Inventor · disambiguated record
Bok Hoen Kim
Also filed as: KIM BOK H · KIM BOK HOEN
77 granted patents·37 pending applications·1,926 citations·filing 1999–2023
99Inventor score
Files withAPPLIED MATERIALS INC84LEE KWANGDUK DOUGLAS4PADHI DEENESH4RAJAGOPALAN NAGARAJAN4HAN XINHAI2
Top patents by PatentIndex Score
114 records- 0197US9157730B2PECVD processAPPLIED MATERIALS INC·Filed 2013·Granted Oct 13, 2015·49 cites·18 claims
- 0297US7572337B2Blocker plate bypass to distribute gases in a chemical vapor deposition systemAPPLIED MATERIALS INC·Filed 2005·Granted Aug 11, 2009·43 cites·15 claims
- 0396US9721784B2Ultra-conformal carbon film depositionAPPLIED MATERIALS INC·Filed 2014·Granted Aug 1, 2017·29 cites·16 claims
- 0496US9458537B2PECVD processAPPLIED MATERIALS INC·Filed 2015·Granted Oct 4, 2016·12 cites·20 claims
- 0596US8076250B1PECVD oxide-nitride and oxide-silicon stacks for 3D memory applicationRAJAGOPALAN NAGARAJAN·Filed 2010·Granted Dec 13, 2011·488 cites·20 claims
- 0695US9816187B2PECVD processAPPLIED MATERIALS INC·Filed 2016·Granted Nov 14, 2017·8 cites·20 claims
- 0795US8536065B2Ultra high selectivity doped amorphous carbon strippable hardmask development and integrationSEAMONS MARTIN JAY·Filed 2011·Granted Sep 17, 2013·51 cites·17 claims
- 0895US6413321B1Method and apparatus for reducing particle contamination on wafer backside during CVD processAPPLIED MATERIALS INC·Filed 2000·Granted Jul 2, 2002·679 cites·6 claims
- 0994US11728168B2Ultra-high modulus and etch selectivity boron-carbon hardmask filmsAPPLIED MATERIALS INC·Filed 2021·Granted Aug 15, 2023·2 cites·18 claims
- 1094US10403535B2Method and apparatus of processing wafers with compressive or tensile stress at elevated temperatures in a plasma enhanced chemical vapor deposition systemAPPLIED MATERIALS INC·Filed 2015·Granted Sep 3, 2019·11 cites·17 claims
- 1194US8993454B2Ultra high selectivity doped amorphous carbon strippable hardmask development and integrationAPPLIED MATERIALS INC·Filed 2013·Granted Mar 31, 2015·16 cites·5 claims
- 1293US11613812B2PECVD processAPPLIED MATERIALS INC·Filed 2020·Granted Mar 28, 2023·2 cites·20 claims
- 1393US7407893B2Liquid precursors for the CVD deposition of amorphous carbon filmsAPPLIED MATERIALS INC·Filed 2005·Granted Aug 5, 2008·33 cites·20 claims
- 1493US6355571B1Method and apparatus for reducing copper oxidation and contamination in a semiconductor deviceAPPLIED MATERIALS INC·Filed 1999·Granted Mar 12, 2002·98 cites·14 claims
- 1592US10418243B2Ultra-high modulus and etch selectivity boron-carbon hardmask filmsAPPLIED MATERIALS INC·Filed 2016·Granted Sep 17, 2019·6 cites·20 claims
- 1691US10276353B2Dual-channel showerhead for formation of film stacksAPPLIED MATERIALS INC·Filed 2016·Granted Apr 30, 2019·4 cites·20 claims
- 1791US8444926B2Processing chamber with heated chamber linerFODOR MARK A·Filed 2007·Granted May 21, 2013·25 cites·16 claims
- 1890US10793954B2PECVD processAPPLIED MATERIALS INC·Filed 2018·Granted Oct 6, 2020·3 cites·13 claims
- 1990US10060032B2PECVD processAPPLIED MATERIALS INC·Filed 2017·Granted Aug 28, 2018·3 cites·20 claims
- 2090US7189658B2Strengthening the interface between dielectric layers and barrier layers with an oxide layer of varying composition profileAPPLIED MATERIALS INC·Filed 2005·Granted Mar 13, 2007·11 cites·20 claims
- 2189US10100408B2Edge hump reduction faceplate by plasma modulationAPPLIED MATERIALS INC·Filed 2015·Granted Oct 16, 2018·6 cites·18 claims
- 2289US10074534B2Ultra-conformal carbon film depositionAPPLIED MATERIALS INC·Filed 2017·Granted Sep 11, 2018·5 cites·9 claims
- 2389US7867578B2Method for depositing an amorphous carbon film with improved density and step coverageAPPLIED MATERIALS INC·Filed 2006·Granted Jan 11, 2011·12 cites·14 claims
- 2489US7091137B2Bi-layer approach for a hermetic low dielectric constant layer for barrier applicationsAPPLIED MATERIALS INC·Filed 2004·Granted Aug 15, 2006·43 cites·52 claims
- 2588US9711360B2Methods to improve in-film particle performance of amorphous boron-carbon hardmask process in PECVD systemAPPLIED MATERIALS INC·Filed 2016·Granted Jul 18, 2017·5 cites·20 claims
- 2688US8227352B2Amorphous carbon deposition method for improved stack defectivityYU HANG·Filed 2011·Granted Jul 24, 2012·13 cites·20 claims
- 2788US6946401B2Plasma treatment for copper oxide reductionAPPLIED MATERIALS INC·Filed 2003·Granted Sep 20, 2005·28 cites·13 claims
- 2887US8283237B2Fabrication of through-silicon vias on silicon wafersRAJAGOPALAN NAGARAJAN·Filed 2010·Granted Oct 9, 2012·11 cites·34 claims
- 2987US7259111B2Interface engineering to improve adhesion between low k stacksAPPLIED MATERIALS INC·Filed 2005·Granted Aug 21, 2007·14 cites·17 claims
- 3086US10246772B2Plasma enhanced chemical vapor deposition of films for improved vertical etch performance in 3D NAND memory devicesAPPLIED MATERIALS INC·Filed 2016·Granted Apr 2, 2019·5 cites·20 claims
- 3186US9390910B2Gas flow profile modulated control of overlay in plasma CVD filmsAPPLIED MATERIALS INC·Filed 2014·Granted Jul 12, 2016·5 cites·20 claims
- 3286US9299581B2Methods of dry stripping boron-carbon filmsLEE KWANGDUK DOUGLAS·Filed 2012·Granted Mar 29, 2016·8 cites·8 claims
- 3386US7670924B2Air gap integration schemeAPPLIED MATERIALS INC·Filed 2008·Granted Mar 2, 2010·22 cites·18 claims
- 3486US6927178B2Nitrogen-free dielectric anti-reflective coating and hardmaskAPPLIED MATERIALS INC·Filed 2003·Granted Aug 9, 2005·32 cites·20 claims
- 3585US11898249B2PECVD processAPPLIED MATERIALS INC·Filed 2023·Granted Feb 13, 2024·0 cites·17 claims
- 3685US8563095B2Silicon nitride passivation layer for covering high aspect ratio featuresRAJAGOPALAN NAGARAJAN·Filed 2010·Granted Oct 22, 2013·11 cites·35 claims
- 3785US8389376B2Air gap integration schemeDEMOS ALEXANDROS T·Filed 2010·Granted Mar 5, 2013·4 cites·20 claims
- 3883US12211694B2Ultra-high modulus and etch selectivity boron-carbon hardmask filmsAPPLIED MATERIALS INC·Filed 2023·Granted Jan 28, 2025·0 cites·19 claims
- 3982US10373822B2Gas flow profile modulated control of overlay in plasma CVD filmsAPPLIED MATERIALS INC·Filed 2017·Granted Aug 6, 2019·2 cites·18 claims
- 4081US8679987B2Deposition of an amorphous carbon layer with high film density and high etch selectivityREILLY PATRICK·Filed 2012·Granted Mar 25, 2014·7 cites·20 claims
- 4180US8329575B2Fabrication of through-silicon vias on silicon wafersRAJAGOPALAN NAGARAJAN·Filed 2010·Granted Dec 11, 2012·6 cites·24 claims
- 4280US7288205B2Hermetic low dielectric constant layer for barrier applicationsAPPLIED MATERIALS INC·Filed 2004·Granted Oct 30, 2007·19 cites·25 claims
- 4379US10580623B2Plasma processing using multiple radio frequency power feeds for improved uniformityAPPLIED MATERIALS INC·Filed 2014·Granted Mar 3, 2020·3 cites·11 claims
- 4479US9490116B2Gate stack materials for semiconductor applications for lithographic overlay improvementAPPLIED MATERIALS INC·Filed 2015·Granted Nov 8, 2016·3 cites·20 claims
- 4579US7273823B2Situ oxide cap layer developmentAPPLIED MATERIALS INC·Filed 2005·Granted Sep 25, 2007·3 cites·20 claims
- 4678US6843881B2Detecting chemiluminescent radiation in the cleaning of a substrate processing chamberAPPLIED MATERIALS INC·Filed 2002·Granted Jan 18, 2005·17 cites·15 claims
- 4776US9337051B2Method for critical dimension reduction using conformal carbon filmsAPPLIED MATERIALS INC·Filed 2015·Granted May 10, 2016·2 cites·19 claims
- 4876US8252699B2Composite removable hardmaskKONECNI ANTHONY·Filed 2010·Granted Aug 28, 2012·6 cites·19 claims
- 4973US10030306B2PECVD apparatus and processAPPLIED MATERIALS INC·Filed 2013·Granted Jul 24, 2018·1 cites·16 claims
- 5072US11365476B2Plasma enhanced chemical vapor deposition of films for improved vertical etch performance in 3D NAND memory devicesAPPLIED MATERIALS INC·Filed 2019·Granted Jun 21, 2022·1 cites·20 claims
Showing the top 50 of 114 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →