Inventor · disambiguated record
Boris Binder
Also filed as: BINDER BORIS
18 granted patents·1 pending application·57 citations·filing 2008–2020
92Inventor score
Files withINFINEON TECHNOLOGIES AG6INFINEON TECHNOLOGIES DRESDEN GMBH6KAUTZSCH THORALF5BINDER BORIS1INFINEON TECH DRESDEN GMBH & CO KG1
Top patents by PatentIndex Score
19 records- 0195US9382111B2Micromechanical system and method for manufacturing a micromechanical systemINFINEON TECHNOLOGIES DRESDEN GMBH·Filed 2015·Granted Jul 5, 2016·13 cites·15 claims
- 0290US8481400B2Semiconductor manufacturing and semiconductor device with semiconductor structureKAUTZSCH THORALF·Filed 2010·Granted Jul 9, 2013·9 cites·9 claims
- 0378US8994127B2Method of fabricating isolating semiconductor structures using a layout of trenches and openingsKAUTZSCH THORALF·Filed 2011·Granted Mar 31, 2015·3 cites·7 claims
- 0478US7832279B2Semiconductor device including a pressure sensorINFINEON TECHNOLOGIES AG·Filed 2008·Granted Nov 16, 2010·12 cites·25 claims
- 0576US8921974B2Semiconductor manufacturing and semiconductor device with semiconductor structureINFINEON TECHNOLOGIES AG·Filed 2013·Granted Dec 30, 2014·2 cites·15 claims
- 0672US9376314B2Method for manufacturing a micromechanical systemINFINEON TECHNOLOGIES DRESDEN GMBH·Filed 2014·Granted Jun 28, 2016·2 cites·21 claims
- 0772US8518732B2Method of providing a semiconductor structure with forming a sacrificial structureKAUTZSCH THORALF·Filed 2010·Granted Aug 27, 2013·3 cites·14 claims
- 0871US9546923B2Sensor structures, systems and methods with improved integration and optimized footprintINFINEON TECHNOLOGIES DRESDEN GMBH·Filed 2014·Granted Jan 17, 2017·3 cites·19 claims
- 0970US9236241B2Wafer, a method for processing a wafer, and a method for processing a carrierINFINEON TECHNOLOGIES DRESDEN GMBH·Filed 2014·Granted Jan 12, 2016·2 cites·20 claims
- 1068US8921954B2Method of providing a semiconductor structure with forming a sacrificial structureINFINEON TECHNOLOGIES AG·Filed 2013·Granted Dec 30, 2014·2 cites·9 claims
- 1168US8266962B2Acceleration sensorKAUTZSCH THORALF·Filed 2009·Granted Sep 18, 2012·4 cites·28 claims
- 1259US10060816B2Sensor structures, systems and methods with improved integration and optimized footprintINFINEON TECHNOLOGIES DRESDEN GMBH·Filed 2016·Granted Aug 28, 2018·0 cites·19 claims
- 1356US9527725B2Semiconductor structure with lamella defined by singulation trenchINFINEON TECHNOLOGIES AG·Filed 2014·Granted Dec 27, 2016·1 cites·13 claims
- 1453US8627720B2Acceleration sensorKAUTZSCH THORALF·Filed 2012·Granted Jan 14, 2014·0 cites·25 claims
- 1550US11393714B2Producing a buried cavity in a semiconductor substrateINFINEON TECHNOLOGIES AG·Filed 2020·Granted Jul 19, 2022·0 cites·14 claims
- 1650US9752943B2Sensor structures, systems and methods with improved integration and optimized footprintINFINEON TECHNOLOGIES DRESDEN GMBH·Filed 2014·Granted Sep 5, 2017·0 cites·19 claims
- 1748US8723276B2Semiconductor structure with lamella defined by singulation trenchBINDER BORIS·Filed 2010·Granted May 13, 2014·1 cites·14 claims
- 1846US11869919B2Method for manufacturing a sensor device with a buried deep trench structure and sensor deviceINFINEON TECH DRESDEN GMBH & CO KG·Filed 2020·Granted Jan 9, 2024·0 cites·16 claims
- 1946US2015203350A1Method of fabricating isolating semiconductor structuresINFINEON TECHNOLOGIES AG·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →