Inventor · disambiguated record
Bok Kyu Choi
Also filed as: CHOI BOK KYU
30 granted patents·2 pending applications·64 citations·filing 2008–2025
94Inventor score
Top patents by PatentIndex Score
32 records- 0196US11264319B1Storage system including a decoupling device having a plurality of unit capacitorsSK HYNIX INC·Filed 2021·Granted Mar 1, 2022·3 cites·20 claims
- 0295US11764144B2Storage system including a decoupling device having a plurality of unit capacitorsSK HYNIX INC·Filed 2022·Granted Sep 19, 2023·2 cites·19 claims
- 0395US11637089B2Semiconductor package including stacked semiconductor chipsSK HYNIX INC·Filed 2021·Granted Apr 25, 2023·3 cites·24 claims
- 0493US11217564B2Stack packages with interposer bridgeSK HYNIX INC·Filed 2020·Granted Jan 4, 2022·3 cites·20 claims
- 0593US11201140B2Semiconductor packages including stacked sub-packages with interposing bridgesSK HYNIX INC·Filed 2020·Granted Dec 14, 2021·3 cites·21 claims
- 0689US11205638B2Stack packages including an interconnection structureSK HYNIX INC·Filed 2019·Granted Dec 21, 2021·6 cites·23 claims
- 0788US7768114B2Semiconductor package, stacked semiconductor package having the same, and a method for selecting one semiconductor chip in a stacked semiconductor packageHYNIX SEMICONDUCTOR INC·Filed 2008·Granted Aug 3, 2010·15 cites·25 claims
- 0887US11127687B2Semiconductor packages including modules stacked with interposing bridgesSK HYNIX INC·Filed 2020·Granted Sep 21, 2021·2 cites·20 claims
- 0987US7808072B2Circuit board having conductive shield member and semiconductor package using the sameHYNIX SEMICONDUCTOR INC·Filed 2008·Granted Oct 5, 2010·16 cites·7 claims
- 1083US11222872B2Semiconductor package including stacked semiconductor chipsSK HYNIX INC·Filed 2020·Granted Jan 11, 2022·2 cites·20 claims
- 1180US12482740B2Storage system including a decoupling device having a plurality of unit capacitorsSK HYNIX INC·Filed 2023·Granted Nov 25, 2025·0 cites·15 claims
- 1279US12243853B2Stack package including core die stacked over a controller dieSK HYNIX INC·Filed 2023·Granted Mar 4, 2025·0 cites·10 claims
- 1379US9705154B2Method for prelithiation, method for fabricating lithium secondary battery comprising the method, and lithium secondary battery fabricated from the fabricating methodLG CHEMICAL LTD·Filed 2014·Granted Jul 11, 2017·2 cites·19 claims
- 1476US10991640B2Semiconductor packages including bridge dieSK HYNIX INC·Filed 2019·Granted Apr 27, 2021·2 cites·11 claims
- 1573US2025174602A1Stack package including core die stacked over a controller dieSK HYNIX INC·Filed 2025·Application pending·0 cites
- 1671US8084839B2Circuit board having conductive shield member and semiconductor package using the sameCHOI BOK KYU·Filed 2010·Granted Dec 27, 2011·3 cites·6 claims
- 1768US11798917B2Stack package including core die stacked over a controller dieSK HYNIX INC·Filed 2020·Granted Oct 24, 2023·0 cites·9 claims
- 1865US8168450B2Semiconductor package, stacked semiconductor package having the same, and a method for selecting one semiconductor chip in a stacked semiconductor packageCHOI BOK KYU·Filed 2010·Granted May 1, 2012·2 cites·6 claims
- 1958US11901345B2Semiconductor packageSK HYNIX INC·Filed 2021·Granted Feb 13, 2024·0 cites·21 claims
- 2058US10270102B2Electrode for electrochemical device with low resistance, method for manufacturing the same, and electrochemical device comprising the electrodeLG CHEMICAL LTD·Filed 2014·Granted Apr 23, 2019·0 cites·5 claims
- 2152US11600600B2Semiconductor package including stacked semiconductor chipsSK HYNIX INC·Filed 2021·Granted Mar 7, 2023·0 cites·20 claims
- 2252US11127722B2Stack packages including vertically stacked sub-packages with interposer bridgesSK HYNIX INC·Filed 2020·Granted Sep 21, 2021·0 cites·20 claims
- 2352US11114362B2Stacked semiconductor package having heat dissipation structureSK HYNIX INC·Filed 2019·Granted Sep 7, 2021·0 cites·20 claims
- 2449US10957627B2Semiconductor packages including a bridge dieSK HYNIX INC·Filed 2019·Granted Mar 23, 2021·0 cites·18 claims
- 2548US11515254B2Semiconductor chip including penetrating electrodes, and semiconductor package including the semiconductor chipSK HYNIX INC·Filed 2020·Granted Nov 29, 2022·0 cites·17 claims
- 2644US9231286B2Package substrate with band stop filter and semiconductor package including the sameSK HYNIX INC·Filed 2013·Granted Jan 5, 2016·0 cites·20 claims
- 2742US11430763B2Semiconductor packages including stack modules comprised of interposing bridges and semiconductor diesSK HYNIX INC·Filed 2020·Granted Aug 30, 2022·0 cites·20 claims
- 2841US11018094B2Semiconductor packages configured for measuring contact resistances and methods of obtaining contact resistances of the semiconductor packagesSK HYNIX INC·Filed 2019·Granted May 25, 2021·0 cites·7 claims
- 2941US10665570B2Stack packages including through mold viasSK HYNIX INC·Filed 2018·Granted May 26, 2020·0 cites·19 claims
- 3040US10923434B2Semiconductor packages having EMI shielding layersSK HYNIX INC·Filed 2018·Granted Feb 16, 2021·0 cites·15 claims
- 3138US11342315B2Stack packages including through mold via structuresSK HYNIX INC·Filed 2018·Granted May 24, 2022·0 cites·12 claims
- 3235US2019080999A1Package substrates with signal transmission paths relating to parasitic capacitance valuesSK HYNIX INC·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →