Inventor · disambiguated record
Boon Yong Ang
Also filed as: ANG BOON Y · ANG BOON-YONG
33 granted patents·1 pending application·431 citations·filing 2000–2020
97Inventor score
Top patents by PatentIndex Score
34 records- 0196US10262911B1Circuit for and method of testing bond connections between a first die and a second dieXILINX INC·Filed 2016·Granted Apr 16, 2019·51 cites·20 claims
- 0295US7710813B1Electronic fuse arrayXILINX INC·Filed 2008·Granted May 4, 2010·73 cites·17 claims
- 0394US11488887B1Thermal enablement of dies with impurity getteringXILINX INC·Filed 2020·Granted Nov 1, 2022·5 cites·9 claims
- 0494US7724600B1Electronic fuse programming current generator with on-chip referenceXILINX INC·Filed 2008·Granted May 25, 2010·37 cites·20 claims
- 0592US7312625B1Test circuit and method of use thereof for the manufacture of integrated circuitsXILINX INC·Filed 2006·Granted Dec 25, 2007·22 cites·20 claims
- 0692US7294888B1CMOS-compatible non-volatile memory cell with lateral inter-poly programming layerXILINX INC·Filed 2005·Granted Nov 13, 2007·21 cites·14 claims
- 0791US11073550B1Test vehicle for package testingXILINX INC·Filed 2019·Granted Jul 27, 2021·5 cites·19 claims
- 0891US7923811B1Electronic fuse cell with enhanced thermal gradientXILINX INC·Filed 2008·Granted Apr 12, 2011·23 cites·20 claims
- 0989US11379580B1Mixed storage of data fieldsXILINX INC·Filed 2020·Granted Jul 5, 2022·3 cites·20 claims
- 1089US7834659B1Multi-step programming of E fuse cellsXILINX INC·Filed 2008·Granted Nov 16, 2010·21 cites·19 claims
- 1186US6830941B1Method and apparatus for identifying individual die during failure analysisADVANCED MICRO DEVICES INC·Filed 2002·Granted Dec 14, 2004·44 cites·3 claims
- 1284US7598749B1Integrated circuit with fuse programming damage detectionXILINX INC·Filed 2006·Granted Oct 6, 2009·12 cites·20 claims
- 1378US8564023B2Integrated circuit with MOSFET fuse elementIM HSUNG JAI·Filed 2008·Granted Oct 22, 2013·11 cites·14 claims
- 1478US7567449B2One-time-programmable logic bit with multiple logic elementsXILINX INC·Filed 2006·Granted Jul 28, 2009·8 cites·16 claims
- 1575US6627484B1Method of forming a buried interconnect on a semiconductor on insulator wafer and a device including a buried interconnectADVANCED MICRO DEVICES INC·Filed 2002·Granted Sep 30, 2003·22 cites·8 claims
- 1673US6974989B1Structure and method for protecting memory cells from UV radiation damage and UV radiation-induced charging during backend processingSPANSION LLC·Filed 2004·Granted Dec 13, 2005·13 cites·20 claims
- 1770US8810269B2Method of testing a semiconductor structureXILINX INC·Filed 2012·Granted Aug 19, 2014·3 cites·19 claims
- 1863US6866416B1Detecting heat generating failures in unpassivated semiconductor devicesADVANCED MICRO DEVICES INC·Filed 2003·Granted Mar 15, 2005·6 cites·10 claims
- 1962US8143695B1Contact fuse one time programmable memoryANG BOON Y·Filed 2009·Granted Mar 27, 2012·5 cites·17 claims
- 2060US6824446B1Method and apparatus for polishing an outer edge ring on a semiconductor waferADVANCED MICRO DEVICES INC·Filed 2001·Granted Nov 30, 2004·7 cites·13 claims
- 2159US6589860B1System and method for calibrating electron beam defect inspection toolADVANCED MICRO DEVICES INC·Filed 2001·Granted Jul 8, 2003·10 cites·11 claims
- 2259US6328641B1Method and apparatus for polishing an outer edge ring on a semiconductor waferADVANCED MICRO DEVICES INC·Filed 2000·Granted Dec 11, 2001·7 cites·9 claims
- 2358US6995564B1Method and system for locating chip-level defects through emission imaging of a semiconductor deviceADVANCED MICRO DEVICES INC·Filed 2003·Granted Feb 7, 2006·10 cites·7 claims
- 2457US8102019B1Electrically programmable diffusion fuseTUMAKHA SERHII·Filed 2009·Granted Jan 24, 2012·3 cites·20 claims
- 2555US7242102B2Bond pad structure for copper metallization having increased reliability and method for fabricating sameSPANSION LLC·Filed 2004·Granted Jul 10, 2007·6 cites·7 claims
- 2652US7688639B1CMOS-compatible non-volatile memory cell with lateral inter-poly programming layerXILINX INC·Filed 2007·Granted Mar 30, 2010·0 cites·9 claims
- 2748US7839693B1Method of fabricating CMOS-compatible non-volatile memory cell with lateral inter-poly programming layerXILINX INC·Filed 2010·Granted Nov 23, 2010·0 cites·17 claims
- 2848US7122465B1Method for achieving increased control over interconnect line thickness across a wafer and between wafersSPANSION LLC·Filed 2004·Granted Oct 17, 2006·1 cites·20 claims
- 2946US7381620B1Oxygen elimination for device processingSPANSION LLC·Filed 2006·Granted Jun 3, 2008·0 cites·20 claims
- 3045US10620644B1Systems and methods for on-die heat generation and temperature sensingXILINX INC·Filed 2018·Granted Apr 14, 2020·0 cites·20 claims
- 3144US6770495B1Method for revealing active regions in a SOI structure for DUT backside inspectionADVANCED MICRO DEVICES INC·Filed 2003·Granted Aug 3, 2004·2 cites·11 claims
- 3243US10302504B1On-die temperature sensing and digitization systemXILINX INC·Filed 2017·Granted May 28, 2019·0 cites·20 claims
- 3336US7923785B2Field effect transistor having increased carrier mobilityGLOBALFOUNDRIES INC·Filed 2003·Granted Apr 12, 2011·0 cites·3 claims
- 3436US2005101147A1Method for integrating a high-k gate dielectric in a transistor fabrication processADVANCED MICRO DEVICES INC·Filed 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →