Inventor · disambiguated record
Blake A. Gillett
Also filed as: GILLETT BLAKE A · GILLETT BLAKE ANDREW
10 granted patents·1 pending application·414 citations·filing 1999–2004
92Inventor score
Top patents by PatentIndex Score
11 records- 0190US6707138B2Semiconductor device including metal strap electrically coupled between semiconductor die and metal leadframeAMKOR TECHNOLOGY INC·Filed 2002·Granted Mar 16, 2004·78 cites·26 claims
- 0289US6756658B1Making two lead surface mounting high power microleadframe semiconductor packagesAMKOR TECHNOLOGY INC·Filed 2001·Granted Jun 29, 2004·67 cites·20 claims
- 0389US6521982B1Packaging high power integrated circuit devicesAMKOR TECHNOLOGY INC·Filed 2000·Granted Feb 18, 2003·52 cites·23 claims
- 0487US6566164B1Exposed copper strap in a semiconductor packageAMKOR TECHNOLOGY INC·Filed 2000·Granted May 20, 2003·45 cites·19 claims
- 0587US6459147B1Attaching semiconductor dies to substrates with conductive strapsAMKOR TECHNOLOGY INC·Filed 2000·Granted Oct 1, 2002·60 cites·7 claims
- 0686US6723582B2Method of making a semiconductor package having exposed metal strapAMKOR TECHNOLOGY INC·Filed 2003·Granted Apr 20, 2004·40 cites·10 claims
- 0779US6844615B1Leadframe package for semiconductor devicesAMKOR TECHNOLOGY INC·Filed 2004·Granted Jan 18, 2005·26 cites·22 claims
- 0871US6794740B1Leadframe package for semiconductor devicesAMKOR TECHNOLOGY INC·Filed 2003·Granted Sep 21, 2004·17 cites·21 claims
- 0964US7001799B1Method of making a leadframe for semiconductor devicesAMKOR TECHNOLOGY INC·Filed 2004·Granted Feb 21, 2006·13 cites·22 claims
- 1049US6236088B1Semiconductor device gate structure for thermal overload protectionINTERSIL CORP·Filed 1999·Granted May 22, 2001·16 cites·5 claims
- 1134US2002125562A1Attaching semiconductor dies to substrates with conductive strapsFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →