Inventor · disambiguated record
Bo Huang
Also filed as: HUANG BO · Huang bo-lin
8 granted patents·12 citations·filing 2019–2022
76Inventor score
Top patents by PatentIndex Score
8 records- 0195US11563021B2Memory device and method for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Jan 24, 2023·10 cites·20 claims
- 0294US12052870B2Staircase structure with multiple divisions for three-dimensional memoryYANGTZE MEMORY TECH CO LTD·Filed 2021·Granted Jul 30, 2024·2 cites·19 claims
- 0358US11990547B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2020·Granted May 21, 2024·0 cites·5 claims
- 0457US11462558B2Staircase structure with multiple divisions for three-dimensional memoryYANGTZE MEMORY TECH CO LTD·Filed 2019·Granted Oct 4, 2022·0 cites·12 claims
- 0553US12052866B2Two-step L-shaped selective epitaxial growthYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Jul 30, 2024·0 cites·12 claims
- 0652US11775107B1Touch sensor and manufacturing method thereofTPK ADVANCED SOLUTIONS INC·Filed 2022·Granted Oct 3, 2023·0 cites·14 claims
- 0751US11751385B2Three-dimensional memory devices and fabricating methods thereofYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Sep 5, 2023·0 cites·20 claims
- 0848US11829539B1Touch sensor and manufacturing method thereofTPK ADVANCED SOLUTIONS INC·Filed 2022·Granted Nov 28, 2023·0 cites·18 claims
Join the waitlist — get patent alerts
Get an alert when Bo Huang files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →