Inventor · disambiguated record

Boyd Finlay

Also filed as: FINLAY BOYD

1 granted patent·0 citations·filing 2016–2016

3Inventor score

Technology areasH10P

Files withGLOBALFOUNDRIES INC1

Top patents by PatentIndex Score

1 record

0129US10186439B2Systems and methods for sensing process parameters during semiconductor device fabricationGLOBALFOUNDRIES INC·Filed 2016·Granted Jan 22, 2019·0 cites·7 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →