and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2023·Granted Oct 22, 2024·0 cites·9 claims
- 2980US2025112184A1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 3079US9812352B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2016·Granted Nov 7, 2017·3 cites·6 claims
- 3179US2025008842A1Method for fabricating semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 3278US11114612B2Magnetoresistive random access memory and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2019·Granted Sep 7, 2021·1 cites·20 claims
- 3378US9633955B1Semiconductor integrated circuit structure including dielectric having negative thermal expansionUNITED MICROELECTRONICS CORP·Filed 2016·Granted Apr 25, 2017·3 cites·17 claims
- 3477US12108691B2Manufacturing method of memory deviceUNITED MICROELECTRONICS CORP·Filed 2023·Granted Oct 1, 2024·0 cites·7 claims
- 3577US11778922B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2021·Granted Oct 3, 2023·0 cites·13 claims
- 3677US11101324B2Memory cell and forming method thereofUNITED MICROELECTRONICS CORP·Filed 2019·Granted Aug 24, 2021·1 cites·9 claims
- 3776US12389606B2MRAM structure and fabricating method of the sameUNITED MICROELECTRONICS CORP·Filed 2023·Granted Aug 12, 2025·0 cites·12 claims
- 3876US2025351376A1Mram structure and fabricating method of the sameUNITED MICROELECTRONICS CORP·Filed 2025·Application pending·0 cites
- 3975US12432946B2MIM capacitor structure and fabricating method of the sameUNITED MICROELECTRONICS CORP·Filed 2023·Granted Sep 30, 2025·0 cites·4 claims
- 4075US12419070B2Semiconductor device including III-V compound semiconductor layer and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2022·Granted Sep 16, 2025·0 cites·5 claims
- 4175US11737370B2Magnetoresistive random access memory (MRAM) deviceUNITED MICROELECTRONICS CORP·Filed 2021·Granted Aug 22, 2023·0 cites·5 claims
- 4275US11723215B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2020·Granted Aug 8, 2023·0 cites·7 claims
- 4375US11706993B2Method of manufacturing magnetoresistive random access memory (MRAM) deviceUNITED MICROELECTRONICS CORP·Filed 2020·Granted Jul 18, 2023·0 cites·6 claims
- 4475US11037833B2Fabrication method of semiconductor device with spacer trimming processUNITED MICROELECTRONICS CORP·Filed 2019·Granted Jun 15, 2021·2 cites·8 claims
- 4575US2025072075A1Compound semiconductor device and fabrication method thereofUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 4675US2024014069A1Metal interconnect structure and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 4774US12376323B2Semiconductor structure and the forming method thereofUNITED MICROELECTRONICS CORP·Filed 2022·Granted Jul 29, 2025·0 cites·9 claims
- 4872US10978339B2Metal interconnect structure and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2018·Granted Apr 13, 2021·1 cites·11 claims
- 4971US11810818B2Metal interconnect structure and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2021·Granted Nov 7, 2023·0 cites·10 claims
- 5071US11723287B2Method of manufacturing magnetic tunnel junction (MTJ) deviceUNITED MICROELECTRONICS CORP·Filed 2022·Granted Aug 8, 2023·0 cites·19 claims
Showing the top 50 of 125 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →